IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...
Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
US electronic design automation (EDA) software company Cadence Design Systems posted third-quarter 2025 revenue of US$1.34 billion, up 10% from a year earlier and slightly above analysts'...
As artificial intelligence (AI) and high-performance computing (HPC) lead a new industrial revolution in the PCB sector, Taiwanese giants Zhen Ding Tech (ZDT) and Unimicron are optimistic...
Driven by next-generation AI chip mass production and seasonal demand for consumer electronics, Taiwan's test interface suppliers reported steady growth in September 2025. Industry...
As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between...
At the OCP Global Summit, Broadcom and Arm presented a joint call for a radical architectural shift in PCI Express, arguing that the industry must move beyond long-standing ordering...
As the generative AI (GenAI) boom becomes a central focus in tech development, high-performance computing (HPC) opportunities continue to expand, recently causing supply-demand gaps...
Southern Taiwan Science Park (STSP) has posted an impressive revenue performance for January to August 2025, driven by the global AI boom. Almost breaking NT$2 trillion at NT$1.828...
Several semiconductor materials distributors have posted robust revenue growth, reflecting rising demand driven by advancements in artificial intelligence (AI) and high-performance...
At the OCP Global Summit 2025 in San Jose, Pegatron showcased a comprehensive lineup focused on next-generation AI, HPC, and professional visual computing workloads. The company also...
At the 2025 OCP Global Summit, Taiwan-based interconnect solutions provider BizLink unveiled a full suite of high-speed connectivity and AI-ready data center solutions, showcasing...
Alcor Micro Corporation, a subsidiary of Egis Technology, is showcasing its latest Arm architecture CPU platform, Mobius100 (CSS V3), at the 2025 Open Compute Project (OCP) Global...
TSMC reported consolidated revenue of NT$330.98 billion (US$10.8 billion) in September 2025, a slight 1.4% decrease from August but a 31.4% increase year-over-year, marking a record...
China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in...
