CONNECT WITH US
NEWS TAGGED AI
Thursday 3 September 2026
Auras sees ASIC revenue reaching 50% in 2027, eyes microchannel cooling production in 2028
Cooling specialist Auras Technology is expanding from GPU platforms to ASIC-related products as its next growth driver, amid the ongoing shift toward liquid cooling in AI servers,...
Thursday 3 September 2026
Column: From automation to autonomy—what robotics still needs to make the leap
I visited Automation Taipei 2026 in mid-August, where the show looked lively and occupied a footprint 7% larger than in 2025. Physical AI and vision-language-action (VLA) models dominated...
Thursday 3 September 2026
SK Hynix wafer purchases jump 104% on AI demand
SK Hynix boosted its silicon wafer purchases in the second quarter of 2026 by more than doubling spending from the previous quarter as it moved early to secure raw materials amid rising...
Thursday 3 September 2026
Thailand AiPASS unlocks premium AI after lessons
Thailand has launched its TH-AI Passport and core AiPASS platform, taking a different path from South Korea's national AI push by buying access to overseas commercial AI tools such...
Thursday 3 September 2026
MiniMax, Z.ai revenues surge on API demand but adjusted losses widen
Two of China's first listed foundation-model developers are showing that demand for their technology can translate into rapidly growing revenue. Turning that demand into profit remains...
Thursday 3 September 2026
TIME AI 100 spotlights China's new AI guard, from Moonshot, Z.ai to AgiBot, Manus
TIME recently unveiled its 2026 list of the 100 most influential people in AI. Alongside leaders of major technology companies, the list includes a new generation of Chinese...
Thursday 3 September 2026
SEMICON Taiwan 2026: Physical AI drives new demand for multimodal robot sensing
The rise of physical AI is creating a new wave of demand for advanced sensors as robots move from controlled demonstrations toward practical deployment. Industry experts at SEMICON...
Thursday 3 September 2026
Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI
Microsoft brought the semiconductor industry's own measure of success back to it on Wednesday, and argued that AI will be judged by it.
Wednesday 2 September 2026
Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
Wednesday 2 September 2026
Lam Research exec says automated preventive maintenance key to fabs of the future
A senior Lam Research executive told an industry audience this week that the next major leap in semiconductor manufacturing will not come from removing humans entirely from fabs, but...
Wednesday 2 September 2026
DRAM giants target 3D stacking to break memory wall and power bottlenecks
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
Wednesday 2 September 2026
Semicon Taiwan 2026 to test cloud AI investment boom
Cloud AI capital expenditure continues to shatter market expectations, sparking growing concerns over whether the spending surge is overheating and heading toward a bubble. Semicon...
Wednesday 2 September 2026
Wonderful Hi-Tech expands Thailand, Vietnam capacity to capture emerging space data center, physical AI demand
Cable manufacturer Wonderful Hi-Tech announced its financial results for the second quarter and first half of 2026 during an earnings call held on September 1. A ramp-up in high-speed...
Wednesday 2 September 2026
World's first legged robot standard sets global benchmark for humanoids, robot dogs
China-led experts have released what CCTV described as the world's first international standard for legged robots, creating a common framework for evaluating humanoid robots,...
Wednesday 2 September 2026
Indium CEO: packaging, cooling and power are next AI bottlenecks
As AI and high-performance computing (HPC) continue to drive semiconductor advances, industry competition is shifting beyond chip performance toward packaging, cooling, assembly, and...