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Monday 16 February 2015
Global Unichip expects 1Q15 sales to grow on-quarter
Global Unichip, an IC design service provider partnering with Taiwan Semiconductor Manufacturing Company (TSMC), expects to report a sequential increase in first-quarter revenues...
Monday 9 February 2015
TSMC set to step up investment in central Taiwan
Taiwan Semiconductor Manufacturing Company (TSMC) has disclosed plans to invest more than NT$500 billion (US$16 billion) in its manufacturing site at the Central Taiwan Science Park...
Tuesday 2 December 2014
HiSilicon expands adoption of Cadence tools and IP for advanced-node FinFET designs
Cadence Design Systems announced on December 1 that HiSilicon Technologies has signed an agreement to significantly expand its use of the Cadence digital and custom/analog flows for...
Thursday 13 February 2014
Intel to cut a deal with Apple for Fab 42?
With shipments of desktop and notebooks in the doldrums since 2010, Intel's PC processor business has been in decline. Meanwhile, AMD and others are taking aim at the Intel-dominated...
Thursday 13 June 2013
UMC to join IBM in 10nm process development
United Microelectronics (UMC) has announced that the company will join the IBM joint technology development alliance to participate in the group's development of 10nm CMOS process...
Monday 15 April 2013
Samsung mass producing 128Gb 3-bit MLC NAND flash
Samsung Electronics has begun mass producing a 128Gb, 3-bit multi-level-cell (MLC) NAND memory chip using 10nm-class process technology, according to the company. The new Samsung...
Friday 16 November 2012
Samsung intros 10nm eMMC NAND
Samsung Electronics has announced a next-generation 64GB embedded multimedia card (eMMC) using 10nm-class process technology. The new 64Gb NAND memory went into production late in...
Thursday 8 December 2011
Samsung seeking approval to build chip plant in China
Samsung Electronics has issued a statement disclosing plans to set up a flash memory chip plant in China.
Wednesday 7 December 2011
Materials and equipment pose challenges for 10nm semiconductor processes
While semiconductor manufacturing processes have been continually upgraded through die shrinks, the development of processes for 10nm and below is expected to face challenges related...
Friday 23 September 2011
Samsung new memory fab goes on line
Samsung Electronics has announced that its new memory semiconductor fabrication facility, Line-16, at its Nano City Complex in Hwaseong, Gyeonggi Province, has commenced operations...
Friday 25 June 2010
TSMC 2010 capex may exceed planned US$4.8 billion, says chairman
Capex spending has been gaining momentum at Taiwan Semiconductor Manufacturing Company (TSMC) recently, and total spending may surpass the company's budget of US$4.8 billion projected...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research