DIGITIMES Semiconductors news

Dec 5

Commentary: Infineon-Innoscience GaN ruling delivers 'disputed victory' for both sides

The US International Trade Commission (ITC) has issued its initial determination in Infineon's Section 337 case against China-based GaN supplier Innoscience. In a telling move that reveals the stakes of the dispute, both companies immediately declared victory.

Broadcom CEO visits South Korea as Samsung HBM4 reportedly obtains Google TPU certification

Dec 5

Micron exits consumer market with Crucial phase-out amid shift to AI-driven memory demand

Dec 5

Samsung to command the AI inference market with GDDR7

Dec 5

Nvidia invests US$2 billion in Synopsys to advance AI chip design

Dec 5

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IC MANUFACTURINGTSMC expansion to drive record earnings for Taiwan engineering contractors through 2026

Dec 8, 11:59

Taiwan's leading construction engineering contractors are on track to post record results in 2026 as TSMC accelerates advanced fab expansion at home and overseas to meet rising demand for artificial intelligence (AI) chips. United Integrated Services (UIS), Marketech International (MIC), L and K Engineering, Yankey Engineering, and Acter Group report strong profit momentum supported by large project backlogs tied to TSMC's new fabs and advanced packaging lines.

IC DESIGN, DISTRIBUTIONChina expected to surpass Taiwan as second-largest IC design revenue generator by 2026, IDC forecasts

Dec 8, 11:41

According to IDC's latest forecast, released on December 5, 2025, China is expected to overtake Taiwan, accounting for the world's second-largest integrated circuit (IC) design revenue starting in 2026. The shift is attributed to China's aggressive pursuit of chip demand autonomy and the rapid emergence of domestic startups focused on edge computing and AIoT markets.

IC MANUFACTURINGWeekly news roundup: TSMC veteran's Intel move sparks debate, Samsung reportedly secures TPU HBM4 nod

Dec 8, 11:10

These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.

MEMORY CHIPSSamsung shifts focus from HBM to DDR5 modules for higher profits

Dec 8, 10:56

Samsung Electronics has shifted its internal strategy in response to intensified HBM market competition**,** reallocating capacity toward DDR5 RDIMM modules and freeing up around 80,000 DRAM wafers monthly to yield stronger profits.

IC MANUFACTURINGRitek revives growth by becoming an AI infrastructure dark horse

Dec 8, 08:05

Ritek Group CEO Wang Ting-chang said the group has long invested in AI-linked fields such as power, semiconductor materials, and packaging. Although invisible at the consumer end, Ritek has become an "invisible champion", supplying the tooling, materials, and power backup systems that underpin customers' AI deployment.

MEMORY CHIPSHuawei's Peter Zhou says China's storage stack is stressed yet still primed for global standing

Dec 8, 08:04

China's storage industry is at a critical juncture. Surging AI workloads have fuelled a global shortage of high-bandwidth memory (HBM) and pushed storage to the forefront of the semiconductor market. Yet while overseas suppliers have filled HBM capacity through 2027, many Chinese vendors remain trapped in margin-draining price competition that limits innovation.

PASSIVE, PCB, OTHER IC COMPONENTSTaiwan poised to benefit as Japan and Korea shift capacitor output to premium markets

Dec 7

Japanese and Korean passive-component makers are diverting more capacity to high-end capacitors used in AI servers, tightening supply in mainstream electronics, and creating new openings for Taiwanese suppliers. The pivot reflects how booming AI server demand is reshaping global component production.

MEMORY CHIPSTaiwan's ESMT sees memory upturn accelerating as pricing gains roll into 4Q25

Dec 7

Tight memory supply has lifted prices across product lines, allowing Elite Semiconductor Microelectronics Technology (ESMT) to break a two-quarter losing streak in the third quarter of 2025. With wafer cycles running four to six months and contract pricing lagging by a quarter, the real pricing uplift is expected to appear from the fourth quarter of 2025. ESMT is on track to return to core profitability, with gross margin set to rise materially from third-quarter levels.

IC DESIGN, DISTRIBUTIONSouth Korea bets on airport GSE to break 90% power chip import lock

Dec 7

South Korea is racing to slash its more than 90% dependence on imported power semiconductors. Industry leaders warn that this reliance threatens the country's competitiveness in electric vehicles (EVs), data centers, and emerging mobility markets. Airport ground support equipment (GSE) has emerged as a strategic platform to validate and scale domestic power semiconductor technologies.

IC MANUFACTURINGHuawei patent reveals DUV method to replicate 2nm-class chipmaking without EUV

Dec 6

A newly released filing from China's National Intellectual Property Administration (CNIPA) shows Huawei submitted a patent in June 2022 outlining a method to achieve 2nm-class metal line patterning using only deep ultraviolet (DUV) lithography — potentially bypassing US export restrictions on advanced tools. The South China Morning Post reports the technique can create metal pitches under 21nm, a requirement typically met only with ASML's top-tier extreme ultraviolet (EUV) exposure systems, which remain off-limits to Huawei.

IC MANUFACTURINGFabship takes chip manufacturing into orbit as industry eyes Space-based fabs

Dec 6

As artificial intelligence (AI) accelerates the global semiconductor race—and as commercial space activity heats up—the idea of moving chip fabrication into orbit is edging from science fiction toward technological reality.

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