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    NEWS TAGGED INTEL
    Monday 31 August 2026
    Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff
    Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
    Thursday 27 August 2026
    Google, MediaTek embrace advanced packaging diversification
    Google and MediaTek are moving toward advanced packaging diversification, as Intel's embedded multi-die interconnect bridge (EMIB) gains traction after Google's TPU was confirmed to...
    Wednesday 26 August 2026
    Hot Chips 2026: Nvidia pushes deeper into server CPUs with Vera
    Nvidia used Hot Chips 2026 to disclose more details about Vera, its next-generation data-center CPU, as the company pushes deeper into the standalone server processor market long dominated...
    Wednesday 26 August 2026
    Samsung, Intel widen AI chip battle into memory, packaging
    Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...
    Tuesday 25 August 2026
    Intel x86 share drops below 70% as AMD reaches a record high
    Intel's long-running lead in x86 processors slipped below a major threshold in the second quarter of 2026, even as AI infrastructure spending helped support demand. New market data...
    Tuesday 25 August 2026
    Intel pitches Diamond Rapids at Hot Chips as server CPU competition heats up
    Intel pitched its next-generation Diamond Rapids Xeon at Hot Chips 2026 as the company bets that agentic AI will increase the role of general-purpose processors in AI infrastructure,...
    Tuesday 25 August 2026
    TSMC, Intel, and Samsung battle over backside power delivery below 2nm
    As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
    Monday 24 August 2026
    SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
    Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
    Monday 24 August 2026
    AI accelerator shipments are set to turn advanced packaging into the next battleground: Counterpoint
    AI accelerator shipments are expected to reshape semiconductor demand worldwide, with implications for cloud operators, memory suppliers, and device makers in every major market. Counterpoint...
    Friday 21 August 2026
    Samsung holds off on High-NA EUV until 1nm production
    Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier...
    Thursday 20 August 2026
    Robotics leaders present future of physical AI, but also deployment challenges
    Tech leaders converged at the 2026 International Robotic Forum on August 19, where they laid out their visions for the evolution and next stages of physical AI. They noted that a robot's...
    Thursday 20 August 2026
    Intel Malaysia packaging expansion draws HBM flows from Taiwan

    South Korean export data showed a sharp shift in high-bandwidth memory, or HBM, shipments toward Malaysia and away from Taiwan, according...

    Wednesday 19 August 2026
    Socionext taps Intel 18A-P process for high-performance compute chiplet development
    Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry's 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data...
    Saturday 15 August 2026
    Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

    High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

    Friday 14 August 2026
    Podcast highlights: Intel raises US$20B, but its 14A ambitions may need twice as much

    DIGITIMES analyst Luke Lin, speaking on a recent podcast, used Intel's latest equity fundraising plan to examine who is benefiting...

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    BIZ FOCUS
    Aug 27, 08:00
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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