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Tuesday 18 August 2020
Samsung announces silicon-proven 3D IC technology
Samsung Electronics has announced the immediate availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for today's most advanced process nodes.
Wednesday 12 August 2020
China smartphone AP shipments, 2Q 2020

Introduction

Tuesday 11 August 2020
Backend demand for consumer logic chips picking up
Taiwan-based IC backend houses including ASE Technology and Powertech Technology (PTI) have seen orders placed by game console and other consumer electronics vendors ramp up since...
Wednesday 29 July 2020
Semiconductor packaging materials to see 3.4% CAGR during 2019-2024
The global semiconductor packaging materials market will expand from US$17.6 billion in revenue logged in 2019 to US$20.8 billion in 2024, a 3.4% compound annual growth rate (CAGR),...
Wednesday 29 July 2020
Elan optimistic about shipments for Chromebook in 3Q20
Fabless chipmaker Elan Microelectronics, which specializes in touchscreen controller chips and fingerprint sensors, expects robust shipments for Chromebook to boost its revenue in...
Monday 27 July 2020
Faraday sees profits surge 265% in 2Q20
Faraday Technology, a fabless ASIC service and silicon IP provider, has announced net profits jumped 265% sequentially to NT$143 million (US$4.86 million) in the second quarter of...
Wednesday 8 July 2020
Macronix, Pixart post revenue growth in June
Memory chipmaker Macronix International and image sensor specialist Pixart Imaging, with both reportedly in the supply chain for Nintendo's Switch, saw their June revenues grow.
Tuesday 7 July 2020
Major Taiwan fabless firms strive for more foundry support
Taiwan's first-tier IC design houses, such as MediaTek, have demanded more capacity support from their foundry partners recently, according to industry sources.
Monday 6 July 2020
ITRI transfers memory technologies to Taiwan chipmakers
Taiwan's Industrial Technology Research Institute (ITRI) has been engaged in the development of next-generation non-volatile memory technologies, such as ferroelectric RAM (FRAM)...
Monday 29 June 2020
Taiwan edges South Korea as largest base for IC wafer capacity, says IC Insights
As of December 2019, Taiwan led the world in wafer capacity with about 22% of worldwide capacity installed in the country, according to IC Insights. Taiwan surpassed South Korea in...
Wednesday 24 June 2020
Top-10 semiconductor suppliers defy weak market conditions in 1Q20
Defying a decline in market revenue, the world's top-10 semiconductor suppliers managed to generate revenue growth of 2.1% in the first quarter of 2020, as they benefitted from a...
Monday 8 June 2020
ASRock, ASMedia to see strong sales from server sector in 2020
Motherboard maker ASRock and ASMedia Technology, a fabless chipmaker specializing in high-speed transmission chips, are both expected to enjoy a substantial ramp-up in orders for...
Friday 29 May 2020
Taiwan analog IC firms to post revenue growth in 2020
Taiwan-based analog IC suppliers, pinpointed as among the beneficiaries of US-China trade tensions, are expected to post impressive revenue results for 2020 despite coronavirus headwinds,...
Thursday 21 May 2020
China smartphone AP shipments, 1Q 2020

Introduction

Tuesday 19 May 2020
TSMC braces for impact of new US restrictions on Huawei
TSMC already took 7nm and 5nm chip orders from Huawei in advance before stopping taking more orders from the China-based client in the wake of the US government's announcement of...
megawin
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research