CONNECT WITH US
NEWS TAGGED ASE
Friday 2 October 2026
ASE stake, expansion open doors for Machvision
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
Thursday 1 October 2026
ASE expands smart OSAT push with six university research partnerships
Advanced Semiconductor Engineering (ASE) held its 11th Automation Industry-Academia Project Results Presentation on September 30, unveiling 12 technology projects developed with six...
Thursday 1 October 2026
AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote
ASE Technology Holding (ASEH) announced on July 30 that it would spend roughly NT$5.67 billion (approx. US$177.97 million) to acquire land and factory buildings in the Zhongli Industrial...
Wednesday 30 September 2026
ASE Technology buys Singapore factory for AI chip testing expansion
ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about...
Tuesday 22 September 2026
TSMC, ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung

Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park...

Thursday 17 September 2026
Charts: Taiwan's chip packaging growth runs deeper than ASE

Taiwan's back-end semiconductor sector is growing well beyond its largest player. The 24 listed packaging and testing firms tracked...

Friday 11 September 2026
ASE to buy AOI, AVI equipment from Machvision for NT$334M
ASE announced at a news briefing on September 11, 2026, that ASE's board had approved the purchase of equipment, including automated optical inspection (AOI) and automated visual inspection...
Thursday 10 September 2026
ASE August revenue tops NT$80 billion record as AI packaging capacity stays sold out
ASE Technology Holding's revenue surpassed NT$80 billion (US$2.5 billion) for the first time in August 2026, as AI continued to drive demand for both advanced and conventional semiconductor...
Wednesday 9 September 2026
IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy

As graduation season arrives, Taiwan's semiconductor industry once again enters its annual competition for talent. Driven by declining birth rates and surging demand...

Wednesday 2 September 2026
TSMC moves into Baipu Industrial Park, boosts advanced packaging
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
Wednesday 2 September 2026
AI packaging demand surges, ASE EVP identifies two manufacturing bottlenecks
On the eve of the official opening of SEMICON Taiwan 2026, the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA), initiated by SEMI, TSMC, and ASE, held the 3DIC Global Summit on...
Tuesday 1 September 2026
ASE CEO describes AI resource squeeze as a short-term problem
AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology...
Monday 31 August 2026
ASE: CPO scale-out demands deeper supply-chain coordination for mass production
SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.
Friday 28 August 2026
AI packaging race heats up: Taiwan OSATs plan US$14.6 billion capex

The AI investment cycle is spreading from leading-edge wafer fabrication into semiconductor packaging and testing, with Taiwan's largest...

Wednesday 26 August 2026
TSMC's 310mm push threatens Samsung's PLP lead
Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...