On March 19, senior executives at Nvidia said the company has reached an agreement with the cloud computing division of Amazon to supply large-scale GPU infrastructure through 2027.
Samsung Electronics' foundry business is showing signs of stabilization after a sustained period of market share decline, as new orders from Nvidia and Tesla underscore its ability to manufacture high-value artificial intelligence (AI) semiconductors, according to Maeil Business News Korea and EBN.
The global CMOS image sensor (CIS) supply chain faces a major disruption as HiSilicon, Huawei's core semiconductor subsidiary, officially enters the high-end CIS market with its first self-developed sensor chip. Partnering with strategic collaborator Gkuvision, an imaging solution provider, HiSilicon launched the new generation sports camera "Xiaotu S7PRO MAX" equipped with its proprietary sensor.
TSMC built its dominance not just on cutting-edge fabs, but on closely guarded know-how that rivals cannot easily replicate. Now, that edge is at the center of a high-stakes legal fight. Former senior vice president Wei-jen Lo stands accused of walking out with the crown jewels — key parameters and trade secrets tied to the chipmaker's most advanced processes — before crossing the Pacific to join rival Intel. The case has landed in Taiwan's Intellectual Property and Commercial Court, and the outcome could set a precedent for how the island defends its most valuable technological assets.
Nvidia GTC 2026 and the Optical Fiber Communication Conference (OFC) have underscored the growing importance of optical communication in cloud AI, with chipmakers playing an increasingly critical role in the ecosystem.
As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance and edging toward obsolescence.
Samsung Electronics held its 57th annual shareholders meeting on March 18 in Suwon, South Korea, where it unveiled advanced memory products, including high-bandwidth memory (HBM), signaling a strategic push to strengthen its semiconductor competitiveness.
Taiwan has long leveraged its manufacturing strengths to carve out a place in the global supply chain. Now, it is going further. With research and development reach expanding overseas, the country is shifting from contract manufacturing to joint innovation. The UK-Taiwan Innovative Industries Programme (I2P), run under the British Office Taipei and ITRI, has hit a record scale in 2026, with 17 research and development teams taking part in bilateral exchanges.
Driven by AI applications boosting advanced processes, HBM, and packaging technologies, demand for key materials like silicon wafers and photoresists has surged. Topco Scientific (TSC) has announced plans to focus on high-growth sectors such as AI, automotive, and data centers in 2026, targeting sustained double-digit growth.
Benefiting from rising demand across the server and industrial PC (IPC) markets, Allied Circuit (ACCL), a PCB manufacturer backed by Compal, reported that its new capacity added in 2025 has fully come online. Now running at full capacity, ACCL's monthly revenue contribution stands at approximately NT$500 million (US$15.7 million). The company plans to continue removing production bottlenecks in 2026 and expects second-half revenue performance to surpass the first half.
Taiwan built its technology identity on two pillars: semiconductors and display panels. One has thrived. The other is reinventing itself.
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