UMC announced on December 8, 2025, that it has signed a technology licensing agreement with Belgium-based Imec to acquire the Imec iSiPP300 silicon photonics (SiPh) process. This process supports co-packaged optics (CPO) compatibility, enabling UMC to launch a 12-inch SiPh platform targeting next-generation high-speed connectivity applications.

Samsung Electronics, fresh off completing sixth-generation HBM4 development, is reportedly accelerating DRAM capacity expansion in a renewed effort to reclaim leadership in AI memory.

The SEMICON Japan 2025 exhibition is set to take place in Tokyo from December 17 to 19, 2025, with Topco Scientific (TSC) and its Japanese subsidiary Shunkawa participating alongside nine semiconductor suppliers from Taiwan, the US, and Japan. Together, they will showcase critical materials and equipment covering semiconductor front-end processing, power modules, and advanced packaging, as well as integrated solutions for smart energy-saving monitoring systems.

Cica-Huntek Chemical Technology, a joint venture between Japan's Kanto Chemical and Huntek Systems, has entered the TSMC supply chain. The company has benefited from Kanto Chemical's long-standing cooperation with TSMC and its deep expertise in chemical supply systems, securing orders for TSMC's AP8 fab and its Kumamoto facility in Japan.

In the wake of multiple high-profile resignations at Apple Inc., Johny Srouji, the company's senior vice president of hardware technologies responsible for its in-house chip development, has reassured staff that he plans to stay with the firm for the foreseeable future. His statement came after reports suggested he was considering leaving.

Rumors have risen that SK Hynix is accelerating the expansion of its 10nm-class sixth-generation 1c DRAM capacity. Previously, to concentrate on producing high-bandwidth memory (HBM), SK Hynix had successively notified major customers that it would reduce general-purpose DRAM supply. However, now that general-purpose DRAM prices have risen sharply, the company's strategy also appears to be undergoing adjustments.

The Indo-Pacific region has become the world's most critical theater for both technology manufacturing and geopolitical competition. As military tensions escalate across East Asia, executives are increasingly questioning whether their supply chains can withstand potential disruptions.

Baidu is considering a spin-off and listing of its AI chip unit Kunlunxin, a development that has quickly become a focal point in China's fast-moving GPU and AI semiconductor market. The company said it is evaluating the potential listing but noted any move would require regulatory clearance and is not guaranteed.

Samsung Electronics, with its sixth-generation high-bandwidth memory (HBM4), uses base dies produced by Samsung Foundry. As Samsung's HBM4 competitiveness rises, the market expects the performance of Samsung Foundry to improve in tandem. Increased HBM4 sales not only boost the memory business but also drive foundry revenue, demonstrating Samsung's advantage as an integrated device manufacturer (IDM).

South Korean memory giant SK Hynix is fast-tracking the development of its next-generation 300-layer V10 NAND flash memory, according to reports in Korean media outlets Hankyung and Nate. The company plans to implement hybrid bonding technology for the first time to compete more effectively with rivals such as Samsung Electronics, China's YMTC, and Japan's Kioxia. Industry sources cited by Hankyung indicate that the company aims to complete development of a pilot line in 2026, before commencing mass production in early 2027.

Navitas Semiconductor and Cyient Semiconductors have announced a strategic, long-term partnership aimed at advancing gallium nitride (GaN) technology adoption in India and establishing a comprehensive local GaN ecosystem. The collaboration, announced on December 8, 2025, will focus on product co-development, local supply chain development, and enabling high-power applications.