DIGITIMES Semiconductors news

Jul 31

Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry

TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach true mass production until 2027. The substrate maker said the new platform is already drawing three suppliers, all targeting an initial 50% yield.

Analysis: The AI buildout stopped being a demand story

Jul 31

Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap

Jul 31

Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war

Jul 31

TSMC reportedly develops EMIB-like packaging to counter Intel

Jul 31

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IC MANUFACTURINGInversion Semiconductor targets ASML with particle-accelerator X-ray lithography

Aug 3, 15:48

Inversion Semiconductor is developing a particle-accelerator lithography platform that it says could deliver shorter wavelengths, higher throughput and denser chips than today's extreme ultraviolet systems, offering a new route beyond ASML's EUV architecture.

IC MANUFACTURINGIntel offers bonuses to speed up Ohio fab construction and reaches EMIB-T yields of 90%

Aug 3, 15:30

Intel is awarding bonuses for overtime work as it seeks to complete the construction of its Ohio fab complex by 2031. Meanwhile, the company has made progress on the development of its next-generation packaging technology, embedded multi-die interconnect bridge-through-silicon via (EMIB-T), positioning it to compete with TSMC.

MEMORY CHIPSCXMT closes in on LPDDR6 mass production, challenging Samsung, SK Hynix

Aug 3, 14:57

CXMT is nearing the end of research and development validation for LPDDR6, bringing it closer to mass production of next-generation mobile DRAM and intensifying competition with Samsung Electronics, SK Hynix and Micron.

IC MANUFACTURINGMA-tek sells Shanghai unit, expands AI market push in Japan and the US

Aug 3, 14:51

MA-tek announced on July 31, 2026, that it will sell 80% of its Shanghai subsidiary for about CNY1.9 billion (US$281.4 million), as global semiconductor supply chains are reshuffled and demand surges for AI, high-performance computing (HPC), advanced process nodes, advanced packaging, and silicon photonics (SiPh). The deal is expected to close and be recognized in revenue by the end of 2026.

PASSIVE, PCB, OTHER IC COMPONENTSAI infrastructure orders extend PCB expansion race

Aug 3, 13:55

Global demand for AI infrastructure is rising, and as order visibility improves, the PCB supply chain has launched a marathon of factory expansion. Upstream copper-clad laminate (CCL) materials are already in short supply, and land, plant space, and machinery are also becoming scarce resources.

IC MANUFACTURINGxLight bets on EUV light source, eyes ASML deal

Aug 3, 12:55

The semiconductor industry is grappling with a supply-demand imbalance as AI-driven demand for advanced-node chips outpaces global capacity by several times, pushing up fab utilization stress and manufacturing costs. xLight says it aims to ease that pressure by reinventing light transmission and turning it from a single-machine function into a utility-scale service.

IC MANUFACTURINGRenesas plans to phase out Takasaki factory production and expand R&D focus

Aug 3, 12:55

Renesas Electronics plans to gradually end production at its Takasaki factory in Japan over the next two to three years while strengthening research and development there. The move reflects wider supply-chain strain in legacy semiconductor manufacturing and could affect customers, workers, and global users of analog and power chips.

IC MANUFACTURINGTSMC Kumamoto fab faces first major quake test with chip-material supplies secured

Aug 3, 11:55

A magnitude 7.1 earthquake struck Kumamoto Prefecture in Japan's Kyushu region on July 28, drawing attention to the recovery of Taiwan Semiconductor Manufacturing Co's Kumamoto plant, Sony, and other local semiconductor facilities.

IC MANUFACTURINGMA-tek sells 80% stake in Shanghai subsidiary to accelerate global expansion

Aug 3, 11:50

Semiconductor testing company Materials Analysis Technology (MA-tek) approved the sale of an 80% stake in its Chinese subsidiary MA-tek Technology Testing (Shanghai), as it moves to accelerate its global footprint in the US, Japan, Europe, and Southeast Asia. The transaction is expected to complete all procedures and close by the end of 2026.

IC MANUFACTURINGApple says advanced-node capacity tightens amid 2nm race

Aug 3, 11:36

Apple reported its best-ever third-quarter results for fiscal 2026, but its guidance for the fourth quarter showed much slower growth than in the prior quarter. CEO Tim Cook said the shortage of advanced-node capacity for mobile SoCs is the biggest limit on the company's expansion.

IC MANUFACTURINGIndia advances semiconductor ambitions as Visakhapatnam OSAT plant anchors South India packaging push

Aug 3, 10:49

India is moving deeper into semiconductor manufacturing with construction beginning on an INR23.87 billion (US$250 million) OSAT facility in Visakhapatnam, supporting New Delhi's broader effort to build a domestic semiconductor ecosystem beyond chip design.

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