Cadence Design Systems has announced the delivery of the new Virtuoso advanced-node platform that is enabled for all 10nm FinFET designs. This next-generation custom design platform...

Globalfoundries plans to develop 10nm process technology in-house instead of relying on licensing from Samsung, according to industry sources.

Foundry chipmaker TSMC has been actively pursuing 16nm FinFET chip orders in order to gain a majority of market share in the FinFET segment starting 2016, according to market sourc...

Applied Materials has unveiled the Applied Olympia ALD (atomic layer deposition) system featuring a modular architecture that delivers high-performance ALD technology to manufacturers...

TSMC has reiterated plans to move 10nm FinFET technology to risk production at the end of 2016, followed by mass production in the first quarter of 2017.

Globalfoundries has completed its acquisition of IBM's microelectronics business, according to the foundry chipmaker.

Imagination Technologies has announced the company will work with TSMC to develop a series of advanced IP subsystems for the Internet of Things (IoT) to accelerate time to market...

Cadence Design Systems has announced that it is collaborating with TSMC on the development of an Internet of Things (IoT) IP subsystem demonstration platform for TSMC's ultra-low...

TSMC is set to move its 16nm FinFET Plus (16FF+) process to commercial production in the second half of 2015, and plans to introduce a compact version of the 16FF+ process in early...

TSMC is confident that the company will beat Samsung Electronics in ramping up production on its 10nm lines, according to the Taiwan-based foundry.

Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to establish a 10nm pilot line at its 12-inch wafer plant in Hsinchu (Fab 12), northern Taiwan, in June, according to...

Applied Materials has announced its Applied Endura Cirrus HTX PVD (physical vapor deposition) system with breakthrough technology for patterning copper interconnects at 10nm and beyond...

Applied Materials has announced the Applied Centura Tetra Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple...

Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for a new fab at its 12-inch wafer plant in central Taiwan in June 2015. The fab is designed to manufacture chips...

Cadence Design Systems has announced that its digital and custom/analog tools have achieved certification from TSMC for its most-current version of 10nm FinFET Design Rule Manual...