Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...
Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...
AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...
Combined revenues of Taiwan's top-3 foundries - Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) - are...
China-based AI chip startup Cambricon Technologies has newly raised US$100 million in series A round funding to support its development of advanced AI chips, which is expected to...
Leading notebook vendors, such as Taiwan's Asustek Computer and Acer, and many other international brands, will roll out their new 2-in-1 and ultra-thin notebook models utilizing...
China is proceeding with systematic deployments in 14nm semiconductor fabrication equipment, process, packaging and materials, which will be fully industrialized in 2018. And the...
Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...
Dialog Semiconductor is looking to extend its partnership with Spreadtrum Communication, and does not rule out forming a joint venture with the China-based mobile SoC provider, said...
Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...
With Qualcomm lowering prices for its Snapdragon 450 chips to less than US$10.50, MediaTek is under pressure to cut prices for its upcoming Helio P23 series designed for mid-range...
EDA vendor Synopsys has introduced its complete DesignWare high bandwidth memory-2 (known as HBM2) IP solution consisting of controller, PHY and verification IP, enabling designers...
United Microelectronics (UMC) is looking to expand its 28nm process offering by launching 28nm HPC and 28nm HPC Plus nodes, which will become available in 2018. The foundry also plans...
