Samsung Electronics is expanding its high-bandwidth memory (HBM) packaging operations in South Korea as its Cheonan campus runs short of space, prompting the company to develop nearby...
SK Hynix's sixth-generation high-bandwidth memory (HBM4) production yield has reportedly surpassed 70%, Chosun Biz reported on November 12, citing semiconductor industry sources,...
Samsung Electronics is targeting an exit from its 8-inch foundry business by the end of 2029, a year earlier than previously reported, and has been outsourcing some production to Taiwan's...
Naver said on November 12 it had signed a KRW2 trillion (approx. US$1.5 billion) AI computing services contract with a US-based AI inference company, securing its first major customer...
OpenAI CEO Sam Altman warned Samsung Electronics executives that AI memory demand could fluctuate in the short term, with the market potentially counting the same demand more than...
Taiwan’s glass fiber exports to South Korea rose 54.0% year-over-year in the first nine months of 2026 as demand for high-bandwidth memory (HBM) and advanced packaging expanded...
Samsung Display, BOE Technology Group and Tianma Microelectronics are considering cheaper OLED panels for budget smartphones to boost factory utilization as handset sales decline,...
Apple and Samsung Electronics are working with suppliers on foldable phone glass that is thinner at the hinge and thicker elsewhere, a design they are considering for 2028 models,...
Samsung Electronics and AMD are teaming up to upgrade the Korean chipmaker's semiconductor manufacturing test infrastructure, combining AMD's new EPYC Embedded 9006 processors with...
Kia is considering investing about US$1.5 billion to expand its plant in Andhra Pradesh, India, while South Korean auto-parts makers have pledged follow-on investments. If approved,...
Samsung Electronics acquired four US silicon photonics patents from UK-based Rockley Photonics in September 2026, South Korea's Shinailbo reported on November 11, citing US...
Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...
Ingentec’s consolidated revenue reached NT$1.329 billion (US$40.4 million) from January to October 2026, up 79.32% from the same period in 2025. However, October revenue fell...
Smaller electronics manufacturers are relying on the spot market for memory as major customers lock in future supply through long-term agreements, according to independent electronic...
Advantech's South Korean business grew 67% in the first three quarters of 2026, as industrial equipment, networking and cloud infrastructure, and healthcare remained its largest local...
