Hiwin Technologies and Qualcomm Inc. announced a partnership at Computex 2026 to integrate Qualcomm Dragonwing Q6 series processors into Hiwin's Load Port products, delivering edge AI capabilities for semiconductor panel-level packaging (PLP) equipment. The collaboration positions Hiwin's Load Port as the smart edge node in front-end modules, aiming to improve real-time image processing, status sensing, and anomaly detection on the equipment side.
Industrial factories are likely to become the first major market for robots at scale, according to NXP chief executive Rafael Sotomayor, who said manufacturers want stable systems, dependable performance, and clear financial returns. This view suggests that the earliest gains from robotics may come in places where efficiency improvements are easiest to measure.
SambaNova used a Computex 2026 session on June 4 to make its most public case yet that the GPU-only approach to AI inference is hitting a fundamental wall — and to demonstrate, live on stage, an alternative architecture it calls disaggregated inference running in a production data center.
As artificial intelligence (AI) workloads place unprecedented demands on data storage systems, South Korean SSD controller designer FADU is betting that next-generation storage architecture will become a critical battleground in the AI infrastructure race.
Huawei has formally introduced its "Tau Law," proposing a shift from traditional process-node scaling to "time scaling," a model aimed at improving chip performance through optimisation across components, circuits, chips, and systems, even under mature process technologies.
Infineon Technologies' India operations are moving beyond traditional engineering support into global ownership roles, as rising demand from AI data centers reshapes the power semiconductor market, according to Vinay Shenoy, managing director of Infineon Technologies India.
Nexchip Semiconductor plans to carve out its BGBM business by contributing specialised equipment assets to Anhui Ruijing Semiconductor, a newly established power device wafer-processing venture in Wuhu, Anhui Province, as the Chinese foundry seeks to focus capital and management resources on its core 12-inch wafer foundry platforms.
As artificial intelligence fuels demand across the electronics supply chain, Taiwanese conductive paste supplier Ample Electronic is seeing a rebound in one of the industry's most overlooked segments: passive components.
GoldKey Technology expects memory shortages to persist into 2028, with AI demand and structural supply constraints set to keep prices rising through the second half of 2026 and into 2027.
Explosive demand for artificial intelligence is widening supply chain bottlenecks for global electronics makers, with shortages now reaching from advanced chips and packaging into printed circuit boards, memory, and passive components. Longer lead times and rising prices are adding uncertainty for data center, optical module, and equipment buyers worldwide.
As demand for artificial intelligence (AI) computing expands rapidly, market attention has long centered on GPUs, high-bandwidth memory (HBM), and advanced packaging. However, printed circuit boards (PCBs), which sit beneath chips and connect critical electronics, are increasingly being viewed by the US government and defense sector as a supply chain risk.
More coverage
