DIGITIMES Semiconductors news

Jul 16, 14:32

TSMC 2Q26 profit surges 77% to a record on AI demand, first 2nm revenue

TSMC reported record second-quarter 2026 results on July 16, with revenue, profit, and earnings per share all surpassing market expectations, underscoring sustained demand for AI and high-performance computing (HPC) chips.

C.C. Wei on EMIB, memory envy, and why TSMC won't squeeze its customers

Jul 16, 16:43

As Trump pushes chips onshore, Netlist's ITC memory bid could keep Samsung, Nvidia offshore

Jul 16, 14:59

Korean prosecutors raid Rambus, Montage, and Renesas as memory-interface chip probe goes global

Jul 16, 11:49

Jensen refutes Vera Rubin's delay, continuing Nvidia's running rebuttal of the rumor mill

Jul 16, 11:41

Commentary: CXMT IPO binds China's DRAM supply chain into one ecosystem

Jul 16, 11:31

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PASSIVE, PCB, OTHER IC COMPONENTSAI hardware boom lifts Taiwan's rail and CCL suppliers; optical module tells messier story

Jul 16, 17:04

Taiwan's technology supply chain delivered another month of strong year-over-year revenue growth in June 2026, led by suppliers tied directly to AI server infrastructure, even as the optical module segment showed the sharpest slowdown of any sector tracked and revealed a widening gap between winners and laggards within its own ranks.

IC MANUFACTURINGTSMC says 2nm has four times as many tape-outs as 3nm at the same stage

Jul 16, 16:21

Customer tape-outs for TSMC's N2 process have reached four times the number recorded by its 3nm technology at the same stage, showing faster design activity as the foundry ramps production of its first 2nm process.

IC MANUFACTURINGAI chips are running hotter — and Niching is betting its future on keeping them cool

Jul 16, 15:47

As AI chips and HPC chips continue to draw more power, major advanced packaging orders at ASE, Powertech Technology, and Amkor remain strong, lifting demand for heat spreaders. Semi-conductor materials supplier Niching incorporated heat spreader maker Ming Chun Yuan Micro Precise Technology into the group on July 1, 2026, and analysts expect the merger to lift revenue by 30% and gross margin by 10%.

IC MANUFACTURINGTaiwan OSATs expand non-China capacity with US and SEA push

Jul 16, 15:44

As the global AI boom drives up demand for semiconductor packaging and testing, Taiwan's OSAT players are accelerating overseas capacity expansion beyond their home market and China. ASE, SPIL, KYEC, Greatek, and Tong Hsing are all pushing ahead in 2026 to strengthen supply-chain resilience amid geopolitical risk.

IC MANUFACTURINGTSMC boosts US investment by US$100B as C.C. Wei outlines long-term capacity planning with customers

Jul 16, 15:43

To address structural long-term growth in semiconductor demand, TSMC chairman C.C. Wei said the company works closely with customers — and its customers' customers — to jointly plan future capacity.

IC MANUFACTURINGTSMC eyes record quarter: 2nm ramp drives 3Q26 guidance above US$44B

Jul 16, 15:20

TSMC is projecting its strongest quarter ever, guiding third-quarter 2026 revenue to between US$44.6 billion and US$45.8 billion on the back of accelerating demand for leading-edge chips and the steep ramp-up of its 2-nanometer process technology.

IC MANUFACTURINGTSMC lifts 2026 revenue growth above 40% on strong AI demand from cloud giants

Jul 16, 15:19

TSMC expressed strong confidence during its July 16 earnings conference that demand for its advanced process technologies remains robust, with chairman C.C. Wei saying the company's 2nm process has entered volume production and is progressing smoothly through its production ramp.

IC DESIGN, DISTRIBUTIONBeyond AI: Resilient consumer demand widens semiconductor supply crunch

Jul 16, 15:06

Reports of lengthening semiconductor lead times have become increasingly common in recent months, highlighting that the imbalance between chip supply and demand has not eased but is instead spreading across a broader range of end markets. Taiwanese IC design companies believe that while booming cloud AI investment remains the primary driver behind today's capacity constraints across semiconductors and electronic components, resilient demand outside the cloud AI sector has also played an equally important role in keeping the market tight.

IC MANUFACTURINGInP substrates emerge as strategic asset as optical engine supply chain heads for reshuffle

Jul 16, 14:29

As AI server interconnects advance toward 1.6T and co-packaged optics (CPO), high-power continuous-wave (CW) lasers are becoming a strategic battleground for global technology companies. At the heart of these optical engines, indium phosphide (InP) manufacturing is shifting toward larger 4-inch and 6-inch wafer production. While existing suppliers have yet to fully meet growing demand, Taiwanese companies may find an opportunity to break into the market by addressing the widening supply gap.

MEMORY CHIPSCXMT IPO raises fresh capital, but its own prospectus map shows distance still to close

Jul 16, 14:26

The IPO prospectus filed by Changxin Memory Technologies (CXMT) ahead of its planned listing on Shanghai's STAR Market offers an unusually candid portrait of the global DRAM industry it is entering, including detailed profiles of the three incumbents it must eventually displace, and a frank accounting of how far behind it still sits.

IC DESIGN, DISTRIBUTIONGroups urge EU interim measures against Broadcom amid VMware antitrust case

Jul 16, 14:17

A European industry group, the Cloud Infrastructure Services Providers in Europe (CISPE), has joined four other trade organizations in calling for the European Commission to impose interim measures while it processes an antitrust case against Broadcom. The case concerns recent licensing changes made by the chip designer on the virtualization platform VMware.

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