The world's top-3 memory chipmakers are likely to reduce their NAND flash memory capex in 2024, following two years of robust spending, according to industry sources.
The Japanese government is taking significant steps to support Rapidus in its efforts to become a global leader in semiconductor manufacturing. This includes providing financial support,...
Samsung Electronics is aggressively targeting Compute Express Link (CXL), a highly anticipated next-generation memory technology. The CXL market is expected to take off in the second...
Chinese foundries have prioritized orders from domestic customers, resulting in limited availability of fab capacity for others particularly Taiwan-based ones targeting the Chinese...
More information has been leaked about MediaTek's Dimensity 9300+ processor, which is expected to power Samsung Electronics' next-generation flagship tablet, the Galaxy Tab S10, according...
Although China is still a long way from meeting international standards in the field of semiconductor equipment, it is entirely feasible for the country to achieve technologically...
The semiconductor industry, traditionally operating at the nanometer scale, is now pushing the boundary toward the even tinier "angstrom" scale (one-tenth of a nanometer) with an...
In a forum hosted by the Korean Chamber of Commerce and Industry (KCCI) in Keiju, KCCI Chairman and SK Group chairman Chey Tae-won told participants that Nvidia's dominance in the...
According to data from the Kyushu Bureau of Economy, Trade, and Industry, from April 2021 to June 2024, there have been 100 new semiconductor-related investments announced or reported,...
A high official of the US Agency for International Development (USAID) has recently urged Mexico to significantly increase investment in its semiconductor industry over the next two...
Nexchip is expanding into photomask production, aiming to achieve mass production by the fourth quarter. This move positions Nexchip as a full-service foundry, similar to TSMC and...
AMD has postponed the Ryzen 9000 series launch due to quality issues found in initial production units. The company is replacing affected chips and has confirmed a packaging, not...
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
Due to the AI-driven surge in demand for semiconductor equipment, KLA reported better-than-expected financial results. The company expects to benefit from investments in advanced...
