Optoelectronics PCB makers, Taiwan PCB Techvest (TPT) and Tripod Technology, have both seen an influx of orders since August, bringing utilization rates to full. TPT has expanded...
Chipbond Technology is performing better than previously expected in the third quarter of 2009, thanks to growing demand from IDM customers, according to the company. The driver IC...
Ralec Electronic plans to expand its monthly capacity of 0201 resistors to up to 400 million units in fourth-quarter 2009, from 200 million currently, as it has seen full utilization...
Notebook PCB makers HannStar Board and Gold Circuit Electronics (GCE) both expect to see their utilization rates stand high in the second half due to shipment outlooks released by...
Taiwan-based LED packaging house Harvatek has reported net profit of NT$14.68 million (US$446,670) for the second quarter with an EPS of NT$0.08. Revenues for the second quarter were...
Notebook PCB maker HannStar Board has estimated its utilization to reach 95% in the third quarter, and climb further to approach 100% in the fourth, according to company COO Yeh Sh...
Passive component maker Walsin Technology Corporation (WTC) swung back to profitability in the second quarter with revenues of NT$3.83 billion (US$116.17 million), up 38% sequentially,...
Taiwan-based IC packaging and testing service providers are expected to post sequential revenue drops of less than 10% in the fourth quarter of 2009, but overall gross margins may...
Greatek Electronics is estimated to see its utilization rate for packaging and testing climb to 90-95% and 60-70%, respectively, in the third quarter of 2009, according to market...
China-based IC foundry Semiconductor Manufacturing International Corporation (SMIC) has sent an internal message to all employees that it has ended its compulsory unpaid leave policy,...
Taiwan-based PCB maker Gold Circuit Electronics (GCE), due to increasing orders for PCBs used in notebooks, expects to see over NT$1.3 billion (US$39.44 million) in its August revenues,...
Taiwan-based IC substrate maker Kinsus Interconnect Technology has seen its capacity utilization for flip-chip chip scale packaging (FC CSP) substrates rise to more than 80% and the...
Order visibility at both Taiwan Semiconductor Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) has extended to November 2009, with utilization rates expected...
Vanguard International Semiconductor (VIS), which specializes in analog/mixed-signal and logic ICs, has estimated shipments for third-quarter 2009 are likely to increase 25% sequentially...
AU Optronics (AUO) is seeing increasing utilization at its 8.5G production line, L8A in central Taiwan, and expects to reach full utilization of 40,000 glass substrates a month by...
