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Friday 10 July 2026
ASE Holdings posts record 2Q26 revenue, bets US$40M on South Korea as AI packaging demand surges

ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and...

Friday 10 July 2026
TSMC CoWoS output reportedly to reach at least 200K wafers in 2027

TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly...

Wednesday 8 July 2026
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
Thursday 25 June 2026
ASE sees AI demand stretching packaging capacity into 2030
ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company...
Thursday 25 June 2026
TSMC-Amkor alliance jolts packaging map as ASE races to expand
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
Friday 12 June 2026
Taiwan OSAT firms gain from AI chip demand and foundry spillover
The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers...
Thursday 11 June 2026
Taiwan Mask sells Zhunan plant to Siliconware Precision Industries for NT$2.8 billion
Taiwan Mask (TMC), a Taiwanese photomask manufacturing process company, has approved the sale of its Plant 6 in Zhunan, Taiwan. The company said the move is primarily a strategic measure...
Tuesday 2 June 2026
ASE CEO says Taiwan's semiconductor ecosystem took 40 years to build — and will take years to replicate
When Marvell CEO Matt Murphy asked ASE Group CEO Tien Wu what makes Taiwan's technology ecosystem unique — and why it is so hard to replicate elsewhere — the answer was...
Sunday 31 May 2026
WinWay to double test capacity with NT$3.5B southern Taiwan plant
WinWay Technologies, a major test interface provider, followed ASE Holdings in holding a groundbreaking ceremony for its new plant at the Renwu Industrial Park in southern Taiwan....
Thursday 28 May 2026
ASE launches first automated PLP line, eyes 1H27 production
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence...
Friday 22 May 2026
AMD deepens Taiwan supply chain ties with US$10B-plus push
AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum...
Sunday 17 May 2026
Taiwan chipmakers quietly fill gaps left by Korea's HBM push
Taiwan's semiconductor ecosystem is getting an unexpected lift from the AI server investment boom. Supply pressure that began in high-bandwidth memory and leading-edge process technology...
Monday 11 May 2026
ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029
Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler...
Monday 11 May 2026
AI boom drives Taiwan's semiconductor testing industry into record expansion

To secure a foothold in the booming market for advanced AI chip packaging and testing, Taiwan's outsourced semiconductor assembly and test...

Monday 4 May 2026
SPIL buys multiple Nanke plants to boost advanced packaging capacity for AI demand
Siliconware Precision Industries Co., Ltd. (SPIL), a subsidiary of ASE Technology Holding, acquired two Nanke-area plants in 2026 from HannStar Display and its affiliate HannsTouch...