Shanghai Micro Electronics Equipment (SMEE) has showcased a new generation of domestically developed lithography systems spanning front-end wafer fabrication and advanced packaging, marking further progress in China's semiconductor equipment localisation. The company claims more than 90% of key components in its front-end systems are sourced domestically, with the equipment advancing into volume production.

Concerns over an overheating AI market have resurfaced, fueled by delays in data center construction, power and permitting bottlenecks, and the potential deferral of hundreds of billions of dollars in capital expenditure.

Innodisk said AI-related applications generated more than 40% of its revenue as demand for high-end AI server memory and storage lifted third-quarter results. The Taiwanese industrial memory maker is expanding into the cloud service provider, AI server supply chain, and humanoid robotics markets, highlighting how artificial intelligence is reshaping technology markets worldwide.

Andy McLean, CEO of the UK Semiconductor Centre (UKSC), told DIGITIMES that strong AI growth is driving demand for energy-efficient processors, high-speed connectivity technologies such as photonics, and advanced power management. He said the UK's strengths in optics and other technologies make this a unique moment to advance its semiconductor industry.

The Department of Defense's Office of Strategic Capital (OSC) has offered Halo Industries, a semiconductor startup based in Santa Clara, California, a conditional loan commitment of US$75 million. The funding is expected to attract an equal amount of private capital to expand silicon carbide (SiC) semiconductor wafer manufacturing for defense, AI infrastructure, and high-voltage power electronics, reducing US reliance on overseas critical semiconductor materials.

Surging demand for advanced packaging driven by artificial intelligence (AI) has turned chip-on-wafer-on-substrate (CoWoS) from an "interesting" technology into a headache, making it an urgent priority for MediaTek to secure wafer, packaging, and substrate capacity, said company deputy GM of advanced packaging Shang Hou.

Democrats' sweeping victory in the US midterm elections has raised concerns that the country could slow AI development and data-center construction, but UK technology industry leaders say political change will not alter the semiconductor sector's fundamentally global cooperation model.

Peter Shu, chairman of Taiwanese memory module maker Transcend, expects DRAM and NAND Flash prices to plateau after stabilising in the third quarter of 2026. Further price increases appear limited, but declines remain unlikely, with DRAM still in short supply while NAND Flash availability has stabilised.

Qualcomm and MediaTek, the two leading smartphone SoC makers, are turning their attention to cloud AI ASICs as the global smartphone market faces what could be its sharpest decline on record in 2026. At their latest earnings briefings, cloud AI dominated the discussion, while smartphone operations took a back seat.

China's semiconductor equipment localisation is accelerating, with chipmakers increasing domestic procurement and local suppliers expanding into advanced manufacturing. Yangtze Memory Technologies (YMTC) is emerging as a key example of this shift.

King Yuan Electronics (KYEC) general manager Gauss Chang said the company's plan to establish a US testing facility in Texas remains on schedule despite concerns that a shift in control after the US midterm elections could alter AI policy. He said KYEC's long-term investment strategy is unlikely to be disrupted by short-term political changes.