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Thursday 15 August 2024
Foxconn confirms timely delivery of Nvidia's GB200 AI servers
Amid recent rumors stating Nvidia's GB200 is facing shipment delays, Foxconn, as a primary supplier, clarified that the development of GB200 is on track and that the company will...
Wednesday 14 August 2024
TSMC approves US$29.6 billion capex for capacity expansions, tech upgrades
TSMC's board of directors has approved a significant capital budget of US$29.615 billion aimed at enhancing the company's advanced process capacities and upgrading packaging technology...
Wednesday 14 August 2024
Taiwan's drone industry grapples with rapid product cycles and short-term focus
Taiwan's drone industry faces significant challenges as it attempts to align with the country's defense initiatives and compete in the global market. The rapid pace of product iteration...
Wednesday 14 August 2024
Ams Osram launches China development center to drive growth and innovation
Ams Osram has unveiled its new China Development Center (CDC), a hub for product marketing, system solutions, applications engineering, and supply chain innovation. The CDC is strategically...
Wednesday 14 August 2024
PCB firm Zhen Ding sees new Thai facility development progress
Zhen Ding Technology, a Taiwan-based flexible PCB and IC substrate supplier, has seen the development of its new plant in Thailand progress more smoothly than anticipated. The plant...
Tuesday 13 August 2024
Samsung reportedly investing in in-house chip development to compete in XR market
Samsung Electronics is developing high-performance semiconductors for next-generation Extended Reality (XR) devices, aiming to compete with Apple's Vision Pro, which uses in-house...
Tuesday 13 August 2024
SK Hynix to face challenges for US fab despite subsidies
SK Hynix is anticipated to expedite the development of its high-bandwidth memory (HBM) manufacturing and R&D fab in Indiana, with government incentives under the US CHIPS and...
Monday 12 August 2024
SDC reportedly signs contract with Microsoft
Samsung Display (SDC) is reportedly collaborating with Microsoft to develop and supply OLED on Silicon (OLEDoS) for the next generation of Mixed Reality (MR) devices.
Monday 12 August 2024
Government support fuels Malaysia's new Infineon Kulim plant
Infineon inaugurated its new 8-inch SiC semiconductor plant in Kulim, Malaysia, on August 8.
Monday 12 August 2024
Weekly news roundup: Intel telecommunications faces cost cuts; Indian opto-semiconductor maker makes acquisition
These are the most-read DIGITIMES Asia stories in the week of August 5 – August 9.
Monday 12 August 2024
Intel unveils discrete GPU for automotive AI
Intel recently introduced its first discrete graphics processing unit (dGPU), known as the Intel Arc graphics for automotive. The product is set to be commercially deployed in vehicles...
Monday 12 August 2024
Companies weigh building AI models vs. using API solutions
Companies are currently navigating the challenge of integrating generative AI, weighing whether to build their own models or tap into external resources.
Monday 12 August 2024
Hycon Tech's SiS acquisition fuels advanced chip development amid market shifts
IC design firm Silicon Integrated Systems (SiS)'s stock exchange agreement with Hycon Technology has drawn significant market attention. Hycon stated that post-merger, it will become...
Friday 9 August 2024
SiS and Hycon merge to drive major product transformation
Taiwan-based IC design firm Silicon Integrated Systems Corp (SiS) announced it will acquire MCU manufacturer Hycon Technology through a share swap.
Thursday 8 August 2024
Potential US ban on Chinese vehicle tech to breed longer-term effects on tech rift
The US is reportedly preparing to impose a ban on vehicle technology that raises cybersecurity concerns. While this move may not immediately impact automakers, it could further widen...