AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging...
Samsung Display (SDC) has disclosed plans to invest KRW4.1 trillion (US$3.1 billion) in building 8.6G IT-use OLED panel production lines by 2026, but tight supply of the core evaporation...
While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts...
Japan is set to officially tighten export controls on 23 semiconductor equipment items to China, starting in July, following the US-led containment against Chinese semiconductor industry...
Japan-based chip equipment maker Ulvac has announced an investment project for a new technology R&D site. The site will be located in South Korea to satisfy client demand.
Japanese semiconductor equipment suppliers Canon, Ulvac, Advantest, and material maker Sumitomo Bakelite are accelerating the R&D of back-end process products. Rapidus, a chip...
Innolux has spent NT$1.49 billion (US$45.91 million) to acquire manufacturing equipment from Ulvac and Applied Materials South East Asia, according to a company post on the Taiwan...
AUO has spent NT$1.57 billion (US$48.39 million) to acquire equipment for manufacturing LCD displays from Screen Finetech Solutions and ULVAC, according to a company filing with the...
Japan-based semiconductor equipment suppliers gained share against US manufacturers in 2011 despite a weak Japanese Yen, The Information Network has observed.
Japan-based Ulvac Technologies will soon offer turnkey equipment for making micromorphous silicon (micro-Si) tandem-junction thin-film photovoltaic (PV) modules at an energy conversion...
