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Tuesday 25 August 2026
AI boom drives Foxconn past 40% of Taiwan-listed firms' China returns, with FII leading the way
Global demand for AI and high-performance computing (HPC) has lifted investment returns for Taiwan-listed companies in China, with Foxconn continuing to lead the pack. According to CRIF, Foxconn's total China investment returns in the first half of 2026 reached NT$117.6 billion (US$3.7 billion).
Tuesday 25 August 2026
Vera Rubin transition gap eases as ASIC, general servers rescue supply chain
As Nvidia's next-generation Vera Rubin platform enters deployment, Taiwan's server supply chain is finding ways to bridge the transition gap before ramping up volume production. Ongoing shipments of the existing GB series, custom ASIC server deployments led by Google and Amazon Web Services (AWS), and general-purpose servers are all providing revenue support to cushion the interim shortfall.
Tuesday 25 August 2026
Intel pitches Diamond Rapids at Hot Chips as server CPU competition heats up
Intel pitched its next-generation Diamond Rapids Xeon at Hot Chips 2026 as the company bets that agentic AI will increase the role of general-purpose processors in AI infrastructure, even as AMD and Arm gain ground in the server CPU market. The company also detailed Crescent Island, a GPU aimed at AI inference, and Wildcat Lake for client and edge systems.
Tuesday 25 August 2026
OmniVision's CIS business slips, but machine vision and robotics surge 71%
OmniVision Group reported a sharp drop in first-half 2026 profit as weakness in consumer electronics and automotive electronics weighed on its core image sensor business, even as machine vision, robotics and edge AI emerged as faster-growing sources of revenue.
Tuesday 25 August 2026
TSMC, Intel, and Samsung battle over backside power delivery below 2nm
As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered to the chip. With Intel, TSMC, and Samsung Electronics each betting heavily on backside power delivery, the race is entering a new phase.
Tuesday 25 August 2026
China-based Guangyu Xinchen says 3D-stacked edge AI chip has entered mass-production deployment
According to 36Kr, Shanghai Guangyu Xinchen Technology says its TC1000 series of 3D-stacked near-memory-computing AI processors has moved from silicon validation to mass-production deployment, marking a claimed acceleration in the commercialization of memory-centric computing for edge AI.
Tuesday 25 August 2026
Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects
Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027, including Grace Blackwell and the next-generation Vera Rubin platform. The move is expected to ripple through the chip and system supply chain, while industry figures say it could also lift the appeal of inference ASICs.
Tuesday 25 August 2026
Novosense encoder launch highlights China's push into robot joint sensing
Chinese analog and mixed-signal chipmaker Novosense Microelectronics has introduced the NSM350x series, a Hall-based magnetic encoder designed for high-precision angular measurement in robot joints and industrial motion-control systems, reports Sina Finance.
Tuesday 25 August 2026
Infineon buys India-based C2i Semiconductors to bolster AI data center power systems
Infineon Technologies has agreed to acquire Bangalore-based C2i Semiconductors, a move that strengthens its position in power delivery for AI data centers and highlights India's growing role in chip design. The deal could shape how global operators manage rising energy demand, efficiency pressures, and next-generation computing workloads.
Tuesday 25 August 2026
Nvidia Groq 3 LPX enters full production for faster agentic AI inference

Nvidia said its Groq 3 LPX inference accelerator is now in full production, a move that could speed up agentic AI systems used worldwide for coding, reasoning, and other tasks. The company said the platform is designed to improve responsiveness, lower latency, and support growing demand for real-time AI applications.

Tuesday 25 August 2026
SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems are built and run worldwide. The partnership also extends toward orbital computing, signaling a broader shift in where future AI infrastructure may be located.

Tuesday 25 August 2026
IBM unveils dual-architecture mainframe chip to run Arm, z/OS, Linux workloads

In an August 24 press release, IBM announced that it is developing the first dual-architecture mainframe processor, a move that could let global enterprises run Arm-native and IBM workloads on the same future systems. The milestone may broaden software choices, accelerate AI adoption, and reshape mission-critical computing for banks, governments, and large cloud operators worldwide.

Tuesday 25 August 2026
Broadcom's debt push signals AI compute is becoming Wall Street asset class
The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly confronting a second bottleneck: how to finance hardware and data-center capacity at the scale frontier-model developers now require.
Tuesday 25 August 2026
SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical and economic limits of scalability.
Monday 24 August 2026
Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving
Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC manufacturing while reducing dependence on external chip suppliers.
Monday 24 August 2026
Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger package footprints, higher layer counts, lower warpage, and higher accuracy. However, relying solely on incremental upgrades to traditional manufacturing processes is hitting a physical wall. This bottleneck is compelling the industry to evaluate next-generation core layer materials.
Monday 24 August 2026
Nvidia's strikes US$6B licensing deal with Poolside to accelerate Nemotron models
Nvidia reportedly struck a US$6 billion deal with startup Poolside to license its technology and hire much of its staff. The technology and personnel will reportedly support the chipmaker's Nemotron models in a bid to compete with China's strength in open-source models, but the deal also puts Nvidia in competition with some of its biggest customers.
Monday 24 August 2026
Taiwan semiconductor materials hit golden opportunity
Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of Everlight Chemical and Chairman of the Taiwan Chemical Industry Association (TCIA), noted that Taiwan boasts the world's largest tier-one customer demand alongside the most stringent process specifications. This unique position, he stated, presents a "once-in-a-century golden opportunity" for local semiconductor material development.
Monday 24 August 2026
MediaTek, GUC, Alchip escalate funding war as global ASIC race demands deep capital
Custom Application-Specific Integrated Circuit (ASIC) chips backed by hyperscalers are set for a mass-production boom starting late 2026, with next-generation projects already in full swing across development and supply-chain reservation. Industry insiders note that chipmakers have entered an era of all-out fundraising warfare, racing to secure capital, capacity, and key clients.
Monday 24 August 2026
AI chip roadmaps force faster changes in data-center design, Cadence says
Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according to Cadence Design Systems. This is narrowing a gap that once separated semiconductor development from facility engineering.
Monday 24 August 2026
ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from a supporting role in the supply chain to a critical factor in technological breakthroughs. SEMI has announced the formation of the "SEMI Semiconductor Materials Alliance," bringing together 35 materials, equipment, wafer fabrication, packaging, and testing companies, as well as industry, government, academia, and research organizations, including Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC), ASE, and Micron Technology, to speed material validation for emerging technologies such as co-packaged optics (CPO) and panel-level packaging (PLP), with the goal of accelerating mass production.

Monday 24 August 2026
Jeilin shifts upmarket as high-end image SoCs drive margins higher
Jeilin's move into higher-end image-processing chips is reshaping its revenue mix and boosting profitability, with implications for cameras, security devices, and drones used by customers worldwide. The Taiwan-based chip designer said new products, tighter cost controls, and broader market reach are helping it compete in a consolidating industry.
Monday 24 August 2026
AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030
Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models (LLMs) toward collaborative teams of AI agents with different roles and capabilities. He also revisited the seven-layer AI architecture he previously proposed, contrasting it with NVIDIA CEO Jensen Huang's five-layer "cake."
Monday 24 August 2026
Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category is now moving toward a three-tier hardware architecture of the brain, cerebellum, and peripheral nerves. He said the shift is reshaping the market and setting the stage for rapid growth through 2030.

Monday 24 August 2026
Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory
ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst Stella Weng said. She also said AI is driving a "qualitative change" in memory architecture inside AI servers.