Chinese companies are shifting more AI accelerator spending away from Nvidia and toward domestic suppliers, a sign that US-China technology tensions are no longer just reshaping chip exports, but the buildout of China's AI infrastructure itself.
Venture capitalists from Japan, Singapore, and Salesforce Ventures converged at the 2026 Asia VC Summit in Taipei to argue that Asian startups should prioritize regional expansion over jumping straight into the US market. They pointed to cross-border collaboration within Asia as a more viable path to building competitive tech companies.
The UK is pitching itself as a new base and technology partner for Taiwanese electronics suppliers as AI demand shifts from models to the physical infrastructure behind them: chips, packaging, servers, cooling, power, and data centers.
Salesforce Ventures laid out how the AI boom has reshaped its investment strategy over the past three years at the 2026 Asia VC Summit today, while acknowledging it has yet to close its first deal in Taiwan despite actively searching for one.
Samsung Electronics Chairman Jae-yong Lee departed for the Sun Valley Conference in the US on July 7, marking his second straight year at the event as he looks to deepen AI cooperation with global tech giants. Industry watchers expect the trip to help Samsung expand its ties with major customers and partners.
A Chinese research team has developed a phase-change memristor-based neural dynamical system chip, offering a potential hardware path for real-time brain modeling, brain-computer interfaces, and brain disease diagnosis.
Speaking at the Taiwan Venture Capital and Private Equity Annual Conference on July 7, Foxconn Chairman Young Liu outlined the company's evolving investment strategy amid the restructuring of global technology supply chains.
Tokyo Artisan Intelligence said it has finished validating its Sting Ray test chip, a step that could broaden access to lower-power edge AI hardware for industries worldwide. The milestone highlights how startups and foundries are pushing specialized chips that may ease energy pressure from AI, even as they support real-time applications in factories, transport, and infrastructure.
Analog Devices (ADI) has reportedly notified customers of extended delivery lead times for certain products, with lead times now reaching six months. The company has advised customers to place orders at least six months in advance to help secure an adequate chip supply.
Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according to sources within China's supply chain. The lineup is expected to launch in September 2026 and will be the first to feature Huawei's new Kirin 2026 flagship processor, which is based on the company's Tau Scaling (τ) concept. The device is expected to be one of Huawei's flagship demonstrations of its post-Moore semiconductor strategy.
China's IC design industry is nearing CNY1 trillion (approx. US$150 billion) ahead of schedule, but AI is exposing deeper gaps in computing architecture, high-end talent, and ecosystem control.
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
