Strong demand for AI computing is creating a capacity squeeze across the passive-component industry, opening new opportunities for Taiwanese suppliers.
Murata Manufacturing plans to begin mass production next year of iPaS, the power substrate it has spent several years developing for AI chips, a step that would carry the world's largest multilayer ceramic capacitor maker out of the passive components it dominates and into the substrate layer itself. The company is targeting annual sales of JPY50 billion (US$325.56 million) within 18 months of that launch, according to The Elec, which reported the plan after Murata showed the product at the KPCA Show 2026 in Incheon on September 9.
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains traction, Resonac CTO for semiconductor materials Hidenori Abe told DIGITIMES that the company sees five major materials challenges: warpage, plating, coating, bonding, and polishing.
ASE announced at a news briefing on September 11, 2026, that ASE's board had approved the purchase of equipment, including automated optical inspection (AOI) and automated visual inspection (AVI) systems, from related company Machvision to meet capacity expansion needs. The cumulative pretax transaction value for the past year and future purchases, based on the quotation and negotiation process, came to NT$334 million (US$10.6 million).
Kioxia's planned US listing could broaden the Japanese memory maker's access to global institutional investors as a sharp recovery in NAND profitability coincides with stronger data-center demand and a new round of capacity investment.
Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the US. Although he did not repeat his previous claim that Taiwan "stole" America's chip industry, Trump said Taiwan's chips should have been subject to heavy tariffs long ago, with tariffs of 100% or even 200%.
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what it calls the industry's first Insertion 2 automated optical test solution. As demand for photonics-integrated testing rises, the company expects equipment requirements to become more diverse and shipments to top 1,000 systems in the next 18-24 months.
Global wafer fab equipment (WFE) spending could reach about US$270 billion in 2030 as data center expansion drives demand for advanced logic, high-bandwidth memory (HBM), DRAM and advanced packaging capacity, according to Futurum Group.
Apple has raised prices on both its new iPhone 18 Pro series and older models, including the iPhone 17, as rising memory costs push up component expenses.
Chinese AI chipmaker Enflame Technology made a striking debut on Shanghai's STAR Market on Friday, with its shares opening 188% above the IPO price after raising CNY6.12 billion (US$912 million). The listing gives the Tencent-backed company fresh capital to fund its next generations of AI processors and large-scale computing systems, while sharpening attention on China's effort to build alternatives to Nvidia.
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