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Thursday 14 September 2017
SEMICON Taiwan 2017: Brewer Science showcasing innovative materials for EUV and 3D IC manufacturing
With the semiconductor-manufacturing industry needing the high computing power that can only be achieved through advanced node logic and memory, as well as the heterogeneous-integration...
Tuesday 12 September 2017
Xilinx, ARM, Cadence and TSMC collaborating on CCIX test chip
Xilinx, ARM, Cadence Design Systems and TSMC have announced a collaboration to build the first CCIX (cache coherent interconnect for accelerators) test chip in TSMC 7nm FinFET process...
Tuesday 8 August 2017
Intel Labs China developing AI algorithms, smart robotics, communication/storage infrastructure
Intel Labs China has focused on AI algorithms, smart robotics and communication and smart storage infrastructure, according to managing director Song Jiqiang for the research insti...
Wednesday 2 August 2017
Qualcomm, Win Semi reportedly to team up for 5G mobile infrastructure
Qualcomm has recently approached GaAs IC foundry Win Semiconductors to cooperate in an infrastructure project for 5G mobile networks, according to market sources.
Friday 21 July 2017
Chip demand for data centers to boom in China
With China's local governments looking to set up data centers, chip demand for data centers locally is set to surge, according to industry sources.
Wednesday 19 July 2017
Worldwide public cloud services spending forecast to reach US$266 billion in 2021, says IDC
Worldwide spending on public cloud services and infrastructure is forecast to reach US$266 billion in 2021, according to the latest update to the IDC Worldwide Semiannual Public Cloud...
Monday 17 July 2017
Worldwide IT spending to grow 2.4% in 2017, says Gartner
Worldwide IT spending is projected to total US$3.5 trillion in 2017, a 2.4% increase from 2016, according to Gartner. This growth rate is up from the previous quarter's forecast of...
Monday 17 July 2017
Globalfoundries and VeriSilicon to enable single-chip solution for next-gen IoT networks
Globalfoundries and VeriSilicon have announced a collaboration to deliver a single-chip IoT solution for next-generation Low Power Wide Area (LPWA) networks. Leveraging GF's 22FDX...
Wednesday 12 July 2017
Worldwide spending on robotics forecast to accelerate over the next 5 years, says IDC
A new update to the IDC Worldwide Semiannual Commercial Robotics Spending Guide forecasts worldwide purchases of robotics, including drones and robotics-related hardware, software...
Wednesday 12 July 2017
Intel unveils new Intel Xeon scalable processors
Intel has launched its new Intel Xeon scalable processors, providing businesses with performance to handle compute-hungry tasks including real-time analytics, virtualized infrastructure...
Monday 10 July 2017
Taiwan to upgrade digital infrastructure
The Taiwan government, under its four-year (2017-2021) Infrastructure Development Program, has announced a plan to upgrade the country's digital infrastructure with a total budget...
Thursday 6 July 2017
Baidu deploys Xilinx FPGAs in new public cloud acceleration services
Baidu has deployed Xilinx FPGA-based application acceleration services in their public cloud, according to Xilinx. The Baidu FPGA Cloud Server, a new service in Baidu Cloud, features...
Tuesday 4 July 2017
Samsung begins mass production at new fab
Samsung Electronics announced its new semiconductor fabrication line in Pyeongtaek (South Korea) has begun mass production and shipping its first product to customers. The new facility...
Tuesday 4 July 2017
Taiwan proposes 8-year infrastructure development program
The Taiwan government has proposed a tentative 8-year (2017-2024) Forward-looking Infrastructure Development Program to create economic growth potential and accelerate industrial...
Monday 3 July 2017
India server market revenues up 14.2% in 1Q17, says IDC
The overall server market in India saw an on-quarter increase of 14.2% in terms of revenues to reach US$215.6 million in the first quarter of 2017 as against US$188.8 million in the...