DIGITIMES Semiconductors news

Sep 22

India's fifth chip plant goes live, capping Suchi Semicon's three-year buildout

Prime Minister Narendra Modi virtually inaugurated commercial production at Suchi Semicon's outsourced semiconductor assembly and test (OSAT) plant in Palsana, Surat, on September 17, alongside CDIL Semiconductor's assembly, testing, marking, and packaging unit in Mohali, Punjab. The two facilities take the number of semiconductor projects in commercial production in India to five, according to The New Indian Express, joining Micron, Kaynes Semicon, and CG Semi at Sanand in Gujarat.

Anthropic, OpenAI expected to start buying memory directly in 2027

Sep 22

DeepSeek bets on Huawei chips for model training as Nvidia's China sales slip

Sep 22

Micron Taiwan union heads for strike vote as board, earnings calendar stall profit-sharing talks

Sep 22

Exclusive: China SiC capacity tightens, spilling orders over to Taiwanese foundries

Sep 22

MORE NEWS

IC MANUFACTURINGTaiwan's August export orders top US$100 billion as overseas production edges up

Sep 23, 09:27

Taiwan's export orders topped US$100 billion in August 2026, reaching US$102.96 billion, up US$5.02 billion from the previous month, according to statistics released by Taiwan's Ministry of Economic Affairs (MOEA) on September 22. Export orders for September are forecast to be between US$106 billion and US$109.1 billion, representing year-over-year growth of 50.7% to 55.1%.

IC MANUFACTURINGTaiwan courts Indian IIT chief in bid to boost chip talent ties

Sep 23, 09:05

Taiwan is stepping up outreach to India's engineering sector as global competition for chip and artificial intelligence talent intensifies. The planned cooperation could affect supply chains, university links, and where skilled graduates build careers, with implications for chipmaking hubs in Asia and beyond.

IC MANUFACTURINGWin Semiconductors expands optical communications capacity with DUV tools

Sep 23, 08:13

Optical communications capacity is in short supply as surging computing demand from AI data centers turns transmission into a bottleneck for AI infrastructure. The market is shifting toward combined optical-and-copper solutions, while optical communications rapidly advances toward 800G and 1.6T, prompting compound semiconductor foundry Win Semiconductors to expand its photodiode (PD) and laser diode (LD) capacity and co-develop 200G components with customers.

IC DESIGN, DISTRIBUTIONAscend 950 clears higher security bar in China's latest chip assessment: who else qualified?

Sep 23, 08:12

China has tightened the security and reliability framework around its domestic computing stack, with the latest official evaluation placing Huawei's Ascend 950 at Level II and Kunlunxin's M100 at Level I among AI training and inference chips. The same assessment also gave the highest Level III rating to several general-purpose CPUs, including Loongson and HiSilicon Kunpeng products, signalling that certification is becoming a more structured gatekeeper for China's locally developed compute infrastructure.

IC DESIGN, DISTRIBUTIONLightmatter launches an optical module that cuts AI cluster fiber in half

Sep 23, 08:12

US photonics company Lightmatter has launched an optical module that sends and receives data over a single strand of fiber. The company says this halves the cabling needed to connect GPUs in large AI clusters.

IC DESIGN, DISTRIBUTIONSiPearl delivers first homegrown server chips for Europe's exascale supercomputer

Sep 22

SiPearl, a fabless company backed by the European Union and France, has delivered the first Rhea1 CPU samples to Bull for integration into Europe's JUPITER supercomputer, moving the European-designed processor from bring-up and validation into customer system integration while benchmarking continues.

IC DESIGN, DISTRIBUTIONMeta's AI agent Muse tops app charts, driving AMD's market cap past US$1 trillion

Sep 22

Meta's new AI agent, Muse, has leapt to the top of app charts roughly two weeks after its release. Its popularity has helped push up chip stocks by focusing attention on the importance of CPUs for agentic AI.

IC MANUFACTURINGHermes Testing sees growth opportunity in AI-driven chip demand as OTC debut expands reach

Sep 22

Hermes Testing Solutions began trading on the over-the-counter market on September 22, positioning itself to benefit from rising demand tied to artificial intelligence and high-performance computing. The semiconductor wafer testing provider is also expanding into high-speed memory SLT, advanced packaging equipment, and SiPh CPO testing.

IC MANUFACTURINGHanmi Semiconductor ships first FC Bonder 75 for 2.5D packaging

Sep 22

Hanmi Semiconductor said on September 22 that it has shipped its first FC Bonder 75 to a customer, expanding the South Korean equipment maker's reach beyond high-bandwidth memory (HBM) into the broader system semiconductor packaging market.

IC DESIGN, DISTRIBUTIONDEEPX targets smart glasses with low-power NPU, eyes 6G AI RAN

Sep 22

South Korean AI semiconductor company DEEPX is reportedly conducting a proof of concept with a US smart glasses company to test whether its low-power neural processing unit (NPU) can balance power consumption, thermal performance, and AI computing capability.

IC MANUFACTURINGAlibaba expands full-stack AI push as cloud data centers target 20 GW by 2032

Sep 22

Alibaba Group Holding Ltd. doubled down on its full-stack AI strategy at the 2026 Apsara Conference, which opened on Sept. 22 at the Hangzhou International Expo Center. Alibaba Group chairman Joe Tsai made a rare appearance at the opening ceremony and said AI is moving from frontier exploration toward real-world deployment and large-scale applications.

More coverage

TOPICS

TSMC UPDATES

INDIA'S SEMICONDUCTOR MISSION

INTERVIEWS

Interview: Advanced packaging shifts toward system-level co-design for AI

Advanced packaging remains one of the semiconductor industry's hottest technology areas in 2026. In Taiwan, terms such as co-packaged optics (CPO), chiplets, and glass substrates are increasingly common as packaging moves deeper into system-level design.

SPECIAL REPORTS