Rumors have risen that SK Hynix is accelerating the expansion of its 10nm-class sixth-generation 1c DRAM capacity. Previously, to concentrate on producing high-bandwidth memory (HBM),...

Samsung Electronics, with its sixth-generation high-bandwidth memory (HBM4), uses base dies produced by Samsung Foundry. As Samsung's HBM4 competitiveness rises, the market expects...

South Korean memory giant SK Hynix is fast-tracking the development of its next-generation 300-layer V10 NAND flash memory, according to reports in Korean media outlets Hankyung...

SK Hynix and battery subsidiaries within SK Group received approval for 68 core patents in China in November 2025. Many of these patents relate to highly integrated memory designs...

SK Hynix announced a comprehensive organizational restructuring to expand its global research network and reinforce its leadership in the high-bandwidth memory sector. The strategic...

SK Hynix has reportedly postponed the mass production timeline for its sixth-generation high bandwidth memory (HBM4) from the end of the second quarter of 2026 to the third quarter...

Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition**,** reallocating capacity toward DDR5 RDIMM modules and freeing up around...

Samsung Electronics and SK Hynix reportedly both plan to raise their DRAM production growth targets for 2026. Samsung is focusing on standard DRAM such as DDR5, LPDDR5X, and GDDR7,...

Samsung Electronics and SK Hynix, which control about 70% of the global DRAM market, signalled in recent IR meetings with global investment banks that they will not pursue aggressive...

Google's expanding investment in custom AI accelerators is reshaping the high-bandwidth memory market and lifting Samsung Electronics and SK Hynix as demand for tensor processing...

Samsung Electronics is undertaking one of its most significant internal restructurings in years as the company pushes to strengthen its artificial intelligence (AI) capabilities and...

At the upcoming International Solid-State Circuits Conference (ISSCC) 2026 in February, Samsung Electronics and SK Hynix are set to unveil significant advances in high-performance...

Media reports show that Google's Ironwood TPU is equipped with HBM3E from Samsung Electronics and SK Hynix. According to the Korea Economic Daily, Samsung supplied over 60%...

Samsung Electronics is reportedly nearing the final stage of qualification tests for its HBM4 memory chips with Nvidia, with a December decision that could mark one of the company's...