Qualcomm said Monday that it will continue to supply Apple with 5G modem chips through 2026, raising concerns about the progress of Apple's in-house developed 5G chip.
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
In spite of strong demand for chips thanks to the generative AI, Broadcom expects the semiconductor soft landing to continue, eclipsing other growth engines for the company.
GlobalFoundries has enhanced two of its technology platforms to enable critical applications for next-generation electric and autonomous vehicles, along with commitments from automotive...
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
Broadcom and Marvell continue to operate on extended delivery schedules, even though the chip shortage has largely been addressed. Despite the alleviation of the supply-demand imbalance...
With end-market devices accelerating incorporating Wi-Fi 7 capability into their products, chipmakers including Broadcom, Qualcomm and MediaTek are optimistic that the first wave...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
The European Commission approved Broadcom's acquisition deal of VMware with open access and interoperability conditions. VMware is still waiting for FTC's approval on its way to diversify...
TSMC is expected to see a significant revenue rebound in the second half of the year, which will be driven by not only the launch of new iPhones but also strong demand for AI chips...
Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Broadcom has announced sample availability of its second generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem, spanning Wi-Fi routers, residential gateways,...
TSMC has seen its capacity utilization rates for advanced processes below 7nm rebound slowly since June, and is poised to embrace a new wave of chip demand growth in 2024 as major...
