Inspur, a Chinese server manufacturer, recently denied a Reuters report, stating it has no collaboration with Nvidia on designing a B20 AI chip based on the Blackwell architecture...
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...
With Taiwan Semiconductor Manufacturing Company (TSMC) chairman C. C. Wei promising to carry through overseas expansion plans regardless of the next US President, those securing TSMC's...
On July 21, US President Joe Biden announced that he would not seek re-election, a decision that adds new variables to the semiconductor and electronic manufacturing supply chain...
Although initial demand for HPC and AI smartphone chips is expected to remain strong as the traditional peak season approaches, recent observations indicate potentially lower-than-expected...
The prime season for the stocking of new products is rapidly approaching, and the outlook for Taiwan's export orders is optimistic, market sources believe.
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
China has intensified its pursuit of IC self-sufficiency, but efforts differ for automotive microcontroller units (MCUs) and MOSFETs, according to industry sources.
NXP reported that its performance was affected by its customers' inventory management practices. Despite this, the company expressed strong confidence in its joint venture with Taiwan-based...
Texas Instruments (TI) provided financial guidance that is slightly lower than expectations. The company's capital expenditure (Capex) plan is progressing smoothly, indicating significant...
The shortage of talent in the semiconductor industry is no longer news. Still, the continuous growth in demand for advanced packaging has triggered a mid-to-long-term scarcity of...
Glass substrates are recognized as critical materials for next-generation advanced semiconductor packaging technologies needed to support the explosive growth of AI chips.
TSMC has witnessed an increase in orders from Chinese customers seeking super hot runs (SHR), for which they are willing to pay a 40% premium, according to industry sources.
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
As Japan prepares to import its first-ever EUV lithography systems, ASML, the sole technology provider, plans to boost its local workforce significantly.
