It is unlikely to see 450mm (18-inch) wafer fabrication technology become mature over the next three years, according to Applied Materials CEO Gary Dickerson. The chipmaking industry's...
A special panel of the Environmental Protection Administration (EPA) has approved the environmental impact assessment for a piece of land designated for construction of an 18-inch...
The arrival of the era of 18-inch wafer foundry processes may not come until 2018 as Intel reportedly has slowed down the development of 18-inch wafers, while semiconductor equipment...
ASML's new EUV system, the NXE:3300B, has obtained 18 orders. In order to meet customer demand, the lithography tool vendor is looking to boost its production capacity for EUV tool...
Nikon has announced that the company will provide the Research Foundation for the State University of New York with a 450mm wafer ArF immersion scanner, with shipment scheduled in...
Taiwan Semiconductor Manufacturing Company (TSMC) has reiterated plans to build its first 450mm (18-inch) pilot production lines, which will offer FinFET transistor technology at...
Foundry chipmaker Taiwan Semiconductor Manufacturing Company (TSMC) will hold its annual supply chain management forum for 2012 on December 14. Participants will include Eric Meurice,...
Intel CTO Justin Rattner on December 4 said that Intel's development of 14nm technology is on schedule with volume production to kick off in one to two years and development of 18-inch...
Revenues at IC front-end tool supplier Gudeng Precision Industrial are likely to register another sequential increase in the fourth quarter of 2012, after climbing to record high...
Taiwan Semiconductor Manufacturing Company (TSMC) has bought a land lot of 14.32 hectares in the Chunan base of Hsinchu Science Park (HSP) for NT$3.2 billion (US$109.1 million), and...
Taiwan Semiconductor Manufacturing Company (TSMC) is on track in the development of 18-inch (450mm) wafers with the possibility to build a pilot line in 2016-2017 followed by mass...
Despite having investment from Intel, TSMC and Samsung Electronics, the 18-inch wafer generation anticipated by ASML may be delayed from 2016 to 2018. In addition, non-ASML equipment...
TSMC on August 5 announced that the firm has joined ASML's customer co-investment program, aimed at accelerating the development and industrialization of key next-generation semiconductor...
Taiwan's Council for Economic Planning and Development (CEPD) has approved a project to assist Taiwan Semiconductor Manufacturing Company (TSMC) to construct an 18-inch wafer fab...
