A Taiwanese court handed down its harshest ruling yet in a semiconductor trade secret case on Monday, sentencing a former TSMC engineer to 10 years in prison and fining Japanese equipment giant Tokyo Electron (TEL) NT$150 million (approximately US$4.6 million) for stealing advanced chipmaking secrets — marking the first time a corporation has been penalized under Taiwan's National Security Act.
Meta and Amazon announced on April 24 that Meta will use Graviton5 CPUs made by Amazon Web Services (AWS). The deal illustrates the growing importance of CPU chips for increasingly complex compute tasks as AI technology makes the leap from model training to autonomous agents.
1.6T optical communication modules are set for broad adoption in AI data centers in 2026, with optical transceiver vendors and key IC design houses preparing for shipments. Broadcom's digital signal processor (DSP) chips and Marvell's fully integrated Light Engine have begun volume production and testing, with revenue contributions expected to grow quarter by quarter this year.
The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor assembly and testing (OSAT) facility in Uttar Pradesh, according to people familiar with the matter cited by The Economic Times. The project marks a further step in India's push to localize semiconductor packaging capacity amid a global supply chain diversification.
Japanese auto parts supplier Denso said on April 27 that it is considering all options, including withdrawing its acquisition proposal for chipmaker Rohm, after failing to secure the company's support.
Global outsourced semiconductor assembly and test (OSAT) leader ASE Technology Holding (ASEH) held its 2025 ASE Supplier Award ceremony, inviting more than 100 suppliers of packaging and testing equipment, raw materials, components, and processing, along with its subsidiaries Advanced Semiconductor Engineering (ASE), Siliconware Precision Industries (SPIL), and Universal Scientific Industrial (USI).
ASML has launched its 0.55 High Numerical Aperture Extreme Ultraviolet (High-NA EUV) in an effort to extend Moore's Law. The market had originally expected TSMC to adopt it first, but the company has held back. TSMC Senior Vice President of Global Business Kevin Zhang stated at the North America Technology Symposium that there are currently no plans to introduce High-NA EUV before 2029, mainly because "it's too expensive!" This decision also reflects how TSMC is shifting competition focus from equipment to process integration and cost efficiency.
Below are the most-read DIGITIMES Asia stories from the week of April 20-27, 2026:
As the AI buildout accelerates and chipmakers race to secure advanced process capacity, TSMC finds itself in an increasingly commanding position.
MediaTek's application-specific integrated circuit (ASIC) business is drawing market attention as volume production of Google's tensor processing units (TPUs) is expected to ramp from the second half of 2026. Views differ on how fast the segment will grow, though some estimates suggest ASIC revenue could overtake smartphone chips by 2027 to become the company's largest revenue source.
South Korea and Vietnam have expanded cooperation across technology, energy, and infrastructure, signing dozens of agreements during Korean President Lee Jae-Myung's visit to Hanoi, as both countries seek to reinforce supply chain resilience amid global volatility.
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