中文網
Taipei
Fri, Jun 18, 2021
14:40
mostly clear
34°C
CONNECT WITH US
NEWS TAGGED BROADCOM
Tuesday 1 June 2021
Chipmakers keen on developing Wi-Fi 7 chips
Chipmakers including Broadcom, Qualcomm and MediaTek have entered the early stages of developments for their respective Wi-Fi 7 (802.11be) chips, according to industry sources.
Tuesday 25 May 2021
Pure-play foundries expanding capacity with prepayments from clients
TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.
Monday 3 May 2021
TSMC ramping 28nm chip output despite cutback in orders from Sony
Despite weakened orders from Sony, TSMC still has been ramping up its 28nm chip output with plans to build additional production capacity at its Nanjing fab in China, according to...
Friday 23 April 2021
TSMC to expand capacity for 28nm process at China fab
TSMC's board of directors has approved a budget of about US$2.89 billion for installation of mature technology capacity, the pure-play foundry announced on April 22.
Monday 12 April 2021
Wi-Fi 6E chips to bring business for test, certification labs in 2H21
Chipmakers are set to roll out Wi-Fi 6E chip solutions in the second half of the year, bringing new business opportunities for IC test and certification labs including Sporton Inte...
Tuesday 16 March 2021
Networking chip supply getting tight
Some networking chip vendors, such as Broadcom, have extended their delivery lead times to as long as 50 weeks due to the tight supply of critical parts and components, heralding...
Tuesday 26 January 2021
ABF substrate suppliers see clear order visibility stretch into 2H21
Taiwan-based IC substrate providers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have seen the visibility of orders for ABF substrates extend to second-half...
Monday 18 January 2021
TSMC, UMC to see full capacity utilization for 28nm node through 3Q21
Both TSMC and UMC are expected to sustain full capacity utilization for 28nm manufacturing process at their 8-inch and 12-inch fabs throughout third-quarter 2021, with gross margins...
Wednesday 13 January 2021
III-V IC players enjoy high capacity utilization for 5G, Wi-Fi 6 applications
Taiwan's III-V IC firms including GaAs foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC) as well as epi-wafer suppliers Visual Photonics Epitaxy (VPEC) and Intelligent...
Thursday 31 December 2020
Development of 3nm process challenging TSMC, Samsung
TSMC and Samsung Electronics have both encountered different but critical bottlenecks in the development of their respective 3nm process technologies, according to industry sources...
Tuesday 17 November 2020
Components demand for iPhone 12 Pro series gaining momentum
Component shipment momentum for iPhone 12 series continues to strengthen, with order visibility for VCM (voice coil motor) components for iPhone 12 Pro and Pro Max models clear through...
Wednesday 4 November 2020
TSMC sees 28nm process capacity utilization ramp up
TSMC has seen capacity utilization rates for 28nm process technology surge and come to nearly 100% in the fourth quarter of 2020, thanks to the bulk of orders transferred by Qualcomm...
Monday 26 October 2020
TSMC may move 6th-gen CoWoS to production in 2023
TSMC continues to advance in CoWoS-S packaging adopting silicon interposer, with the prospect of entering volume production in 2023 for the sixth-generation of the technology that...
Friday 25 September 2020
TSMC to ramp up 3nm chip production starting 2H22
TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...
Thursday 24 September 2020
TSMC to open new packaging fabs in 2021-22 using 3D Fabric platform
TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly...