News tagged HPC at DIGITIMES

NEWS TAGGED HPC

Saturday 11 July 2026

Interview: Why Geckos bets materials, not chips, will decide the next AI performance leap

As generative AI fuels rapid growth in demand for high-performance computing (HPC), the semiconductor industry is shifting from a process...

Tuesday 7 July 2026

Exclusive: Geckos bets on AI materials beyond nano copper powders and CPO waveguides

As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos...

Monday 6 July 2026

Kingboard raises CCL prices again as AI demand tightens PCB material supply

Rising demand for AI servers and high-performance computing (HPC) continues to drive price increases across the upstream PCB materials supply chain.

Sunday 5 July 2026

AI, HPC test interface demand drives CHPT June revenue to new monthly high

Test interface supplier Chunghwa Precision Test Tech. Co., Ltd. (CHPT) reported its June 2026 revenue, marking its sixth consecutive...

Saturday 4 July 2026

Machvision's June revenue hits another record due to AI demand

Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for...

Friday 26 June 2026

Altos and FPT sign MOU to scale enterprise AI and HPC across Asia-Pacific

Altos, a subsidiary of Acer, said on June 24, 2026, that it signed a memorandum of understanding (MOU) with Vietnam-based FPT to jointly deploy and commercialize enterprise AI across...

Thursday 25 June 2026

Taiwan electronics production jumps 93% in first five months of 2026 on AI boom

Taiwan's Ministry of Economic Affairs (MOEA) released industrial production statistics for May 2026 on June 24, reporting that Taiwan's computer, electronic products, and optical products...

Friday 19 June 2026

Cornelis-powered Lynx supercomputer enters service at LLNL, expanding NNSA computing capacity

Cornelis Networks has announced the successful deployment of the Lynx supercomputing cluster at the US Department of Energy's Lawrence...

Wednesday 17 June 2026

WinWay buys California property to support US expansion in AI and HPC

WinWay Technologies has bought real estate in California for US$2.28 million to create a local manufacturing and office base, a move that underscores how Asian suppliers are expanding...

Friday 12 June 2026

Taiwan OSAT firms gain from AI chip demand and foundry spillover

The global push for AI and HPC chips is tightening advanced packaging capacity and lifting orders for outsourced semiconductor assembly and test providers. For international customers...

Wednesday 10 June 2026

WinWay revenue rises on AI and HPC demand

WinWay Technologies said shipments linked to artificial intelligence, high-performance computing, central processing units, and application processors lifted consolidated revenue to...

Monday 1 June 2026

AuthenX targets CPO bottlenecks with detachable metalens FAU

AuthenX is preparing to showcase a detachable 2D fiber-array unit at COMPUTEX 2026, as the Taiwanese optical-communications company seeks to address packaging and alignment challenges...

Friday 29 May 2026

Chinese power chipmaker China Resources Microelectronics targets AI servers with PLP packaging

Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more...

Monday 25 May 2026

Embedded substrates draw AI chip interest as packaging turns strategic

Rising interest in embedded substrates among Nvidia, AMD, and Intel signals potential shifts in AI data‑center supply chains, as the technology promises improved signal integrity...

Friday 22 May 2026

Lam Research launches PLP Center of Excellence, replacing wafers with panels

Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...

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Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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