Nan Ya PCB has disclosed plans to spend at least NT$8 billion (US$287.5 million) in 2021, compared to a capex of NT$7.35 billion for 2020, for capacity expansions at its plants in...
With its advantages in edge computing and mobile device applications, Arm has been expanding its server solution offerings, heading towards high performance computing instead of staying...
Prices for MOSFET chips are set to rise significantly in the months ahead thanks to worsening shortages arising from persistently tight 8-inch foundry capacity and rapid increases...
Taiwan-based motherboard and graphics card makers are poised to enjoy a particularly strong first half of 2021, as demand propelled by coronavirus-induced stay-at-home activities...
ABF substrate prices are likely to rise later in the first half of 2021, driven by rebounding demand for crypto mining chips and a sharp rise in demand for server applications starting...
IC substrate supplier Kinsus Interconnect Technology swung to net profit of NT$541 million (US$19.3 million) in 2020 from loss of NT$2.025 billion a year earlier, mainly driven by...
Backend houses including Taiwan's ASE Technology and China's Tongfu Microelectronics have seen the visibility of orders for packaging AMD's processors extended to mid third-quarter...
Taiwan-based IC substrate providers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen the visibility of orders for ABF substrates extend to second-half...
Nvidia and Qualcomm reportedly have already reached agreements with TSMC for capacity support from its next-generation manufacturing processes, and with orders from Intel, Apple and...
Downstream clients have neither registered overly-high inventory levels for high-end PCB products nor overbooked capacity at PCB makers, as they are still striving to satisfy strong...
Strong demand for notebooks driven by the stay-at-home economy in the wake of the coronavirus outbreak has undermined shipments of conventional desktops, but sales in the PC DIY market...
Demand for highly-customized IC sockets will sustain growth momentum in 2021 along with increasing application of SiP (system in package) technology to heterogeneous chips integration,...
As Intel and AMD are expected to release their next-generation server CPUs in the first quarter of 2021, US- and Europe-based datacenter operators have accelerated their paces in...
