CONNECT WITH US
NEWS TAGGED INTEL
Saturday 11 July 2026
Samsung's CXL 3.1 memory delay lays bare Intel, AMD server platform lag

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...

Saturday 11 July 2026
SunplusIT clears Intel and AMD eUSB hurdle, starts thermal imaging shipments ahead of July listing
Sunplus Innovation Technology (SunplusIT) said on July 9, 2026, that it is preparing to become a listed company in mid-July 2026 and outlined its view on market conditions in the second...
Friday 10 July 2026
Insight: TSMC's 2nm lead widens, Intel 14A slips beyond 2030, Samsung 4nm fills on HBM4 demand

Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence...

Wednesday 8 July 2026
Pegatron chairman downplays Intel CPU price hike worries
Intel confirmed on July 6 that it will raise suggested prices for consumer and server CPUs, stirring questions about whether the move will push up PC costs and affect consumer demand...
Friday 3 July 2026
Intel takes aim at TSMC's CoWoS lead with EMIB-T
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components...
Wednesday 1 July 2026
Tenstorrent's Jim Keller says startup will outpace Cerebras as AI chip competition intensifies

AI chip competition is widening beyond raw performance, a shift that matters for global cloud providers, device makers, and investors...

Wednesday 1 July 2026
Tesla taps Intel 18A veteran to lead Terafab chip project in Texas

Tesla has hired Gary Jiang, a nearly 18-year Intel manufacturing veteran, as director of its Terafab chip project in Texas, marking...

Tuesday 30 June 2026
Arm says it tops 50% share in hyperscale cloud as x86 grip slips

Arm Holdings says its chip architecture has crossed the 50% threshold in the hyperscale cloud market, a milestone in a segment long...

Tuesday 30 June 2026
Intel-UMC tie-up talk runs into hard realities of process gaps and cash needs

A recent market rumor suggesting UMC may deepen cooperation with Intel, extending work from 12nm processes to the more advanced Intel...

Monday 29 June 2026
Taiwan joins post-HBM memory race with Intel, SoftBank

Taiwan's semiconductor ecosystem has entered the race to develop a possible post-HBM memory architecture, with Powerchip Semiconductor...

Thursday 25 June 2026
SambaNova targets US$10B valuation as demand rises for cheaper AI inference
AI chipmaker SambaNova could raise between US$800 million and US$1 billion in a new funding round, according to its executive chairman and Intel CEO Lip-Bu Tan. This would raise SambaNova's...
Thursday 25 June 2026
TSMC 3nm lead times surpass one year as Samsung faces Intel in foundry push
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics'...
Tuesday 23 June 2026
Intel deepens ties with Taiwan's chip supply chain as October talks expand
Intel is deepening cooperation with Taiwan's semiconductor supply chain and plans to broaden its engagement again in mid-October after completing exchanges in the US with several Taiwanese...
Monday 22 June 2026
Intel CEO doubles down on advanced packaging with former SK Hynix chief's return
Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies...
Monday 22 June 2026
TSMC glass substrate rollout unlikely before 2030

The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving...