SEMICON Taiwan 2024 will feature more than 1,000 firms and up to 3,700 booths, including Taiwan Semiconductor Manufacturing Company (TSMC), Samsung Electronics, and SK Hynix.
SK Hynix has announced the successful development of the world's first sixth-generation 10nm-class DRAM (1c DRAM), surpassing industry leader Samsung Electronics in achieving mass...
As the global semiconductor foundry market shows signs of recovery, Samsung Electronics continues to trail significantly behind sector leader TSMC in market share. Additionally, it...
Samsung Display (SDC) has reportedly achieved a breakthrough in tandem OLED yield rates, positioning the company to increase its supply of OLED panels for tablets and to aggressively...
After Nvidia confirmed the on-schedule shipment of its latest Blackwell GPUs, high-bandwidth memory (HBM) providers, including SK Hynix and Samsung Electronics, expressed relief as...
August 28 marked the 100th day since Vice Chairman Young Hyun Jun was appointed as the new Head of the Device Solutions (DS) Division at Samsung Electronics. The South Korean industry's...
Kioxia, currently ranked third in the global NAND market, is reportedly set to go public in Japan in October 2024. The move aims to secure funds for R&D and production capacity...
Samsung Electronics has announced the successful qualification of its automotive LPDDR4X memory for use with Qualcomm Technologies' Snapdragon Digital Chassis. This memory is intended...
Samsung Electronics attended Gamescom 2024, held in Cologne, Germany. With an alleged largest-ever exhibition hall of about 800 square meters, Samsung unveiled its new gaming monitor,...
With TSMC expanding its presence in the United States, Japan, and Europe, many suppliers have followed suit, venturing abroad to establish new operations.
Samsung Electronics reported a significant increase in memory chip production in the first half of 2024, surpassing 1 trillion chips. This surge is largely driven by a recovery in...
In early 2023, Samsung Electronics welcomed former TSMC deputy director Jing-cheng "Vic" Lin to lead an advanced packaging task force to compete against TSMC. However, industry insiders...
