The Taiwanese government decided to raise electricity prices by an average of about 10% starting in April, with industrial electricity prices up by nearly 14%, the third consecutive...
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the expansion of its advanced interconnect technology on the VIPack platform. This development...
OSAT company ASE Technology Holding (ASEH) expects inventory adjustments at clients to conclude in the first half of 2024, followed by an AI-driven comeback in operations in the second...
In the past decade, environmentally friendly corporate practices have become such a norm, that electronic manufacturing supply chains reducing carbon emissions to align with global...
According to industry sources in Taiwan, IC back-end houses are divided as to whether they will establish facilities in Japan similar to Taiwan Semiconductor Manufacturing Company...
Following ASE Technology Holding announced the acquisition of Infineon's automotive packaging and testing plants in South Korea and the Philippines on February 22, China's Jiangsu...
Taiwanese OSAT leader Advanced Semiconductor Engineering (ASE) has recently announced its plan to bolster overseas production by acquiring Infineon's backend assembly and testing...
The AI surge is anticipated to substantially boost demand for advanced packaging, which is already in short supply, according to sources at backend houses.
ASE Technology Holding (ASEH) will be stepping up its advanced packaging and testing capabilities in the second half of 2024, when a new cycle begins after the completion of inventory...
According to industry sources, IC material distributors anticipate customer inventory adjustments will end in the first half of 2024, with AI expected to accelerate growth in the...
With TSMC and ASE Holdings (ASEH) gearing up to build additional fab capacities for advanced packaging, relevant supply chain participants are optimistic about growth driven by their...
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.