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Jan 21
TSMC capacity crunch signals opportunity for Samsung's advanced nodes

The explosive demand for AI chips has created a rare production bottleneck for TSMC's advanced 3nm process, with capacity fully booked through 2027. Deutsche Bank analysts suggest that the crunch may provide a strategic opening for Samsung Electronics to capture orders from major technology firms.

GlobalWafers chairwoman Doris Hsu spoke to the media on January 21, outlining the company's current US strategy and sharing her views on the recently finalized US-Taiwan tariff agreement.
Strong memory demand propelled Nanya's profits to soar in the fourth quarter of 2025, with president Pei-Ing Lee highlighting sustained AI and general server needs driving a robust DRAM market into 2026. Customers are overbooking and seeking long-term agreements (LTAs), eyeing to secure sufficient supply.

As tensions between China and Japan escalate over export controls on rare earths and semiconductor materials, China is accelerating efforts to build domestic production capacity—even as Japanese firms continue to dominate the global photoresist market.

Samsung Electronics and SK Hynix have been investing tens of trillions of won each year to expand memory production as the global market moves into a new upcycle. That spending now faces fresh pressure from the US semiconductor tariff policy, complicating long-term investment planning at the two companies.

Eric Demers, a veteran GPU architect who until recently served as Senior Vice President of Engineering at Qualcomm and led its GPU business, is leaving the company to join Intel, according to a disclosure he made on LinkedIn.

Taiwan's Executive Yuan Vice Premier Li-Chun Cheng and Minister without Portfolio and chief trade negotiator Jen-Ni Yang held a press conference on January 20, 2026, accompanied by Premier Jung-Tai Cho and Minister for Economic Affairs Ming-Hsin Kung, to discuss ongoing negotiations with the US over reciprocal tariffs and Section 232 measures.

PCB maker Tripod Technology said full-year 2025 revenue reached a record high, and it expects stable momentum heading into 2026 despite ongoing inventory adjustments among automotive customers. Strong demand from server and memory module applications is driving a steady increase in utilization rates, allowing first-quarter operations to defy traditional seasonality and remain in line with the previous quarter's revenue level.

Raana Semiconductors Pvt. Ltd. (RSPL), an India-based company specializing in crystal growth systems and single-crystal materials, has raised US$3 million in a seed funding round, marking its first institutional capital raise. The pure equity round was led by Equirus Innovatex Fund and Artha Venture Fund, with participation from IvyCap Ventures, PointOne Capital, CIIE Initiatives (IIMA Ventures), and angel investor Garimella Laxminarayana. Valuation details were not disclosed, according to Inc42, Saure Energy, and BW Disrupt.
Taiwan PCB direct shipments to the US remain limited
Jan 22, 08:24
The US has lowered the tariff rate on Taiwan to 15%, and it will not be stacked with the most-favored-nation (MFN) tariff rate. This places Taiwan on the same baseline as Japan, South Korea, and EU countries. It is also better than the previously agreed rates of 19% and 20% for Thailand and Vietnam, respectively. Regarding semiconductor tariffs derived from Section 232, as long as the products are supplied for use by cloud service providers (CSPs), government agencies, and other such purposes, they meet the exemption conditions set by the US. This means that Taiwan's AI products exported to the US are essentially unaffected and benefit from zero-tariff preferential treatment.
Paras Defence and Space Technologies Ltd. announced the launch of a new subsidiary, Paras Semiconductor Pvt. Ltd., marking the company's expansion into the semiconductor packaging and assembly sector. The move aims to address gaps in India's domestic capability for advanced semiconductor packaging, particularly for defence and strategic electronics applications.

As next-generation AI server platforms enter volume deployment, supply chain constraints are extending beyond high-bandwidth memory (HBM). Bottlenecks are increasingly emerging in printed circuit boards (PCBs) and critical upstream materials, according to DIGITIMES analysis.