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Thursday 5 October 2017
Low yield rates for 3D sensing modules to blame for smartphone shipment delays
Low yield rates during production for 3D sensing modules to be incorporated into Apple's iPhone X and other Android-based smartphone brands have forced major global vendors to postpone...
Monday 2 October 2017
VR headsets to drive near-term growth, but AR headsets to gain momentum by 2020, says IDC
IDC is forecasting the combined augmented reality (AR) and virtual reality (VR) headset market to reach 13.7 million units in 2017, growing to 81.2 million units by 2021 with a compound...
Tuesday 26 September 2017
Digitimes Research: Apple outraces Google for on-device AI development
Google has been regarded as the leading force for the development of artificial intelligence (AI) technology thanks to its AlphaGo AI computer program. While Google still holds the...
Monday 11 September 2017
Global AR/VR headset shipments maintain solid growth in 2Q17, says IDC
Global shipments of augmented reality (AR) and virtual reality (VR) headset shipments, excluding Google Cardboard and other Cardboard-like devices, grew 25.5% on year to 2.1 million...
Wednesday 6 September 2017
Competition in AI chip market heating up on full presence of global tech giants
Competition in the artificial intelligence (AI) chip market is heating up as nearly all major players in the IT industry have joined the race to develop AI chips and applications...
Tuesday 5 September 2017
Digitimes Research: Breakthroughs needed before AR glasses can replace smartphones
There is gradual awareness in the market that augmented reality (AR) glasses do have the potential to replace smartphones, as Microsoft's HoloLens AR glasses inventor Alex Kipman...
Thursday 31 August 2017
Advantest obtains ramp-up of orders for memory production
Semiconductor testing equipment supplier Advantest has landed a ramp-up of orders from Korea- and Taiwan-based memory chipmakers, according to CH Wu, chairman of Advantest Taiwan.
Wednesday 30 August 2017
Qualcomm, Himax jointly develop 3D depth sensing solution
Qualcomm and Himax Technologies have jointly announced a collaboration to accelerate the development and commercialization of a high-resolution, low-power active 3D depth sensing...
Monday 28 August 2017
Digitimes Research: Google aims to achieve virtual experiences through daily life applications
Google's development of AI/VR/AR products can be backdated to as early as the launch of Google Search as the service is using machine learning algorithms to search for needed information...
Wednesday 23 August 2017
Digitimes Research: AR players shift focus to platform products
Major players in the augmented reality (AR) industry have slowed down the development of consumer-end products, and instead have shifted their strategies to focus on developing AR...
Wednesday 16 August 2017
Dell stresses importance of digital transformation at technology forum
Dell on August 15 hosted Dell Technology Forum 2017 in Taipei, discussing the trend of digital transformation through explaining software-defined or cloud-like modern datacenters.
Thursday 6 July 2017
Intel, Qualcomm to compete fiercely in AR/VR and AI sectors
Intel and Qualcomm are expected to compete neck and neck in the VR/AR and AI sectors as the two companies have continued to enhance their deployments in these areas. With new applications...
Thursday 6 July 2017
Wireless charging demand promising: Q&A with Dialog CEO Jalal Bagherli
As a global leader in providing rapid charging solutions, Dialog Semiconductor has demonstrated its prowess in power management for smartphones and other applications. But the market...
Wednesday 28 June 2017
CMOS image sensor sales to reach another record high in 2017, says IC Insights
CMOS image sensor sales are on pace to reach a seventh straight record high in 2017, and nothing ahead should stop this semiconductor product category from breaking more annual records...
Wednesday 21 June 2017
Cooling module maker CCI starts production at new factory in China
Thermal module maker Chaung Choung Technology (CCI) is moving manufacturing equipment from a factory on lease in Chongqing, western China, to a newly constructed factory nearby. So...