Driven by expanding global investments in artificial intelligence infrastructure, South Korea's ICT exports shattered previous records in September 2026. Shipments surged past the...
Five senior Samsung Electronics executives, including the heads of its semiconductor and consumer electronics businesses, reportedly traveled to Tokyo on October 13 while chairman...
LG Innotek expects to begin supplying glass substrates for advanced semiconductor packaging around 2028 and sees its chip substrate business improving in 2027, as the South Korean...
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
South Korea's LG Innotek expects its semiconductor substrate business to improve in 2027 as it pursues long-term supply agreements (LTAs) with major technology companies and prepares...
SK Hynix is seeking US approval to ship additional American chipmaking equipment to its NAND flash facility in Dalian, China, linking the request to a potential investment in a new...
Samsung Electronics has reportedly completed development of next-generation 4F² DRAM technology and is aligning commercialization with customer requirements, even as China's ChangXin...
SK Hynix aims to finalize the technical specifications for high-bandwidth flash (HBF) in January 2027 as it develops new memory technologies to address growing bottlenecks in AI inference...
Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor...
South Korea's LX Semicon is seeking buyers for more than 60 silicon carbide (SiC) power semiconductor patents, winding down a business it entered five years ago to reduce its reliance...
Competition in the global PC market is shifting from a focus on shipment volumes of low-cost models towards premium, high-performance devices, intensifying the race in OLED display...
South Korean inspection equipment manufacturer Hanwool Semiconductor has secured an order to supply ultrasonic inspection equipment for multilayer ceramic capacitors (MLCCs) to a subsidiary...
Global DRAM demand for humanoid robots is projected to increase more than 20-fold by 2030 as robot deployments expand and memory capacity per unit doubles, potentially opening a new...
Some back-end manufacturing equipment intended for SK Hynix's sixth-generation high-bandwidth memory (HBM4) production may be deferred from the second half of 2026 into 2027, raising...
