The silicon carbide (SiC) substrate market appears to be oversupplied, but it takes more than just comparing production capacity and actual demand to understand the real picture,...
The significant expansion of Chinese manufacturers' SiC substrate production capacity in 2024 has led to oversupply and a sharp decline in prices, rapidly expanding the applicable...
Luxshare Precision Industry, Apple's primary Chinese partner, has accelerated its capacity expansion in Vietnam by expanding its factory site in Nghe An, according to industry sour...
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
Prices of mainstream 6-inch SiC substrates have fallen since the beginning of this year and are expected to keep lowering as Chinese SiC substrate suppliers expand their production,...
The US and European semiconductor industries are seeing major investments, yet ASML CEO Christophe Fouquet noted that Asia's semiconductor production capacity is expanding more rapidly...
TikTok's parent company ByteDance has reportedly ordered 100,000 of Huawei's Ascend 910B chips in 2024 to train an AI model, with 30,000 already delivered. ByteDance has not commented...
William Liao, Senior Vice President, and Henry Chiang, spokesperson of TSEC, stated on October 3 that the solar module and cell production capacity in the US is currently only half...
As the second half of 2024 enters the peak sales season for consumer electronics, supply chains have gradually entered the peak season cycle starting from the third quarter. However,...
China's leading outsourced semiconductor assembly and test (OSAT) companies, such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics, are intensifying...
China is poised to take the lead in the global market for mature semiconductor manufacturing processes as it continues to expand its production capacity. Industry experts warn that...
The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...