The current adoption rate of QLC NAND SSD in PCs is approximately 20-25%, and this rate is expected to expand dramatically in 2024, according to Micron Technology. The primary use...
Synopsys has disclosed extensive EDA and IP collaboration with TSMC for advanced node designs, which have been used in a wide range of AI, high-performance computing, and mobile applications...
ASE Technology Holding (ASEH) expects its core IC Assembly, Testing, and Material (ATM) business to see sequential revenue growth in the second quarter of 2024.
Horizon Robotics has showcased its next-generation automotive processor, the Journey 6 series, which will power BYD's forthcoming New Energy Vehicles (NEV).
Qualcomm has just announced the Snapdragon X Plus, its latest PC processor. According to available specs, the new processor is identical to the earlier Snapdragon X Elite, but with...
The US Department of Commerce and Micron Technology have signed a non-binding Preliminary Memorandum of Terms (PMT) to provide up to US$6.14 billion in direct funding under the CHIPS...
At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...
SK Hynix has announced plans to expand production capacity for next-generation DRAM, including HBM, a critical component of AI infrastructure. This decision is in response to the...
As the US-China technology war enters its seventh year, with the process of domestic substitution policy of China's semiconductor industry continuing to deepen, China's local Electronic...
The continuous surge in generative AI applications is driving strong demand for High Bandwidth Memory (HBM), significantly benefiting Japanese suppliers of materials and equipment...
AI Expo Taiwan 2024 was opened on April 24, with more than 20,000 people visiting the event on the first day. Jack Sun, who retired as the Chief Technology Officer (CTO) of TSMC and...
