Suzhou C*Core Technology announced on April 15 that its next-generation automotive microcontroller unit (MCU), the CCRC4XXX series, has completed internal testing, marking a milestone in its push into high-end automotive semiconductors.
Memory module maker Apacer Technology reported its consolidated financial results for the first quarter of 2026, with revenue reaching NT$7.04 billion (approx. US$223 million), gross profit NT$3.47 billion, operating profit NT$2.31 billion, net profit NT$1.86 billion, and earnings per share (EPS) of NT$14.54. Revenue, gross profit, operating profit, and net profit all hit record highs for the quarter. Compared with EPS of NT$6.7 for the full-year 2025, Apacer's first-quarter earnings alone have already exceeded last year's total.
Google is in talks with the US Department of Defense that would allow the Pentagon to use the company's Gemini AI models for classified purposes, according to The Information. If the deal comes to fruition, it could represent a deepening of ties between Google and the Pentagon, which is seeking AI partners after its falling out with Anthropic in recent months.
In an era where AI systems are rapidly scaling beyond the limits of traditional silicon, new experimental companies are beginning to question what "compute" itself should look like. One of the most unusual entrants is The Biological Computing Company (TBC), which proposes a hybrid model integrating living neurons with modern machine learning systems to enhance performance, efficiency, and adaptability. The idea sits at the intersection of neuroscience and computing.
The surge in AI-grade high-speed computing is pushing printed circuit board manufacturing toward thicker, higher-layer designs, creating a strategic, global shortage of advanced coated PCB drills and raising costs and supply risks for hardware makers and cloud providers, potentially constraining the deployment of server and network equipment over the next two years.
Openchip's growth and product roadmap could reshape AI computing supply chains and deployment costs globally, offering lower-power alternatives and CPU-independent modules that could ease constraints for data centers, research institutions, and defense contractors. The developments signal potential new suppliers for countries pursuing sovereign AI capabilities.
China is preparing a new round of large-scale investment and industrial upgrading centered on AI infrastructure, advanced manufacturing, and strategic emerging industries, according to a briefing by the National Development and Reform Commission (NDRC) at a State Council Information Office press conference on April 17.
National Silicon Industry Group (NSIG) reported full-year 2025 revenue growth driven by higher 300mm wafer shipments, though pricing pressure and high fixed costs weighed on margins.
TSMC chairman C.C. Wei emphasized persistent capacity shortages during the company's earnings call, noting that 3nm technology accounted for about 25% of first-quarter 2026 revenue. New 3nm production capacities will come online sequentially in Taiwan, the US, and Japan between 2027 and 2028. Wei also revealed plans for CoPoS for the first time.
Taiwan's outsourced semiconductor assembly and test industry is expanding rapidly, driven by AI, high-performance computing, and memory demand. Global supply chains may face tighter advanced-test capacity, higher prices, and accelerated investment as Taiwanese OSATs boost capital spending and capacity, significantly affecting chipmakers and device makers worldwide into 2026 and beyond.
A year-old startup from Hsinchu, Taiwan is preparing to make its American debut. Fluidiconic Bio will join four other Taiwanese startups at the Plug and Play Silicon Valley Summit this May, pitching a high-information-density tumor-on-a-chip platform that its founders believe can do what decades of animal testing cannot: reveal, with greater resolution, how a cancer drug behaves inside a human tumor — and help pharma teams make better decisions before they reach the clinic.
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