Silicon Valley venture firm Playground recently showcased seven semiconductor startups at a media event in Taiwan. Beyond the well-known Ayar Labs, d-Matrix, and NextSilicon, two...
The global semiconductor sector is at a critical juncture as demand for AI servers and high-performance computing (HPC) accelerates. A structural memory shortage is emerging across...
The 66th edition of the global TOP500 supercomputer rankings was officially released at the 2025 International Conference for High Performance Computing, Networking, Storage, and...
Wieson reported significant gains in its third-quarter 2025 results, driven by heightened demand for connectors in artificial intelligence (AI) servers and high-performance computing...
As AI ASIC makers accelerate the release of next-gen chips to catch up with AI GPU leaders, industry observers expect a major shift in the AI chip landscape by 2026. This transformation...
As AI servers and high-performance computing (HPC) drive a wave of high-current and high-speed transmission demand, Taiwan-based electronic connector maker Bellwether Electronic Corp...
IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...
Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
US electronic design automation (EDA) software company Cadence Design Systems posted third-quarter 2025 revenue of US$1.34 billion, up 10% from a year earlier and slightly above analysts'...
As artificial intelligence (AI) and high-performance computing (HPC) lead a new industrial revolution in the PCB sector, Taiwanese giants Zhen Ding Tech (ZDT) and Unimicron are optimistic...
Driven by next-generation AI chip mass production and seasonal demand for consumer electronics, Taiwan's test interface suppliers reported steady growth in September 2025. Industry...
As AI models and computing demands continue to grow exponentially, the biggest challenge in chip design is no longer pure processing power, but the bandwidth gap between...
At the OCP Global Summit, Broadcom and Arm presented a joint call for a radical architectural shift in PCI Express, arguing that the industry must move beyond long-standing ordering...
As the generative AI (GenAI) boom becomes a central focus in tech development, high-performance computing (HPC) opportunities continue to expand, recently causing supply-demand gaps...
Southern Taiwan Science Park (STSP) has posted an impressive revenue performance for January to August 2025, driven by the global AI boom. Almost breaking NT$2 trillion at NT$1.828...
