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Thursday 23 May 2024
Exploring the Synergy of Nanoelectronics, AI, and Quantum: Interview with General Chair of IEEE INEC 2025
IEEE INEC, which stands for IEEE International Nanoelectronics Conference, was initiated in 2006 when the field of nanoelectronics was emerging and will host its 2025 conference in...
Monday 30 October 2023
Circular economy (1)Recycling of solar panels (part 1)
Circular economy is an economic system focusing on the reuse or regeneration of products or materials. The concept is to extend the life cycle of materials and products through 5Rs--reducing,...
Tuesday 21 December 2021
Broadcom, MediaTek to roll out Wi-Fi 7 SoCs in 1H22
Broadcom and MediaTek are set to release their respective Wi-Fi 7 SoC series in the first half of 2022, looking to build a preemptive presence in the next-generation Wi-Fi segment...
Thursday 25 March 2021
Alliance formed in Taiwan to promote 5G smart pole standards
A total of 25 companies in Taiwan have newly formed a 5G Smart Pole Standard Promotion Alliance, aiming to draft technological standards and tap huge smart-city business opportunities...
Tuesday 8 December 2020
Foxconn showcases O-RAN solutions at GLOBECOM 2020
Foxconn Electronics (Hon Hai Precision Industry) is showcasing its prowess for the manufacture of 5G equipment, including open-RAN (O-RAN) small cells, related base station devices...
Thursday 23 April 2020
Debuting a new generation of IEEE 802.3bt Gigabit Fiber-to-Ethernet Power Injector with unique central and local network management software
Are you experiencing the challenge how to provide higher power management capability transferring data and power simultaneously as well as to extend Fiber-to-Ethernet network economically...
Wednesday 10 July 2019
Sporton, Qualcomm team up to gain FCC approval for 802.11ay solution
Mobile device testing and certification service company Sporton International has teamed up with Qualcomm to gain US Federal Communications Commission (FCC) approval for 60GHz Wi-Fi...
Monday 3 June 2019
Wi-Fi 6 outlook: Q&A with Cees Links from Qorvo
Along with Skyworks and Broadcom as the world's top-3 providers of RF (radio frequency) solutions for advanced wireless devices, US-based Qorvo is keen on promoting Wi-Fi 6 (IEEE...
Tuesday 5 June 2018
Customized emulator testing quickly overcomes the challenges arising from a mixed use of different communication standards
In 2010, the China Ministry of Industry and Information Technology (MIIT) officially selected Wuxi National Hi-Tech Industry Development Zone as a national electronic information...
Wednesday 25 October 2017
TPCA Show 2017 highlights tech advancements for AI
The TPCA Show 2017 opened October 25 for a three-day run at the Taipei Nangang Exhibition Hall, with over 400 exhibitors from PCB-related supply chains showcasing their latest products...
Friday 31 March 2017
TAICS signs MOU with IEEE
The Taiwan Association of Information and Communication Standards (TAICS) and the Institute of Electrical and Electronics Engineers (IEEE) have signed a memorandum of understanding...
Wednesday 25 November 2015
Digitimes Research: Next generation IEEE 802.11ay standards to come in 2017
IEEE is setting next generation wireless transmission standards at 60GHz, IEEE 802.11ay, which is expected to be completed in 2017. The new standards are likely to focus on new applications...
Wednesday 26 June 2013
TSMC R&D VP recognized for contributions to lithographic manufacturing
Burn J Lin, VP of R&D at Taiwan Semiconductor Manufacturing Company (TSMC), has been recognized for his invention of liquid immersion lithography. The breakthrough allows the...
Tuesday 2 August 2011
Macronix president CY Lu wins 2012 IEEE Frederik Philips Award
Hsinchu, Taiwan, Aug. 01, 2011- Dr. C.Y. Lu, President of Macronix International Co., Ltd., was selected to receive the 2012 IEEE Frederik Philips Award by the Institute of Electrical...
Tuesday 21 December 2010
AUO CIPO Fang-Chen Luo honored with IEEE Jun-ichi Nishizawa Medal
Hsinchu, Taiwan, Dec 21, 2010 - AU Optronics (AUO) announced today that Fang-Chen Luo, AUO's CIPO (Chief Intellectual Property Officer), was honored by the 2011 IEEE Jun-ichi Nishizawa...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research