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Friday 31 July 2026
Powertech bets on AMD FOPLP mass production in 2027
Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to...
Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...

Thursday 30 July 2026
Samsung foundry to double 2nm design wins in 2026 on Broadcom talks; claims profit turnaround 'possible in near term'

Samsung Electronics' foundry business expects its 2nm project wins to more than double year-on-year in 2026, and the company is in...

Wednesday 29 July 2026
South Korea unveils US$950 billion AI partnerships with Nvidia, Samsung, SK Group
South Korea announced a US$950 billion package of AI cooperation initiatives in Silicon Valley on July 24, 2026, as President Lee Jae-Myung led a delegation of government and business...
Monday 27 July 2026
Samsung’s Broadcom AI chip pact expected to top US$200 billion as Hyundai expands robotics push

Samsung Electronics and Hyundai Motor Group used the San Francisco AI Summit to outline separate artificial intelligence (AI) expansion...

Friday 17 July 2026
Powertech and Broadcom expand AI ASIC push with US$400M Singapore FOPLP venture

Powertech Technology is deepening its panel-level packaging (FOPLP) strategy after its board approved a joint venture with Broadcom...

Thursday 16 July 2026
Groups urge EU interim measures against Broadcom amid VMware antitrust case

A European industry group, the Cloud Infrastructure Services Providers in Europe (CISPE), has joined four other trade organizations...

Monday 13 July 2026
Meta, MediaTek, TSMC push AI chips to challenge Google

Chip industry sources said Meta's cloud AI chip procurement could soon catch up with Google or Amazon AWS among the four major cloud...

Friday 10 July 2026
Apple's US$30 billion Broadcom deal puts its server-chip plans back in focus

Apple and Broadcom have extended their custom-chip partnership through 2031 under agreements expected to exceed US$30 billion, reinforcing...

Thursday 9 July 2026
Apple's Broadcom deal extension shows wireless independence remains a distant dream

Apple's decision to extend its wireless transmission and RF chip supply agreement with Broadcom through 2031 signals that its shift...

Thursday 9 July 2026
Apple's expanded US$30 billion Broadcom deal signals deeper bet on US chip strategy and domestic manufacturing
Apple's decision to commit more than US$30 billion to Broadcom over the next several years carries implications that reach well beyond a single procurement contract — potentially...
Tuesday 7 July 2026
Broadcom and Apple extend custom chip deal through 2031
Broadcom has extended its custom chip supply agreement with Apple through 2031, strengthening a key supplier tie that could shape wireless connectivity, AI infrastructure, and device...
Monday 29 June 2026
Qualcomm stirs AI data center competition with CPUs, ASICs, and accelerators
Qualcomm officially unveiled its Dragonfly data center platform at this week's annual investor day, laying out a four-pronged push into cloud AI that spans SerDes, PAM4 DSP, and other...
Thursday 25 June 2026
OpenAI debuts Broadcom-designed, TSMC-built inference chip as model makers diversify silicon
OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model...
Tuesday 16 June 2026
Nvidia reportedly tightens grip on AI inference market despite growing competition

Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible...