Cadence Design Systems' third quarter suggests demand for chip design tools is still rising, with AI-driven design work showing up in both revenue and backlog, while the cost of buying growth is hurting profitability. Revenue for the three months ended September 30, 2026, rose 22% from a year earlier, the company said on October 26, but operating income barely moved.
Amkor Technology's latest quarter shows how a shift toward advanced packaging can strengthen profitability even when overall sales barely grow. Computing and automotive demand lifted the value of the company's production mix, while smartphone and consumer electronics headwinds kept the revenue recovery uneven.
As advanced packaging shifts toward large-size glass substrates, Cheng Mei Materials Technology is developing materials to address warpage, heat resistance, and drilling challenges. Its cutting and grinding tapes have entered customer validation and small-volume testing, while its anti-warpage film and heat-resistant tape remain in development.
Hermes Testing Solutions Inc. (HTSI), a semiconductor wafer-testing solutions provider, is expanding its Taiwan operations. Its board approved budget authorisations on October 22 for a new R&D centre in Hsinchu and a manufacturing centre in south-central Taiwan, with total investment expected to exceed NT$7 billion (approx. US$215 million).
Following TSMC's third-quarter 2026 earnings call, DIGITIMES analyst Luke Lin provided in a podcast additional analysis of several details that received limited attention in market coverage, including a new 3nm fab at the Southern Taiwan Science Park (STSP), the transfer of Nvidia-related high-bandwidth memory (HBM) base die orders to TSMC, and whether demand for A14 includes Intel server CPUs.
India's tech push opens markets unevenly: foreign suppliers get first crack at Tata's fab, Lam courts local vendors, Jio's IPO tests its 5G pitch, and CleanMax powers AI data centers.
Nvidia has unveiled a prototype of its next-generation co-packaged optics (CPO) technology, Optics-on-Interposer (OOI), at SEMICON West 2026. The design moves the optical engine from a conventional organic package substrate to the silicon interposer carrying the compute chips, increasing bandwidth density and reducing power consumption for future AI system interconnects.
Texas Instruments (TI) held its latest earnings call this week, projecting fourth-quarter 2026 revenue of US$5.8 billion to US$6.3 billion. The midpoint of its guidance is broadly in line with third-quarter revenue, outperforming the seasonal declines typically seen in the fourth quarter.
Since Elon Musk publicly confirmed that Tesla and SpaceX are evaluating a potential merger, the prospect has stirred widespread speculation over what could become the largest corporate transaction in history—and whether combining two of Musk's biggest technology platforms would actually create value beyond the sprawling ecosystem they already share.
Nvidia CEO Jensen Huang said the company did not expect memory supply to exceed demand in the coming years and remained open to working with China's ChangXin Memory Technologies (CXMT). The comments, made during the GTC Berlin conference and reported by CNBC, came as falling market valuations for memory manufacturers and new Chinese dynamic random-access memory (DRAM) developments intensified concerns about oversupply.
Samsung Electro-Mechanics (Semco) is gaining pricing power as AI server demand extends multilayer ceramic capacitor (MLCC) lead times beyond a year. Shortages now span consumer, automotive and industrial products, prompting customers to secure 2027 supplies.
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