The existing competitive edge has prompted the birth of a semiconductor Innovation Zone in the city of Bromont, located in Quebec, Canada. World leaders like IBM, Teledyne DALSA,...
Ahead of SEMICON India, the Indian government approves a chipmaking facility proposed by Kaynes Semicon, which commits to setting up multiple chipmaking projects in more Indian sta...
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
Several Dutch companies showcased cutting-edge technologies at SEMICON Taiwan 2024, contributing to advancements in semiconductor manufacturing and data center infrastructure.
Two Indian startups, Silizium Circuits and Calligo Technologies, are making their mark at Semicon Taiwan 2024, as they seek to establish a foothold in the global semiconductor mark...
Under the theme of "3S Open Lab Platform," 3S will present its achievements and advancements at SEMICON Taiwan 2024, showcasing the unique capabilities of the 3S Open Lab Platform.
In today's fast-growing industry, the accuracy and stability of gas equipment are indispensable to semiconductor manufacturing. As an integrator in the gas field, Reliya Tech. has...
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding...
SEMICON Taiwan 2024, is set to take place on September 4, with over 200 industry leaders from the global high-tech and semiconductor sectors expected to attend.
SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes,...
Taiwan's machinery and electronics manufacturing sectors are rapidly integrating into a "mechatronics supply chain," with a dedicated "precision machinery zone" to be...
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...
Advanced packaging and testing technologies shined brightly at SEMICON Taiwan 2023 due to a focus on AI, HPC, and automotive chips. This included various showcases of new products...
