TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...

Global server shipments are expected to see a CAGR of 6.7% from 2020-2025, driven by demand for datacenter, HPC, AI and 5G related applications.

TSMC as a top-choice foundry partner for HPC (high performance computing) chips vendors will significantly benefit Taiwan suppliers of ABF substrates for processing such chips, according...

TSMC expects to post revenues of between US$12.4 billion and US$12.7 billion in the fourth quarter of 2020, which is a 3.4% sequential increase at the midpoint. Gross margin and operating...

Taiwan-based IC test solutions providers including Chunghwa Precision Test Tech (CHPT), Keystone Microtech and WinWay Technology have enjoyed a pull-in of short lead-time orders for...

Global server shipments are expected to see a CAGR of 6.7% from 2020-2025, driven by demand for datacenter, HPC, AI and 5G related applications, according to Digitimes Research's...

Taiwan-based IC test interface specialist Chunghwa Precision Test Technology (CHPT) is stepping up AI-based smart production of vertical probe cards (VPC) seeking to compete well...

ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with...

PCB equipment supplier Symtek Automation Asia (SAA) expects higher sales in second-half 2020 than in first-half 2020, with even brighter market prospect for 2021.

Taiwan-based IC substrate makers including Unimicon Technology, Nan Ya PCB and Kinsus Interconnect Technology continue to see their available production capacities for ABF substrates...

Leading OSAT providers, such as ASE Technology, are expected to see revenues generated from their SiP businesses climb about 30% in 2020, driven by demand for 5G, AI and HPC device...

Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...

Taiwan-based IC test interface solutions provide Chunghua Precision Test Tech (CHPT), mobile device certification specialist Sporton International, and testing house Sigurd Microelectronics...

System-in-package (SiP) demand will grow further on a wide range of applications enabled by the emerging 5G, AI and HPC technologies in 2021, according to industry sources.

TSMC is expected to continue its advanced packaging development focus on 3D SoIC (system on integrated chips) technology and organic interposer in 2021, although it has fabricated...

Samsung is stepping up its deployments in the 3D IC packaging field, looking to compete against TSMC starting 2022 for advanced chip packaging in-house, according to industry obser...

Taiwan's PCB supply chain is trying to identify clients who may replace Huawei and HiSilicon, both of whom face tough US trade restrictions, according to industry sources.

Macnica Galaxy, a Taiwan-based IC distribution arm of Japan's Macnica Group, has reported its first-half 2020 net profits soared 87.6% on year to a four-year high of NT$130 million...

Taiwan-based semiconductor material suppliers and distributors have enjoyed strong demand from their foundry clients for advanced-node manufacturing, and have seen clear order visibility...

Taiwan-based Nan Ya PCB saw its net profits soar nearly 80% sequentially to NT$833 million (US$28.36 million) in the second quarter of 2020, a sharp improvement from operating losses...

Taiwan's IC substrate makers Nan Ya PCB and Kinsus Interconnect Technology are optimistic that their revenues for the third quarter of 2020 may grow 20% sequentially and profits may...

TSMC saw its July revenue decline 12.3% on month but remain above NT$100 billion (US$3.4 billion).

Chroma Ate, which provides integrated and customized solutions for test and measurement instruments, has reported net profits increased 24% sequentially to NT$580 million (US$19.8...

The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...

IC substrate maker Unimicron Technology is slated to complete construction of a new plant in Yangmei, northern Taiwan by the end of 2020, followed by process optimization and validation...