DIGITIMES Semiconductors news

Sep 24

TSMC locks in 3-6% wafer out price hikes for 2027

TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends to 2030. According to the sources, the company plans to adjust wafer prices from January 2027 across different processes, with hikes of about 3-6% as tight capacity and strong AI demand keep customers in line.

CXMT gains ground in DRAM as Samsung, SK Hynix shift more capacity to HBM

Sep 24

Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production

Sep 24

Nscale's biggest customer: a Singapore unit with US$1,000 in capital, owned by ByteDance's AI brand holder

Sep 24

Qualcomm sticks with TSMC for both 2nm Snapdragon flagships as Samsung steps up foundry push

Sep 24

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MEMORY CHIPSSolidigm weighs US IPO as AI storage demand lifts valuation

Sep 29, 12:46

SK Hynix's US-based NAND flash and solid-state drive (SSD) subsidiary, Solidigm, is considering a US initial public offering as early as 2027, with reports indicating a potential valuation of up to US$150 billion and a fundraising target of about US$15 billion. The move comes as AI data centers drive stronger demand for high-capacity enterprise SSDs, putting AI storage businesses in focus for capital markets.

PASSIVE, PCB, OTHER IC COMPONENTSSamsung Electro-Mechanics to invest US$5 billion in ABF substrate expansion

Sep 29, 12:43

Samsung Electro-Mechanics said it will invest KRW6.78 trillion (about US$5 billion) in South Korea and Vietnam to expand ABF substrate production for AI servers and high-performance computing (HPC) markets. Part of the funding reportedly comes from advance payments by Nvidia and other global technology companies. With Samsung Electro-Mechanics having already entered Nvidia's NVSwitch and Groq 3 supply chains, the two companies' cooperation is expected to extend from an existing supply relationship to dedicated capacity.

IC MANUFACTURINGUS, China eye US$60 billion in tariff relief, but chips stay off the table

Sep 29, 12:25

The US and China are moving toward tariff reductions on about US$60 billion of bilateral trade following last week's Trump-Xi summit, but semiconductors and other strategically sensitive sectors remain outside the arrangement.

IC MANUFACTURINGAdvanced packaging shifts toward system integration as AI renews semiconductor talent appeal

Sep 29, 11:59

At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics (IME), KLA, ASM International, the National University of Singapore (NUS), the SHINE Centre, and ASMPT discussed how advanced packaging is evolving beyond conventional chip integration, with optical interconnects, panel-level packaging, and talent development emerging as key challenges.

IC MANUFACTURINGBeyond 16 layers: HBM stacks test advanced packaging equipment makers

Sep 29, 11:55

At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding beyond the performance of individual tools to hybrid bonding, interface materials, defect metrology, process control, optical interconnects, and panel-level packaging.

MEMORY CHIPSSamsung bonus plan to lift South Korea talent race

Sep 29, 11:36

Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance bonus in late September, after a holiday break. The move comes as SK Hynix continues recruiting experienced talent, underscoring how pay systems and workplace conditions have become key to attracting and retaining workers at South Korea's semiconductor giants.

IC MANUFACTURINGGlobalFoundries eyes GaN expansion to challenge TSMC in AI

Sep 29, 11:31

GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) foundry services in 2027. GF said it was the first foundry to proactively approach TSMC and secure a GaN technology license, positioning itself to give existing customers a "seamless migration" path to its own platform.

MEMORY CHIPSSK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

Sep 29, 11:23

SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom. That means work on the generation after next is already underway with the foundry, while its HBM4 is only now being built into Nvidia's Vera Rubin superchip.

IC MANUFACTURINGGF's MIPS bets on RISC-V physical AI, expands into autos and data centers

Sep 29, 11:22

MIPS, a GlobalFoundries (GF) unit, said it has completed its integration with the ARC unit acquired from Synopsys earlier this year and is using the move to position RISC-V for physical AI, while expanding from AIoT into automotive and data center applications. MIPS said the strategy lowers the barrier for global customers to adopt GF platforms across process technologies and has pushed GF and MIPS to become the world's second-largest processor IP provider.

MEMORY CHIPSHBM to take nearly 30% of DRAM capacity as Samsung speeds up P5

Sep 29, 11:07

High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate the rollout of new memory capacity amid tightening supplies of both HBM and conventional DRAM.

IC DESIGN, DISTRIBUTIONChips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them

Sep 29, 10:53

Semiconductors made up nearly half of South Korea's exports in the first 20 days of September, while China and Hong Kong combined accounted for more than half of the country's chip shipments in August, underscoring the growing concentration of the latest export surge by both product and destination.

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