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Monday 5 November 2012
Samsung reportedly delays new logic fab construction
Samsung Electronics is likely to put off the construction of a new logic fabrication facility dubbed Line-17, due to the possibility of losing a portion of orders for Apple's next-generation...
Monday 22 October 2012
Korean DRAM firms gearing up for 20nm
Samsung Electronics and SK Hynix have both stepped up efforts to migrate to 20nm process technology, which is expected to become their mainstream production node for DRAM memory in...
Tuesday 2 October 2012
Globalfoundries 28/32nm foundry capacity hits as high as 80,000 wafers
Globalfoundries' combined capacity for 28/32nm chips has climbed to 60,000-80,000 wafers a month, according to Michael Noonen, the foundry's executive VP for marketing and sales.
Wednesday 19 September 2012
SK Hynix develops 20nm 4Gb GDDR3
SK Hynix has developed 20nm-class 4Gb graphics DDR3 DRAM, designed specifically for notebooks requiring low-power consumption.
Thursday 12 July 2012
TSMC touting next-generation 20nm process in the US
TSMC's sales representatives and its design service team, as well as a group of technical support staff from its IC design subsidiary Global Unichip, have been stationed in the US...
Wednesday 4 July 2012
Samsung sampling 16GB DDR4 modules for servers
Samsung Electronics recently announced that the company has begun sampling the industry's first 16GB DDR4 RDIMMs, designed for use in enterprise server systems.
Monday 2 July 2012
UMC signs license deal with IBM to develop 20nm chips
United Microelectronics (UMC) announced recently that the company has signed a license agreement with IBM to expedite the development of its 20nm CMOS process with FinFET 3D transi...
Thursday 19 April 2012
20nm process to take off in 2013, says Cadence executive
The semiconductor industry will accelerate towards the adoption of 28nm process in 2012, and begin its transition to the next technology node in 2013, according to Chi-Ping Hsu, a...
Tuesday 17 April 2012
Xilinx collaboration with TSMC said to extend to 20nm
The successful roll-out of Xilinx devices on 28nm at TSMC has encouraged the FPGA design firm to utilize TSMC's 20nm technology for its next-generation products, with the tape-out...
Tuesday 10 April 2012
TSMC to revise 2012 capex, says Chang
Taiwan Semiconductor Manufacturing Company (TSMC) will announce its revised capex budget for 2012 at its upcoming investors meeting on April 26, according to company chairman and...
Monday 9 April 2012
TSMC begins further expansion of Fab 14
TSMC on April 9 held a groundbreaking ceremony at the South Taiwan Science Park in Tainan for Phase 5 of its Fab 14 Gigafab. Following TSMC's Fab 12 Phase 6 in Hsinchu, this facility...
Friday 9 December 2011
TSMC breaks ground for new facility equipped for 20nm and below
Taiwan Semiconductor Manufacturing Company (TSMC) on December 9 held a groundbreaking ceremony for the Phase 3 facility at Fab 15 in Taichung, central Taiwan, and also revealed that...
Thursday 8 December 2011
Samsung seeking approval to build chip plant in China
Samsung Electronics has issued a statement disclosing plans to set up a flash memory chip plant in China.
Wednesday 7 December 2011
Micron, Intel unveil 20nm 128Gb NAND flash
Intel and Micron Technology have jointly announced a 20nm, 128Gb multilevel-cell (MLC) NAND falsh device. The companies also announced mass production of their 20nm 64Gb NAND.
Friday 18 November 2011
ARM builds new R&D center in Taiwan
ARM has announced the opening of a new R&D center at the Hsinchu Science Park, northern Taiwan. The focus of the center will be physical IP development and processor implementation...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research