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For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove more heat.

DIGITIMES analyst Luke Lin, speaking on a recent podcast, used Intel's latest equity fundraising plan to examine who is benefiting most from the current surge in server CPU demand and how much more capital Intel may need to reach the 1.4nm generation.

SanDisk Corp used its August 13, 2026 investor day to detail a technology roadmap and a set of financial targets it says will carry the flash-memory maker through the end of the decade. The plans center on new multiyear supply contracts with data center customers and an accelerating NAND product cadence built around artificial intelligence inference workloads.

Taiwanese test interface provider MPI said that continued strong expansion demand from global artificial intelligence (AI) customers, along with its growing global market share in mid- to high-end test interfaces, drove both revenue and profit to record highs in the second quarter of 2026. The company added that probe card capacity remained fully utilized as demand outpaces supply.

Suzhou Novosense Microelectronics expects to return to profitability in the first half of 2026, with revenue rising nearly 67% as demand for AI computing infrastructure, automotive electronics, server power supplies, and renewable energy systems lifts semiconductor shipments.
Advanced Micro Devices (AMD) is launching up to US$5 billion in debt offerings, part of a wave of tech companies reaching for capital markets to fund investments in AI-driven technologies. The move comes as the company is competing with both Intel and Nvidia to capture enormous opportunities from data center development and agentic AI.
Samsung Electronics may move part of the general-purpose DRAM and NAND packaging and testing now handled at its Cheonan and Onyang sites in South Korea to Vietnam, potentially freeing domestic backend capacity for high-bandwidth memory (HBM), according to DealSite.
Eternal Precision Mechanics (EPM), a small but fast-growing subsidiary of Eternal Materials, is accelerating its shift from IC substrates into advanced packaging equipment. The company said it is now developing equipment for chip-in-package, glass substrates, and organic interposers, while also moving from panel lamination into wafer lamination, primarily targeting "Taiwan's largest semiconductor manufacturer."
International tungsten prices have risen 666% year-on-year amid China's export controls, while the US Department of Commerce recently announced restrictions on exports of tungsten scrap and battery black mass. Tungsten is used across a broad range of strategic industries, including semiconductors, aerospace and defense.
Nvidia Feynman pushes TSMC A16 and CPO ramp
Aug 14, 11:42

Nvidia is accelerating development and supply-chain alignment for its Feynman generation in the second half of 2028, even as Vera Rubin enters mass production and ramps up. The move is set to drive upgrades at TSMC and could trigger another wave of orders across the global equipment and materials supply chain.

Intel has priced the largest equity raise in its history, selling 210,526,315 shares of common stock at US$95 per share to raise roughly US$19.67 billion in net proceeds, according to a prospectus supplement filed with the US Securities and Exchange Commission.