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60 news items tagged 22nm

  • Intel drops Sandy Bridge CPU prices

    Thursday 22 December 2011
    Intel has recently notified its partners of plans to reduce prices of the existing Sandy Bridge-based processors with some Core i3 and i5 series processors to see a drop of 10-15%,...
  • Windows on ARM (WoA), a combination of Windows 8 and ARM-based processors, is expected to make an official appearance at the end of 2012 and will try to compete in the notebook market...
  • Intel is expected to unveil its 22nm Ivy Bridge CPUs in March 2012 at the earliest, with initial offerings focusing on dual- and quad-core models, according to sources at motherboard...
  • Asustek+Zenbook+series+ultrabook
    Asustek Computer has unveiled its Zenbook series ultrabooks saying it is confident it has the closest performance/price ratio compared to Apple's MacBook Air.
  • Intel CPUs will enter 14nm processing by 2014, according to Steven Smith, vice president and head of netbook, tablet PC business speaking at Intel Developer Forum (IDF) in San Fran...
  • Intel, facing weak PC performance, reportedly is considering to temporarily halt its plans to upgrade to a 22nm process at Fab 24, and has decided to delay the launch of its next-generation...
  • Intel plans to launch three new 7 series chipsets – Z77, Z75 and H77, supporting its upcoming 22nm Ivy Bridge-based CPUs and the existing 32nm Sandy Bridge-based CPUs, in March...
  • Intel has announced a breakthrough in the evolution of the transistor. For the first time since the invention of silicon transistors over 50 years ago, transistors using a three-dimensional...
  • Motherboard prices, affected by upstream component shortages caused by the Japan earthquake, are set to rise for the second time this year after mid-April, according to sources from...
  • Intel reportedly has completed the design of its 22nm Ivy Bridge processors and will showcase the new CPUs at Computex Taipei 2011 in June, according to a Chinese-language Commercial...
  • By the end of 2011, there may be only three remaining sources for high-volume and leading-edge semiconductor foundry manufacturing: Taiwan Semiconductor Manufacturing Company (TSMC),...
  • FPGA startup Achronix Semiconductor's recent announcement that Intel will make 22nm chips for it has sparked speculation that the chip giant is looking to share the higher end segment...
  • Globalfoundries has announced the addition of a new technology offering based on its 28nm high-k metal gate (HKMG) technology, and revealed for the first time its manufacturing timeline...
  • Taiwan Semiconductor Manufacturing Company (TSMC) has announced that it will skip the 22nm manufacturing process node and move directly to a 20nm technology, and TSMC is expected...
  • Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to enter trial production on its 22nm high performance process node in the third quarter of 2012, and then move to the...
  • Antonio+Mesquida+K%26uuml%3Bsters%2C+Director+of+Market+Intelligence+for+ASML
    Customers have turned more active in placing orders, according to Antonio Mesquida Kusters, Director of Market Intelligence for ASML. Citing predictions by research firms, Kusters...
  • Cross%2Dsection+view+of+IMEC+integrated+micro%2Dmirror+array
    IMEC, a Belgium-based research center in nanoelectronics and nanotechnology, and Taiwan Semiconductor Manufacturing Company (TSMC) on October 6 jointly announced the extension of...
  • Taiwan Semiconductor Manufacturing Company (TSMC) will maintain its plans to begin trial production on 18-inch wafers in 2012 despite a conservative outlook prevailing across most...
  • UMC focusing R&D on 28nm, 22nm processes

    Wednesday 30 September 2009
    United Microelectronics Corporation (UMC) currently focuses its R&D on 28nm and 22nm processes and related key technologies as well as 18-inch wafers, according to company central...
  • Intel president and CEO Paul Otellini has displayed a silicon wafer containing its first working chips built on 22nm process technology. The 22nm test circuits include both SRAM memory...
  • KLA-Tencor has introduced the Teron 600-series reticle defect inspection system to address a major transition in mask design at the 2Xnm logic (3Xnm half-pitch memory) node. The new...
  • KLA+Tencor+CMO+Brian+Trafas
    R&D expenses are estimated to equal 25% of KLA-Tencor's overall sales in 2009, with the expenditure mainly on the development of next-generation products for 3X/2Xnm and beyond...
  • The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....
  • Taiwan Semiconductor Manufacturing Company (TSMC) has announced it will join a three-year program led by the CEA-Leti research institute on electron-beam (e-beam) maskless lithography...
  • TSMC to base European R&D at IMEC

    Thursday 4 June 2009
    IMEC, an Belgium-based nanoelectronics research center in nanoelectronics and nanotechnology, has signed an expanded research agreement with Taiwan Semiconductor Manufacturing Company...
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