Microsoft has released architecture details for Maia 300, its third-generation Azure AI accelerator. The design pairs 96 accelerators per rack with a two-tier network that links up to 12,288 accelerators into a single superpod. The company says the system is built for cloud-scale agentic inference, and that it co-designed the software, silicon, rack infrastructure, networking, and data centers to run as one platform.

Microsoft will scale its in-house Azure Maia AI accelerators to multi-gigawatt deployments starting in 2027, making Maia the primary AI inference system for its products and services. The company also unveiled Maia 300, the third generation of the chip family, which it says will start production deployments next year.

Samsung Electronics has committed 75–80% of its 2027 memory supply, including high-bandwidth memory (HBM), to long-term agreements (LTAs), the Korea Economic Daily reported on October 9, 2026, citing industry sources. Nvidia, Google and Microsoft were among the major customers that had largely finalized contracts. Samsung has not confirmed the allocation or named the buyers.

Nanya Technology reported record quarterly earnings in the third quarter of 2026, according to unaudited results released on October 12, as DRAM average selling prices (ASPs) rose more than 60% sequentially following the expiration of low-priced long-term agreements (LTAs).

Under what the industry terms the "Filter Moore's Law," each process node shrink lowers tolerance for airborne molecular contaminants, causing filtration demand to grow exponentially. For global airborne molecular contamination (AMC) filtration leader Ye Siang Enterprise, that demand is now showing up in record revenue.

Largan chairman and CEO Adam Lin said October 2026 orders are tracking at roughly the same level as September's, but will begin declining in November as customers cut their forecasts after new phones went on sale. The comments signal that demand across the smartphone supply chain will weaken in the fourth quarter of 2026, creating challenges for handset chipmakers and other suppliers that performed strongly during the third quarter.

Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This is expected to approximately double its production capacity for mold underfill (MUF) materials and approximately triple that for compression-molding granules.

Hermes Testing Solutions (HTSI) reported September revenue of NT$514 million (US$16.10 million), up 2.35% month over month and 150.33% year over year, as shipments of customized products, membrane probe cards and cleaning materials increased. The wafer testing solutions provider said the results reflected rising demand for advanced testing capabilities supporting artificial intelligence (AI) and high-performance computing (HPC) chips.

As US defense procurement restrictions and European Union (EU) supply-chain due diligence requirements advance, South Korean risk-intelligence startup Helios is targeting verification needs in Taiwan and South Korea's AI, semiconductor, and defense industries. The company plans to bring public-information analysis and on-site verification services to Taiwan while strengthening maritime-threat analysis around the Taiwan Strait for corporate and national-security applications.

Taiwan's exports hit a single-month record high of US$87.22 billion in September 2026, lifting the year-to-date total for the first nine months of the year to US$661.55 billion, according to customs import and export statistics released by Taiwan's Ministry of Finance (MOF) on October 8. Exports to the US totaled US$207.78 billion in the first nine months, a level the ministry called "unprecedented."