DIGITIMES Semiconductors news

Jul 17

Exclusive: PC brands reportedly rush to secure CXMT memory as orders extend to end-2027

Chinese DRAM maker ChangXin Memory Technology's (CXMT) IPO has entered its final stage, drawing close market attention. PC supply chain sources said the US had briefly planned to add CXMT to its entity list but had not announced it, and that easing US-China tensions, along with reports that Apple had tested CXMT memory and lobbied the US government, had signaled a possible green light and triggered a rush of orders from brands, with shipments reportedly booked through the end of 2027.

AI server tracker: Taiwan's testing and design service leaders surge on global chip demand

Jul 17

China, Netherlands urge Nexperia talks as Wingtech warns of 1H loss

Jul 17

China's DRAM milestone arrives with CXMT IPO; HBM now separates contenders from leaders

Jul 17

Interview: QuantumDiamond's EU-backed quantum leap in chip inspection lands in Taiwan

Jul 17

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IC DESIGN, DISTRIBUTIONJensen Huang's week in Tokyo: what Nvidia's Japan trip reveals about future partners

Jul 20, 10:54

Nvidia founder and CEO Jensen Huang spent last week in Tokyo meeting government officials, robotics makers and dozens of supply chain executives, as the company deepens its push into Japan's manufacturing and AI ecosystem, according to a blog post published on Nvidia's website and its official newsroom release.

PASSIVE, PCB, OTHER IC COMPONENTSNetworking demand remains resilient, but component shortages threaten shipment schedules

Jul 20, 10:37

AI data center expansion and high-speed network upgrades continue to support demand for networking equipment. However, as the industry enters the second half of 2026, supplies of key components—including memory, printed circuit boards (PCBs) and passive components—remain tight, with lead times extending significantly.

MEMORY CHIPSCXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month

Jul 20, 10:35

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing network following its A-share subscription on July 16. The moves have placed its capacity expansion and next-generation memory roadmap under closer scrutiny from the industry.

IC MANUFACTURINGNvidia grappling with internal compute needs amid GPU shortages

Jul 20, 10:30

TSMC recently posted strong earnings, helped in large part by Nvidia orders, but both companies are grappling with chips inside their own operations: TSMC says they are too expensive, while Nvidia says there are not enough to go around.

PASSIVE, PCB, OTHER IC COMPONENTSSamsung struggles to secure AI chip substrates, report says

Jul 20, 10:21

Samsung Electronics is reportedly facing difficulties securing large-format FC-BGA package substrates for custom AI chips, as suppliers seek purchase guarantees, advance payments or direct procurement by end customers before allocating capacity.

PASSIVE, PCB, OTHER IC COMPONENTSHoltek sees customers prioritize supply stability over pricing as optical communications gains are expected in 2027

Jul 20, 10:03

Microcontroller (MCU) supplier Holtek Semiconductor reported June 2026 revenue of NT$351 million (approx. US$12 million), up 12.62% month-over-month and 30.93% year-over-year. Revenue for the first half of 2026 reached NT$1.81 billion, an increase of 11.58% from a year earlier.

IC MANUFACTURINGBeyond Taipower: AI, semiconductors, and overseas grids reshape Taiwan's electromechanical supply chain

Jul 20, 08:03

Taiwan's heavy-electrical and electromechanical industry is entering a new growth phase as demand expands beyond its long-standing reliance on Taiwan Power (Taipower). While Taipower's grid modernization remains the sector's foundation, semiconductor investments, AI data center construction, and overseas infrastructure projects are creating multiple growth drivers. At the same time, project-based business models are making revenue recognition increasingly uneven despite record order backlogs.

MEMORY CHIPSMicron's 10-year deal with GlobalWafers signals tighter 12-inch supply

Jul 20, 08:02

Rising demand for AI data centers and high-bandwidth memory (HBM) is pushing semiconductor competition further upstream into silicon wafers and critical materials. Micron and GlobalWafers recently announced a 10-year agreement, with Micron also providing US$500 million in support, marking the longest and potentially largest long-term supply agreement in GlobalWafers' history.

IC MANUFACTURINGHuahsu expands capacity to tap AI and advanced packaging demand

Jul 20, 08:02

Huahsu, a semiconductor materials supplier established in 1997 through a joint investment by Japan's Asahi Kasei and Wah Lee, has launched a new capacity expansion plan as demand for AI, HPC, and advanced semiconductor packaging accelerates. The company recently held a completion ceremony for its second high-resolution dry film photoresist processing plant.

MEMORY CHIPSHanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms

Jul 20, 08:01

South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that demand could outstrip supply from 2027, a bottleneck that would ripple across the AI chip buildout now being funded by the likes of Micron, SK Hynix, and TSMC.

IC MANUFACTURINGIndia roundup: India deepens semiconductor and AI ambitions as local ecosystem expands beyond fabs and assembly

Jul 20, 08:01

India is broadening its technology strategy from attracting chip factories to building semiconductor equipment, materials, AI capabilities, supply chains and trade partnerships as it seeks a larger role in global electronics.

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