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Wednesday 16 July 2025
Broadcom launches Tomahawk Ultra AI networking chip built on TSMC's 5nm process to challenge Nvidia
Broadcom has launched its latest Tomahawk Ultra Ethernet switch chip, fabricated using TSMC's 5nm process, targeting high-performance AI infrastructure with a design aimed squarely...
Wednesday 16 July 2025
Penang's OSAT boom: ASE, Tongfu, Inari lead charge in advanced packaging
Malaysia has steadily developed its outsourced semiconductor assembly and testing (OSAT) industry, with Penang — often called the "Silicon Valley of the East" — at its...
Tuesday 15 July 2025
Broadcom's plant investment in Spain reportedly canceled, dealing blow to Southern Europe's chip ambitions
Broadcom has reportedly scrapped its plan to invest US$1 billion in an assembly, test, and packaging (ATP) facility in Spain. Reuters and Europa Press cited insiders...
Wednesday 9 July 2025
MediaTek and Realtek go head-to-head in Ethernet chips battleground
High-end Ethernet chips continue to advance, while mid-range chips have expanded into broader applications. Particularly, automotive Ethernet is seeing a significant rise in adoption...
Friday 4 July 2025
OpenAI's chip strategy remains unclear as demand for customized functions stays vague
Amid speculation about its chip strategy, OpenAI has denied plans for large-scale use of Google's TPUs, saying it is only experimenting. The company aims to develop its own chips,...
Saturday 28 June 2025
Marvell bets big on custom AI chips to challenge Broadcom's lead

While Broadcom remains a dominant force in the AI ASIC market, Marvell Technology is working hard to catch up, much like AMD's continued...

Monday 23 June 2025
SK Hynix reportedly clinches custom AI memory orders from Nvidia, Microsoft, Broadcom
SK Hynix has reportedly secured customized high-bandwidth memory (HBM) orders from Nvidia, Microsoft, and Broadcom, pulling ahead of domestic rival Samsung Electronics in the race...
Thursday 19 June 2025
New front opens in CPO, SiPh race: TSMC and Taiwanese supply chain in the lead
Surging demand for AI compute is driving global investment in GPUs, ASICs, and next-generation datacenter infrastructure. As conventional electronic interconnects fall short of meeting...
Wednesday 18 June 2025
PCL fast-tracks CPO production as US cloud giants pushing AI infrastructure
PCL Technologies has secured a significant laser optical packaging order from Broadcom for its next-generation data center switch chips, signaling a milestone in the commercial rollout...
Saturday 14 June 2025
Broadcom's AI chip sales hit 52%, with SoftBank and OpenAI on deck

Broadcom is emerging as a key supplier in the artificial intelligence (AI) supply chain, with revenue from AI-related chips now comprising...

Sunday 8 June 2025
Cloud ASIC market gains momentum as AI demand soars
The cloud application-specific integrated circuit (ASIC) market continues to gather steam as both the US and Taiwanese semiconductor players ramp up investments and innovation to...
Friday 6 June 2025
Broadcom reports strong earnings growth on robust AI-driven demand and VMWare boost
Broadcom reported a 20.2% year-over-year revenue jump to a record US$15 billion in the second quarter of fiscal 2025, driven by surging demand for AI chips and strong contributions...
Friday 6 June 2025
Broadcom sees sustained AI momentum, eyes continued growth through fiscal 2026
Broadcom delivered a strong second-quarter performance for fiscal 2025, with AI-driven growth continuing to dominate the company's outlook. In the earnings call, President and CEO...
Tuesday 20 May 2025
Broadcom unveils third-gen CPO technology to power AI's next leap

Semiconductor giant Broadcom has introduced the third generation of its co-packaged optics (CPO) technology, significantly advancing...

Tuesday 20 May 2025
Nvidia courts ASIC allies with NVLink Fusion, so why is Broadcom still saying no?
At this year's COMPUTEX keynote, Nvidia CEO Jensen Huang unveiled NVLink Fusion, a new initiative to open the company's proprietary NVLink interconnect to third-party ASICs and CPUs...