DIGITIMES Semiconductors news

Jul 30

China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic Technology Group, founded in August 2023 with CNY7 billion (approx. US$1.03 billion) in registered capital, is reportedly coordinating limited production of domestically developed lithography systems.

Samsung foundry to double 2nm design wins in 2026 on Broadcom talks; claims profit turnaround 'possible in near term'

Jul 30

Intel's reported DDR4 CPU revival expected to boost PC demand in second half

Jul 30

Qualcomm confirms price hike plan and broadens growth bets as Apple sales fade

Jul 30

Arm readies AGI CPU shipments, eyes 3Q stream in fiscal 2028

Jul 30

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MEMORY CHIPSAnalysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

Jul 31, 08:56

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single number. It was the shape of the customer list: cloud service providers, AI/HPC designers, an LPU maker ramping at 4nm, and talks with Broadcom. This is not the mobile-centric foundry business Samsung has run for a decade. It is the profile of a fab catching overflow from a leading-edge market that has run out of capacity.

PASSIVE, PCB, OTHER IC COMPONENTSUnimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry

Jul 31, 08:02

TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach true mass production until 2027. The substrate maker said the new platform is already drawing three suppliers, all targeting an initial 50% yield.

IC MANUFACTURINGSPIL AI packaging investment boosts CTSP Erlin Park as first standard factory opens in 2H26

Jul 31, 08:01

The Central Taiwan Science Park's (CTSP) Erlin Park is set to reach a long-awaited milestone when its first standard factory building begins operations in the second half of 2026, signaling a potential turning point for a development that has struggled for nearly two decades to establish an industrial foothold.

IC MANUFACTURINGUMC raises capex to US$2B, eyes AI SiPh

Jul 31, 08:01

UMC said on July 29 that it will raise 2026 capex from US$1.5 billion to US$2 billion, while unveiling expansion plans in Singapore and a new fab in STSP. The foundry also disclosed its first AI business target, forecasting AI-related revenue of about US$300 million in 2026 and aiming to reach US$1 billion within the next three years.

IC DESIGN, DISTRIBUTIONQualcomm, MediaTek set Sept flagship SoC showdown

Jul 31, 07:59

Qualcomm and MediaTek are preparing to unveil their latest 2nm flagship smartphone system-on-chip (SoC) platforms in September 2026, with both brands expected to launch standard and upgraded chips at the same time to meet different customer needs. Supply chain sources say the two chipmakers will no longer rely on a single product for flagship phones in 2026, but instead offer two separate specifications.

PASSIVE, PCB, OTHER IC COMPONENTSChang Wah sees broadening demand recovery and higher margins in 2Q26

Jul 31, 07:58

Chang Wah Technology said stronger demand and tighter inventories are lifting its business across multiple markets, a sign that the recovery in electronics supply chains is widening for global customers. The Taiwan-based lead-frame maker also expects third-quarter sales to keep rising, underscoring improved momentum in semiconductors and related end markets.

MEMORY CHIPSSamsung boosts Hwaseong DRAM capacity as it converts older NAND lines

Jul 31, 07:56

Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site. By the end of 2026, general-purpose DRAM capacity is expected to rise about 15%.

IC MANUFACTURINGASE sees full-year LEAP revenue topping US$3.5 billion amid tight packaging capacity

Jul 30

ASE Technology Holding said growing demand for advanced packaging and testing, combined with stronger momentum in its electronics manufacturing services (EMS) business, has tightened capacity across both advanced and conventional packaging. Wafer sorting and final test capacity are also nearing full utilization.

MEMORY CHIPSSamsung signs five-year memory deals as chip shortage stretches to 2028

Jul 30

Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing share of its DRAM and NAND output to commitments that run years into the future.

MEMORY CHIPSSouth Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Jul 30

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth memory (HBM) moves into advanced packaging processes led by TSMC.

IC DESIGN, DISTRIBUTIONMicrosoft's AI buildout: 88 new data centers, broader model catalog, silicon gains

Jul 30

Microsoft CEO Satya Nadella laid out how the company is scaling its AI infrastructure and platform to keep pace with demand. He outlined these plans during an earnings call on July 29, when he also announced record revenue above US$331 billion for fiscal year 2026 (ending on June 30), with Microsoft Cloud earnings surpassing US$214 billion and Azure earnings surpassing US$100 billion.

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