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Thursday 27 August 2026
AMD, Broadcom book most of Powertech's FOPLP capacity ahead of 2027 ramp
Powertech Technology (PTI) is preparing to move its fan-out panel-level packaging (FOPLP) technology into mass production by mid-2027. AMD and Broadcom are backing demand, and most...
Wednesday 26 August 2026
Google's TPU v10 turns multi-vendor, deepening MediaTek's ASIC role
Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...
Tuesday 25 August 2026
Anthropic bets on in-house chips, reshaping ASIC orders
Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware...
Tuesday 25 August 2026
Broadcom's debt push signals AI compute is becoming Wall Street asset class
The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly...
Friday 21 August 2026
Broadcom reportedly eyes up to US$100B debt financing to expand AI chip push
Broadcom is in talks with asset managers to raise more than US$60 billion in debt financing, with the potential package reaching as much as US$100 billion, as the chipmaker moves to...
Friday 21 August 2026
Google, Marvell long-term deal keeps Broadcom at bay, limits MediaTek impact

Marvell filed a Form 8-K with the US Securities and Exchange Commission on August 19, 2026, revealing that it signed a commercial agreement...

Thursday 20 August 2026
Analysis: Google keeps Sunfish at Broadcom, Zebrafish at MediaTek — Marvell's US$12.2bn warrant buys a category nobody was defending

One word in Marvell Technology's August 19 filing decides how the Google agreement should be read. The custom silicon programs, it says,...

Wednesday 19 August 2026
Tech giants' AI commitments reach US$3 trillion beyond balance sheets
Alphabet, Meta, Amazon, Microsoft and other major technology companies have accumulated as much as US$3 trillion in off-balance-sheet commitments tied to AI infrastructure, according...
Wednesday 19 August 2026
Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek

Market speculation that AMD is working with Google on technology for its v10-generation tensor processing unit (TPU) has prompted questions...

Tuesday 18 August 2026
Nvidia vs Broadcom: Dueling AI financing bets, Contrasting risks

Nvidia has unveiled a US$500 billion artificial intelligence (AI) compute financing plan with six Wall Street giants—Goldman...

Tuesday 18 August 2026
MediaTek widens ASIC services as market share surges

MediaTek has reportedly landed major orders for Google TPU products in recent years, even appearing to challenge Broadcom's position...

Thursday 13 August 2026
Synopsys pushes into system design as Nvidia, AMD and Broadcom move up the stack
Nvidia, AMD and Broadcom are moving beyond chip-level design into subsystems and complete systems, a shift that is increasing the need to account for thermal, electrical, mechanical...
Wednesday 12 August 2026
OCP APAC 2026: Nvidia, Broadcom diverge on how to scale AI networks beyond the rack
Nvidia and Broadcom outlined different paths for scaling AI networks at the OCP APAC Summit in Taipei on Aug. 11, as clusters expand from rack-scale systems to entire data centers...
Friday 31 July 2026
Powertech bets on AMD FOPLP mass production in 2027
Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to...
Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...