The second half of the year is typically a peak season for substrates. Despite market volatility, strong demand for AI continues to drive the global integrated circuit (IC) substrate...
Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the...
Apple has disclosed its supplier list for fiscal year 2023. Nan Ya PCB, the second-largest provider of IC substrates, re-entered the supply chain after an extended absence.
China's annual Two Sessions meeting of the National People's Congress (NPC) and the Chinese People's Political Consultative Conference (CPPCC) began on March 4. According to a report...
China's National People's Congress (NPC) and Chinese People's Political Consultative Conference (CPPCC) started their respective annual meetings during the weekend. Local automotive...
Taiwan-based IC substrate suppliers Unimicron Technology, Nan Ya Printed Circuit Board (NPC) and Kinsus Interconnect Technology all ended the first half of 2020 with double-digit...
Nan Ya PCB returned to profitability in 2019, thanks to strong shipments of its high-end ABF substrates and an influx of new orders for SiP substrates.
The supply of ABF (ajinomoto build-up film) substrates is unlikely to expand substantially in 2019, as most suppliers intend to be cautious about expanding capacity, according to...
IC substrate suppliers Kinsus Interconnect Technology and Nanya PCB have reported on-year declines in consolidated revenues for November 2016 of 7.1% and 0.5%, respectively.
Nanya Printed Circuit Board (NPC) has reported net profits of NT$433 million (US$13.24 million) for the third quarter of 2015, reversing from a net loss of NT$32 million recorded...
A number of supply chains in Taiwan, including those for touch panels, system assembly, NFC chips, wireless charging and flexible PCBs, are to benefit from the release Apple Watch...
Major Taiwan-based IC substrate suppliers are set to post strong revenue growth in the second half of 2014 in line with booming sales at wafer foundry houses and IC backend service...
IC substrate makers Kinsus Interconnect Technology, Unimicron Technology and Nanya PCB all plan to ramp up their production capacity for flip-chip chip scale package (FC CSP) substrates...
Nan Ya PCB (NPC) will invest most of its targeted capex of NT$2 billion (US$67 million) on FC CSP (chip scale package) substrates in 2013, acknowledging brisk demand coming from the...
Nanya PCB expects its sales to stay flat in the second quarter of 2013 after revenues dropped 10.1% sequentially and 13.1% on year to NT$6.54 billion (US$219.04 million) in the first...
