Intel will keep working with Elon Musk on Terafab, according to Bloomberg. Intel CEO Lip-Bu Tan stated that the company will stay involved in Musk's plan to make cutting-edge...
Japan's Rapidus is widening its semiconductor push with help from four Malaysian IC design firms, a move that could strengthen chip-development support for customers worldwide. The...
As Elon Musk's Terafab ambitions advance, the realities of modern silicon manufacturing become increasingly apparent, prompting Musk to enter talks with industry mainstays like Intel...
Days after reports emerged that TSMC was reassessing plans for a wafer fab in Texas, Tim Culpan, a former Bloomberg columnist and founder of independent media outlet Culpium,...
This excerpt from DIGITIMES analyst Luke Lin's podcast looks at TSMC's rumored Texas expansion, Intel's 14A and 18A process debate, and Qualcomm's high bandwidth compute (HBC) push...
Elon Musk has confirmed that Terafab, the chipmaking venture backed by his SpaceX and Tesla, is in discussions with TSMC. The confirmation followed a report that the Taiwanese foundry...
Under Lisa Su's 12-year tenure at Advanced Micro Devices (AMD), the company has gradually moved beyond its role as Intel's challenger in the CPU market. But in the accelerator market...
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
Silicon Valley data center optical interconnect startup CScale emerged from stealth on September 30 after raising US$145 million in a Series C funding round backed by Nvidia and Intel...
MediaTek's Google Tensor Processing Unit (TPU) business is still moving steadily higher, but supply-chain sources say the real limit is capacity as chipmakers and cloud service providers...
Intel CEO Lip-Bu Tan stated that Intel's relationship with TSMC is built on partnership rather than rivalry. He noted that a collaborative mindset guides key industry leaders, including...
Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
Physical AI is accelerating like never before. Autonomous intelligent machines can walk, run, fly, swim, and assemble car parts in under a minute. New advances in AI models and technologies...
