DIGITIMES Semiconductors news

Dec 18

China's EUV prototype forces a rethink of the AI chip order

China has quietly crossed a psychological and potentially strategic threshold in the global semiconductor race. In a tightly controlled laboratory in Shenzhen, Chinese scientists have built a working prototype of an extreme ultraviolet (EUV) lithography machine, the most complex and geopolitically sensitive tool in modern chipmaking, according to Reuters.

Intel completes high-NA EUV validation for 14A, advances 2D transistor tech

Dec 18

China's AMD- and Nvidia-bred GPU rivals meet on the IPO stage

Dec 18

Why OpenAI is courting AWS chips—and what it signals about cracks in its AI expansion

Dec 18

Micron's blowout quarter underscores tightening memory supply and rising AI leverage

Dec 18

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IC MANUFACTURINGTSMC's US expansion stirs security debate as Taiwan government reaffirms N-2 rule

Dec 21, 02:44

TSMC's plan to sharply expand its US footprint has reignited debate in Taiwan over technology security, even as the government insists that existing safeguards remain firmly in place.

IC MANUFACTURINGTaiwan academics seek to break through SiPh yield bottlenecks

Dec 21, 02:41

Cloud computing, GenAI, and high-performance computing continue to drive bandwidth and energy efficiency demands. Line rates have now been pushed beyond 100–200Gbps. The intense heat generated by machines poses serious rack management challenges at data centers.

IC DESIGN, DISTRIBUTIONBiren targets Hong Kong's first GPU listing after US$890M losses

Dec 21, 02:41

Shanghai-based Biren Technology has cleared its Hong Kong listing hearing, positioning itself as Hong Kong's first listed domestic GPU pure-play and a key test for China's capital-intensive AI chip sector.

IC MANUFACTURINGFoxconn's quantum advancement earns UNESCO recognition

Dec 20

Marking the 100th anniversary of quantum mechanics, the United Nations General Assembly (UNGA) proclaimed 2025 as the International Year of Quantum Science and Technology (IYQ). The United Nations Educational, Scientific, and Cultural Organization (UNESCO) launched the Quantum 100 initiative, recognizing key contributors who have made pivotal contributions to the advancement of quantum science, technology, and the broader quantum community.

MEMORY CHIPSSamsung reveals sub-10nm DRAM breakthrough targeting 0a, 0b nodes

Dec 20

Samsung Electronics has unveiled a key technology pathway for sub-10nm DRAM, offering a rare public look at how the company plans to push memory scaling beyond current 10nm-class limits and into future 0a and 0b nodes.

IC MANUFACTURINGUS scrutinizes Nvidia H200 chip exports to China as risks mount

Dec 19

The Trump administration has launched an interagency review to determine whether to authorize the first exports of Nvidia's H200 artificial intelligence chips to China, Reuters reported.

IC MANUFACTURINGTaiwan makes silicon photonics a pillar of its new national AI strategy

Dec 19

Taiwan is seeking to anchor itself at the center of the next wave of artificial intelligence infrastructure, with silicon photonics elevated to a strategic national priority.

IC MANUFACTURINGJapan poised to guarantee 80% of Rapidus chip loans

Dec 19

Japan plans to guarantee up to 80 percent of private-sector loans raised by Rapidus as the government intensifies financial backing for the chipmaker’s plan to mass-produce 2nm semiconductors, the Ministry of Economy, Trade and Industry said on December 18.

IC MANUFACTURINGTI begins shipping chips from new 300mm Sherman fab in Texas

Dec 19

TI has begun shipping chips from its newest 12-inch semiconductor fabrication plant in Sherman, Texas, marking a key milestone in the company's long-term manufacturing expansion in the US. The facility, known as SM1, is the first fab at TI's Sherman mega-site and comes online about three and a half years after construction began.

IC DESIGN, DISTRIBUTIONSamsung releases Exynos 2600 specs and confirms 2nm AP in mass production

Dec 19

According to Yonhap News and The Korea Herald, Samsung Electronics has posted a full specification sheet for its mobile application processor (AP), the Exynos 2600, on its official website. The Exynos 2600 was designed by Samsung Semiconductor's Device Solutions (DS) division under the System LSI business unit and manufactured using the company's most advanced 2nm process based on Gate-All-Around (GAA) technology. With the specifications now public, the industry's first 2nm mobile AP is expected to attract increased attention from the tech sector.

PASSIVE, PCB, OTHER IC COMPONENTSChina eases rare earth export curbs as shipments rebound

Dec 19

China has begun easing restrictions on rare earth exports by approving a series of general licenses for qualified suppliers, according to the Ministry of Commerce on December 18, 2025. The move allows for smoother shipments to overseas customers and signals a measured loosening of trade controls that had tightened earlier this year.

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