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Friday 28 August 2026
China memory catch-up broadens: YMTC closes in on SK Hynix NAND share, CXMT advances DRAM tech
China's memory-chip industry is narrowing parts of the technology gap with global leaders on two fronts. YMTC is approaching SK Hynix in NAND revenue share while running a more advanced...
Friday 28 August 2026
Samsung eyes zHBM products from 2029 as heat remains key hurdle
Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...
Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
Friday 28 August 2026
China rises to No. 2 in global CMOS image sensors, overtaking Korea with 21% share
China's CMOS image sensor industry is gaining ground beyond smartphones, with robotics emerging as one of the latest areas where domestic suppliers are linking sensor technology with...
Thursday 27 August 2026
Rebellions targets 100-plus NPU racks as UK steps up chip spending
Rebellions is pursuing deployment of more than 100 NPU-based computing racks in the UK through a partnership with British AI infrastructure startup Callosum, giving the South Korean...
Thursday 27 August 2026
HBM hybrid bonding delayed by 300°C heat and CMP dishing
As high-bandwidth memory (HBM) stack counts continue to rise, the industry originally anticipated that hybrid bonding (HB), a next-generation packaging solution, would be officially...
Thursday 27 August 2026
CXMT DDR5 closes in on SK Hynix at 8,000 MT/s, benchmark gap falls below 1%
CXMT is narrowing the performance gap with SK Hynix in high-speed DDR5 memory, with new benchmark tests showing CXMT chips running stably at 8,000 MT/s and delivering productivity...
Thursday 27 August 2026
China OLED buildout lifts Korean equipment sales as backlogs grow
Chinese panel makers' investment in next-generation OLED production is beginning to translate into reported sales at South Korean equipment suppliers, with several vendors posting...
Thursday 27 August 2026
Moody's lifts South Korea GDP forecast on hard-to-replace memory chips
Moody's has sharply raised its forecast for South Korea's 2026 economic growth to 3.5%, saying the country's semiconductor boom and export strength will last longer than expected and...
Thursday 27 August 2026
Nvidia reportedly shifts HBM4 mix toward 8-high as memory supply stays tight

Nvidia has reportedly asked Samsung Electronics and SK Hynix to increase the share of 8-high products...

Wednesday 26 August 2026
YMTC targets global NAND lead by 2027 as parent seeks US$5 billion IPO
Yangtze Memory Technologies (YMTC) is aiming to become the world's largest NAND flash supplier by the end of 2027, setting an aggressive target as its parent prepares a nearly US$5...
Wednesday 26 August 2026
South Korea, US clash over reactor choice in US$350B nuclear deal
South Korea and the United States are at odds over which reactor design to build — and who runs the project — in the nuclear power component of Seoul's US investment package,...
Wednesday 26 August 2026
SK hynix production union rejects stock-heavy pay deal by 25 votes
SK hynix's production-worker union has rejected the company's tentative 2026 wage and collective bargaining agreement by just 25 votes, sending the two sides back to the negotiating...
Wednesday 26 August 2026
Samsung's 3-year shareholder returns seen topping KRW600T
AI memory excess profits are beginning to change Samsung Electronics' capital-allocation logic. The company recently said that, under its current 2024-2026 shareholder return policy,...
Wednesday 26 August 2026
BOE, 3M expand materials partnership as foldable OLED competition intensifies
BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development...