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NEWS TAGGED BOOK-TO-BILL RATIO
Monday 21 August 2023
IPC makers eyeing China's infrastructure smartification as next growth driver
China's economic recovery has fallen short of expectations, and many industry players are not optimistic about sales there in the second half of 2023. Nevertheless, Taiwan's industrial...
Tuesday 18 July 2023
BB ratio for MLCCs rises
The book-to-bill ratio for multi-layer ceramic capacitors (MLCC) has risen to 0.91 on average from 0.84 in April, as orders from ODM customers have resumed, according to sources at...
Friday 11 November 2022
Nan Ya PCB sees increasing rush orders for BT substrates
Taiwan's IC substrate supplier Nan Ya PCB has witnessed a surge in rush orders for BT substrates needed to process memory and other chip solutions for mobile smart devices and TV...
Monday 18 July 2022
Ennoconn eyeing 10% of Taiwan public cloud market by 2025
Taiwan-based IPC vendor Ennoconn, an affiliate of Foxconn Technology, is set to develop cloud-ground integration services as a new business line and will launch ESG+ Edge AI cloud...
Monday 29 November 2021
IPC makers see record order visibility, may suffer from component shortage
Taiwan's industrial PC (IPC) makers, including Advantech, Ennoconn, DFI, Axiomtek and Adlink Technology, all see record order visibility thanks to strong order placements from clients...
Wednesday 25 January 2017
US fab tool book-to-bill ratio rises to 7-month high
The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment came to 1.06 in December 2016, the highest in seven months, compared with 0.96 in the prior month and 1.00...
Friday 16 December 2016
NA semiconductor equipment industry posts November book-to-bill ratio of 0.96, says SEMI
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.96 in November 2016, compared with 0.91 in the prior month and 0.96 a year ago, according...
Wednesday 23 November 2016
US fab tool book-to-bill ratio slips below parity
The SEMI book-to-bill ratio for US manufacturers of semiconductor equipment slid to 0.91 in October 2016 after having stayed above parity for 10 straight months.
Tuesday 22 November 2016
Japan chip gear orders rise 7% in October, says SEAJ
Japan-based semiconductor equipment manufacturers posted JPY139.3 billion (US$1.3 billion) in orders in October 2016 (three-month average basis), up 7.3% from JPY129.85 billion in...
Monday 24 October 2016
North American semiconductor equipment industry posts September book-to-bill ratio of 1.05
North America-based semiconductor equipment manufacturers posted US$1.60 billion in orders worldwide in September 2016 (three-month average basis) and a book-to-bill ratio of 1.05,...
Monday 19 September 2016
US fab-tool book-to-bill ratio stays above parity, says SEMI
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.03 in August 2016, having been above parity for nine months in a row, according to the...
Wednesday 24 August 2016
US fab-tool book-to-bill ratio rises, says SEMI
North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.15 in July 2016, having been above parity for eight months in a row, according to the...
Monday 20 June 2016
North American semiconductor equipment industry posts May 2016 book-to-bill ratio of 1.09, says SEMI
The book-to-bill ratio for the North America semiconductor equipment industry stayed above parity for the sixth consecutive month in May 2016, according to industry association SEM...
Monday 25 April 2016
North American semiconductor equipment industry posts March 2016 book-to-bill ratio of 1.15
North America-based manufacturers of semiconductor equipment posted US$1.38 billion in orders worldwide in March 2016 (three-month average basis) and a book-to-bill ratio of 1.15,...
Friday 18 March 2016
North American semiconductor equipment industry posts February 2016 book-to-bill ratio of 1.05, says SEMI
North America-based manufacturers of semiconductor equipment posted US$1.26 billion in orders worldwide in February 2016 (three-month average basis) and a book-to-bill ratio of 1.05,...
Colder Products Company
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research