DIGITIMES Semiconductors news

May 8

TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead

TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead over rivals in the AI semiconductor race. Industry sources said TSMC has imposed strict confidentiality controls across the CoPoS supply chain, requiring Taiwan-based equipment and materials partners to sign agreements that prevent technology leakage and limit supply to TSMC for several years after mass production begins.

TSMC reports record April sales as AI chip demand puts Asia supply in focus

May 8

Analysis: Anthropic's xAI deal puts Musk's GPU efficiency problem in focus

May 8

Sony, TSMC form Japanese joint venture to push image sensors into automotive and robotics

May 8

Inside Nvidia's high-stakes bet on next-generation AI cooling

May 8

MORE NEWS

MEMORY CHIPSThe AI memory squeeze may not ease before 2028

May 11, 08:20

Global memory supply is under severe strain, prompting major cloud service providers to sign multi-year contracts with memory makers and forcing the industry to rethink capacity spending and pricing. The shortage reflects long lead times for new fabs and a strategic shift toward higher-margin memory types.

IC MANUFACTURINGTaiwan chip testing firm sheds power unit, pivots to AI validation as margins recover

May 11, 08:12

Taiwan-based electronics verification and analysis specialist Integrated Service Technology (iST) posted weaker first-quarter revenue and an operating loss amid a major operational restructuring, but said the transition has laid the groundwork for a sharper focus on higher-margin AI-related validation and analysis services.

IC DESIGN, DISTRIBUTIONNvidia backs IREN in 5GW AI infrastructure push tied to US$2.1 billion stake

May 11, 08:11

Nvidia is expanding its influence beyond AI chips and deeper into the infrastructure layer underpinning the global artificial intelligence boom, announcing a strategic partnership with AI cloud and data center operator IREN to deploy up to 5 gigawatts of AI infrastructure globally.

IC DESIGN, DISTRIBUTIONSamsung eyes Exynos 2700 as test for chip-unit recovery

May 11, 08:11

Samsung Electronics is looking to the tentatively named Exynos 2700 application processor (AP) as a key test for its non-memory semiconductor recovery, with the chip's adoption rate and performance in the Galaxy S27 series expected to shape the outlook for its System LSI and foundry businesses.

IC MANUFACTURINGIndia roundup: India accelerates semiconductor and display ambitions with new approvals, AI infrastructure expansion

May 11, 08:10

India is advancing its electronics and semiconductor manufacturing strategy through new approvals for semiconductor and Mini/Micro LED projects, while companies including Tata Electronics and Yotta Data Services expand investments tied to chips, AI infrastructure, and data centers. The developments reflect India's broader push to become a larger global sourcing base for semiconductors, displays, automotive electronics, and AI-related manufacturing amid ongoing supply chain diversification.

IC MANUFACTURINGAI demand fills Vanguard's Singapore fab ahead of schedule

May 10

Vanguard International Semiconductor said AI-driven demand has largely offset geopolitical and macroeconomic headwinds and will be the dominant force shaping semiconductor industry conditions in 2026. The wafer foundry said AI infrastructure buildout has crowded available capacity, pushed prices higher and accelerated customer orders for its Singapore 12-inch fab, with sampling now slated for July 2026.

IC MANUFACTURINGTaiwan's IntelliEPI warns of severe indium phosphide supply shortage

May 10

As AI data centers demand ever-faster networking speeds and more advanced optical interconnects, one of the semiconductor industry's lesser-known materials is emerging as a major constraint.

IC MANUFACTURINGWhat's driving the TSMC-Sony AI sensor JV?

May 9

TSMC and Sony Semiconductor Solutions signed a non-binding memorandum of understanding on May 8 to establish a joint venture developing and manufacturing next-generation AI image sensors, targeting automotive, robotics and advanced smartphone camera markets. The planned venture will be headquartered at Sony's new facility in Kōshi, Kumamoto Prefecture, with Sony holding a majority stake and operational control.

MEMORY CHIPSSamsung accelerates Pyeongtaek fab expansion as memory supercycle builds

May 9

Samsung Electronics is reportedly moving up construction of the final production line at its Pyeongtaek semiconductor campus, accelerating one of its largest capacity-expansion projects as demand for memory chips tied to artificial intelligence continues to exceed expectations.

PASSIVE, PCB, OTHER IC COMPONENTSPower chip shortages deepen as AI server demand and GaN battles escalate

May 9

Global power semiconductor suppliers are entering a new upcycle marked by tightening supply, rising prices, and intensifying technology competition, fueled by accelerating investment in AI infrastructure and electric vehicles.

MEMORY CHIPSAdata sees DRAM, NAND prices rise 40% in 2Q26

May 9

Adata said DRAM and NAND flash contract prices will each climb more than 40% in the second quarter of 2026, as supply is kept tight by cloud server giants that have already locked up 2027 output from upstream memory suppliers. The memory module maker said its inventory topped NT$40 billion (approx. US$1.3 billion) as of the end of April, and it sees no risk to demand through the end of 2026.

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