STMicroelectronics (STM) is set to begin production at its new 8-inch silicon carbide (SiC) substrate plant in Chongqing, China, two months ahead of schedule.

Taiwan-Asia Semiconductor Corp. (TASC), a specialist in sensing and light-emitting devices, is significantly increasing its investment in the wide bandgap power semiconductor market...

Taiwan's Acme Electronics is anticipating flat or slightly declining demand for its silicon carbide (SiC) powders used in electric vehicles (EVs) during the second half of 2024. To...

Infineon inaugurated its new 8-inch SiC semiconductor plant in Kulim, Malaysia, on August 8.

Infineon has built a new plant in Kulim Hi-Tech Park, Malaysia, dedicated to generating 8-inch silicon carbide (SiC) wafers. Here are five major takeaways from the new facility's...

Taiwan-Asia Semiconductor Corporation (TASC) is actively boosting its silicon carbide (SiC) production capacity and is currently in talks to select a location for a new factory. If...

Infineon has a solid basis in SiC production technology capabilities and intends to mitigate potential market oversupply and other market headwinds by capitalizing on its superior...

Infineon Technologies is set to unveil a new silicon carbide (SiC) wafer fab at its plant site in Kulim, Malaysia, which aims to move from 6-inch to 8-inch production in 2025. Malaysia's...

Rohm reported a declining performance over the past quarter due to sluggish sales of industrial chips and increased depreciation and research costs related to expanding production...

Gallium Nitride (GaN) semiconductors, having made a strong debut with fast chargers for consumer electronics, are now finding fresh opportunities in AI servers, data centers, and...

SiC chip prices in China are expected to fall by as much as 30% in the next two years, according to industry sources.

Onsemi reported a decline in performance for the past quarter, attributing the downturn to short-term economic headwinds. Despite these challenges, the company remains confident in...

Infineon Technologies is working to maintain its leadership in the power semiconductor industry by implementing measured strategies for power semiconductors and wide-bandgap (WBG)...

As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...

L&T Semiconductor Tech, a subsidiary of Indian conglomerate Larsen & Toubro, plans to focus on semiconductor IC design in its initial phase, followed by the development of...