Siliconware Precision Industries (SPIL) with its 2.5D and fan-out packaging technology has cut into the supply chain of network processor vendor Marvell, according to industry sour...

AMD, Broadcom, Marvell, and Nvidia are among the largest consumers of TSMC's CoWoS (Chip-on-Wafer-on-Substrate) backend technology,

Taiwan-based Holtek Semiconductor has developed its first AI chip solution to tap smart living application opportunities and has also launched a spate of new MCU products for automotive,...

With the advent of the 5G era, artificial intelligence (AI) applications will be in full swing, prompting chipmakers to develop multiple xPU chips beyond Intel's CPU and Nvidia's...

Samsung Electronics has announced a successful network processor tape-out based on Samsung's 14LPP (Low-Power Plus) process technology in collaboration with eSilicon and Rambus. This...

Broadcom recently announced the industry's first 100Gbps full duplex network processor unit (NPU). Targeting the next wave of 100GbE switches and routers for service provider networks,...