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Apr 30
Qualcomm to ship custom product with hyperscaler in 4Q26
In an earnings call on April 29, Qualcomm told investors it expects initial shipments of a custom silicon engagement with a leading hyperscaler in the December quarter, a milestone executives said will mark the start of a multi‑generation partnership
BenQ Materials is accelerating its expansion into semiconductor materials as its subsidiary Cenefom officially begins operations at its new Guangyuan plant. The facility's chemical mechanical planarization (CMP) brush wheels have entered the Taiwan supply chain of a major memory manufacturer.
The European Semiconductor Manufacturing Company (ESMC), a joint venture among TSMC, Bosch, Infineon Technologies, and NXP Semiconductors, is set to begin initial production in 2027. On April 29, the German Trade Office Taipei confirmed that construction is progressing as scheduled and expressed confidence in the timely delivery of the first batch of chips.
Microcontroller (MCU) maker Holtek announced it has raised prices on low-margin MCUs following wafer foundry and packaging cost hikes in China at the end of 2025. This price adjustment has since driven order inflows for touch MCUs and other products. Holtek expects strong growth momentum in the security and health segments in the first half of 2026, with some orders already visible up to six months ahead. The company is also advancing the development of brushless DC motor (BLDC) products and external laser optical communication modules targeting AI servers.

India's technology ecosystem is seeing rapid expansion across AI infrastructure, semiconductors, and electronics manufacturing. From startup bets on AI inference to multi-billion-dollar data center plans and OSAT capacity buildouts, global and domestic players are deepening commitments. The momentum underscores India's rising role in supply chains and compute-driven industries.

Samsung Electro-Mechanics (Semco) has moved early to commercialize embedded semiconductor substrates, but the window is rapidly closing as Japan's Ibiden and Taiwan's Unimicron prepare to enter the field, setting up a new competitive front in advanced packaging.
Recovery in the industrial chip market, driven by AI data center demand, is poised to reshape manufacturers and supply chains worldwide, as Texas Instruments and NXP Semiconductors report stronger performance in their industrial segments. Improved demand visibility and projected growth through 2026 could influence component sourcing, pricing, and investment strategies for technology stakeholders.
China-based chip design service provider VeriSilicon Microelectronics (Shanghai) Co. is seeing a sharp acceleration in AI-driven demand, with record orders and surging revenue in the first quarter of 2026 — even as heavy R&D spending continues to weigh on profitability.
PCB maker Zhen Ding Technology has launched the second phase of its joint research center with National Tsing Hua University, aiming to deepen collaboration on advanced PCB and IC substrate technologies, smart manufacturing, and talent development.

On the morning of April 28, 2026, 37-year-old Yichen Shen stood at the Hong Kong Stock Exchange, striking the IPO gong with a wooden mallet.

At their latest earnings calls, all four major US cloud service providers (CSPs) offered updated views on their 2026 capital expenditure (capex) plans. While Amazon's AWS maintained its already elevated capex levels, the other three — Alphabet, Microsoft, and Meta — each raised their spending outlooks.
As wireless communication applications surge, demand for quartz components and filters is rising in tandem, with manufacturers actively expanding into the low Earth orbit (LEO) satellite sector. An industry insider says ground receiving stations currently drive the strongest demand for filters and quartz parts, forecasting a market explosion by 2027 as satellite communication users grow.