347 news items tagged 28nm
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
Monday 18 September 2017China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
ASML EUV equipment production to almost double in 2018
Wednesday 13 September 2017ASML has disclosed annual production of its extreme ultraviolet (EUV) lithography systems will increase to 20 units in 2018 from the current 12.
China could enhance its position in post-Moore's Law era, says former TSMC COO
Wednesday 23 August 2017China's semiconductor industry could have a chance of strengthening its position in the post-Moore's Law era, according to Shang-yi Chiang, former executive VP and co-chief operating...
Qualcomm to extend tie-up with TSMC, says executive
Monday 21 August 2017Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...
SPIL to invest US$25 million in China
Tuesday 15 August 2017Siliconware Precision Industries (SPIL) has announced plans to invest indirectly a total of US$25 million in its newly-established wholly-owned subsidiary in China. Named Siliconware...
UMC, VIS July revenues down
Wednesday 9 August 2017Pure-play wafer foundries United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have reported sequential decreases in July consolidated revenues of 2.4% and...
SMIC expects up to 3% revenue growth in 3Q17
Wednesday 9 August 2017China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post revenue growth of up to 3% sequentially in the third quarter of 2017, with gross margin...
eMemory announces validation of on-chip security IP on UMC advanced nodes
Friday 28 July 2017Taiwan-based eMemory has verified its latest on-chip security IP on several of UMC's advanced nodes, according to the embedded NVM IP provider. The IP, based on unique IC biometrics,...
UMC planning 28HPC, 22ULP processes
Thursday 27 July 2017United Microelectronics (UMC) is looking to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, which will become available in 2018. The foundry also plans...
UMC expects flat 3Q17
Wednesday 26 July 2017United Microelectronics (UMC) expects its wafer shipments and ASPs to stay flat sequentially in the third quarter of 2017. The guidance is lower than market watchers' estimates of...
MediaTek to transfer 28nm chip orders to UMC
Tuesday 25 July 2017MediaTek plans to transfer part of its 28nm mobile chip orders, including those for the Amazon Echo Dot, to United Microelectronics (UMC) from Taiwan Semiconductor Manufacturing Company...
Chip demand from non-Apple camp slows
Monday 24 July 2017Chip suppliers engaged in Apple's supply chain started to see orders pick up in June. On the other hand, chip demand from the non-Apple camp has been slow, according to sources at...
TSMC expanding number of equipment suppliers for 7nm
Tuesday 18 July 2017Taiwan Semiconductor Manufacturing Company (TSMC) is expanding the number of suppliers of equipment for its 7nm process in a bid to maintain an ecosystem pricing balance, according...
Faraday unveils 28HPC USB 3.1 PHY and 40LP Type-C PHY with PD controller
Friday 14 July 2017Faraday Technology, a Taiwan-based ASIC design service and IP provider, has announced the availability of its USB 3.1 PHY on UMC 28HPC process, as well as the silicon-verified USB...
TSMC 2Q17 EPS hits 5-quarter low
Thursday 13 July 2017Taiwan Semiconductor Manufacturing Company (TSMC) has reported net profits of NT$66.27 billion (US$2.18 billion) on consolidated revenues of NT$213.86 billion for the second quarter...
Globalfoundries 22FDX attracts orders from Shanghai Fudan
Monday 10 July 2017Globalfoundries' 22nm FD-SOI process, dubbed 22FDX, has obtained orders from Shanghai Fudan Microelectronics, according to industry sources.
MediaTek shifts half of its 16nm chip orders away from TSMC, says report
Tuesday 27 June 2017Half of MediaTek's 16nm chip orders placed with Taiwan Semiconductor Manufacturing Company (TSMC) will be shifted to Globalfoundries, according to a report from Taiwan's TechNe...
SMIC mass producing 28nm HKMG chips
Monday 26 June 2017Semiconductor Manufacturing International's (SMIC) 28nm HKMG process has entered its mass production stage, according to company CEO Haijun Zhao. SMIC will move forward making chips...
Samsung mass producing Exynos-branded IoT solution
Thursday 22 June 2017Samsung Electronics has announced the start of mass production of its first Exynos-branded IoT solution, the Exynos i T200.
Faraday MFP ASIC shipments rise at CAGR of 38%
Thursday 22 June 2017Faraday Technology has announced that its MFP (Multi-Function Printer) ASIC solutions have surpassed 50 design wins since its introduction 10 years ago, and the MFP ASIC shipment...
Xiaomi sampling in-house developed Surge S2 chips, says report
Thursday 22 June 2017Earlier in 2017, Xiaomi Technology unveiled its first in-house developed smartphone solution, dubbed Surge S1, which is built by Taiwan Semiconductor Manufacturing Company (TSMC)...
Packaging can extend physical limits of semiconductors, says TSMC chair
Monday 12 June 2017Moore's Law will reach its physical limits in 8-10 years, but the development of advanced packaging technology will help extend innovations, according to Morris Chang, chairman of...
Pure-play foundries post increased May revenues
Friday 9 June 2017Taiwan-based pure-play foundries Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have reported sequential...
SMIC eyeing top-3 spot in pure-play foundry segment
Saturday 3 June 2017Semiconductor Manufacturing International (SMIC) is aiming to become a global top-3 pure-play foundry chipmaker by 2020, according to the China-based company. In addition to advanced...
TSMC to start equipment move-in at Nanjing plant in September
Tuesday 30 May 2017Taiwan Semiconductor Manufacturing Company's (TSMC) new 12-inch plant in Nanjing, China will be ready for equipment move-in in September 2017, according to the Taiwan-based foundry...
- NXP shows first FD-SOI chips (Apr 13) - EE Times
- China: Fab boom or bust? (Mar 16) - Semiconductor Engineering
- Samsung running 28nm FDSOI chip process (Dec 23) - EE Times
- The Liang Mong-song story: Hunting down a turncoat (Jan 23) - CommonWealth magazine
- Why Globalfoundries is embracing FD-SOI and why now (Jul 15) - EE Times India
- MediaTek expands its flagship Helio processor family with the P series (Jun 1) - Company release
- Globalfoundries offers new low-power 28nm solution for high-performance mobile and IoT applications (May 20) - Company release
- Renesas develops 28nm embedded flash memory technology for microcontrollers (February 18) - Company release
- AMD launches first ARM-based server CPU (February 13) - EE Times
- ARM and SMIC broaden IP partnership with 28nm process for mobile and consumer applications (February 9) - Company release