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Tuesday 24 March 2026
China's AI GPUs face equipment and software constraints, but system-level design boosts self-reliance
Although it may appear that China's AI GPU development is behind the US by one or more generations, a recent Morgan Stanley report reveals the actual gap is smaller than widely perceived.
Tuesday 24 March 2026
Alibaba unveils XuanTie C950 and C925, advancing RISC-V into AI and edge computing

Alibaba's DAMO Academy has introduced two new RISC-V processors—the flagship XuanTie C950 and the energy-efficient C925—marking a significant step in pushing the open-source architecture into both high-performance AI and edge applications.

Tuesday 24 March 2026
Trump administration's 'Pax Silica' fund to strengthen global semiconductor and AI supply chains
The Trump administration set up a US$250 million fund intended to grow out of its "Pax Silica" initiative launched in December 2025, aimed at supporting global supply chains for semiconductors, artificial intelligence (AI), and critical minerals, according to the New York Times. The fund represents the first step in a voluntary consortium that could attract up to US$1 trillion in investments from allies, including Singapore, the United Arab Emirates (UAE), Qatar, Sweden, Japan, South Korea, Israel, Britain, and Australia, with the US committing US$250 million.
Tuesday 24 March 2026
Nvidia opens server racks to rival chips, expanding cloud infrastructure role

Nvidia is expanding its role in artificial intelligence (AI) infrastructure by designing server racks that can accommodate processors from its competitors, according to a report by The Information, citing people familiar with the matter.

Tuesday 24 March 2026
Huawei's Ascend 950PR debuts with nearly 3x H20 performance, targets China's AI compute gap
Huawei has officially launched its Ascend 950PR processor and introduced the Atlas 350 AI accelerator card equipped with this chip, marking the commercial debut of its next-generation inference computing platform. At Huawei China Partner Conference 2026, the company showcased the Ascend 950PR AI chip, highlighting that a single Atlas 350 card delivers up to 2.87x the compute power of Nvidia's H20, emphasizing its FP4 low-precision inference capabilities, a rare feature among AI accelerators in the Chinese market.
Tuesday 24 March 2026
Zeiss deepens Taiwan investment, taps new semiconductor lead as GM
Zeiss is significantly intensifying its investment in Taiwan, positioning the island as a premier global hub for its optical and semiconductor technologies. This strategic shift, marked by the appointment of Henry Cai as the new General Manager of Zeiss Taiwan, signals a move beyond product distribution toward deep-tier research and development collaboration.
Tuesday 24 March 2026
Commentary: From chip performance to inference economics, Jensen Huang rewrites AI industry trends at GTC
Over the past three years, Nvidia founder and CEO Jensen Huang has returned to the same two-axis chart at each annual GTC conference — but the story that chart tells has shifted dramatically, from a technical argument aimed at engineers to a financial argument aimed at CEO and boards of directors. That evolution is not accidental. It is a deliberate, multi-year strategy to elevate Nvidia's compute platform procurement from a line item in an IT budget to a question of corporate competitiveness.
Tuesday 24 March 2026
The chip gap: How Alibaba is pulling away from Tencent in China's AI arms race
Alibaba Group has been quietly building something big. Over recent years, it has pushed steadily into in-house chip development — moving from design and research all the way to large-scale commercialization, all in a bid to cut reliance on external suppliers.
Tuesday 24 March 2026
Meet the South Korean firm wafer wobbling for Samsung and TSMC
As semiconductor advanced processes continue to evolve, the factors affecting yield and equipment stability have grown increasingly complex. One long-standing challenge troubling chipmakers such as Samsung Electronics, SK Hynix, and TSMC is wafer wobbling. Korean smart equipment solution provider GSF Solution has introduced a new integrated approach — combining sensing, algorithms, and edge AI — to address the problem.
Monday 23 March 2026
Inergy Technology eyes SiC expansion for HVDC as AI power demand rises
Power semiconductor design company Inergy Technology expects strong growth momentum in its cooling and power device businesses in 2026, supported by rising demand from artificial intelligence (AI) data centers, with AI server-related products projected to account for 25% of its portfolio.
Monday 23 March 2026
India's FDI reset opens controlled door to Chinese participation in semiconductor supply chains
India's decision to ease foreign direct investment (FDI) restrictions for neighboring countries marks a calibrated shift in policy that could reshape its electronics and semiconductor supply chains, even as geopolitical sensitivities remain intact.
Monday 23 March 2026
Meet the duo bridging Jensen Huang to Taiwan at GTC 2026
At Nvidia's GTC 2026 conference last week, two figures were notable in helping CEO Jensen Huang connect with major Taiwanese business partners.
Monday 23 March 2026
Nvidia sees self-driving cars as a long-term growth engine
Beyond its GTC conference, autonomous vehicles have long stood out as a key application in Nvidia's AI ecosystem. For the company, revenue from self-driving systems represented only about 1% of total sales in 2025. Yet Chief Executive Jensen Huang views the segment as a strategic foothold akin to the early days of CUDA — a launchpad from which the company could potentially scale into multi-trillion-dollar markets.
Monday 23 March 2026
Nvidia pushes deeper into AI inference to counter custom chip rivals
At its GTC 2026 conference, Nvidia showcased a slate of technologies and new products squarely aimed at the next wave of artificial intelligence inference. With the integration of Groq's LPU technology, Nvidia's portfolio appears markedly more competitive on the inference side — widely seen as a strategic effort to defend its market share and discourage customers from turning to application-specific integrated circuits, or ASICs.
Monday 23 March 2026
Weekly news roundup: geopolitics, AI memory, racing for semiconductor control
Below are the most-read DIGITIMES Asia stories from the week of March 16-22, 2026:
Monday 23 March 2026
Can Elon Musk's Terafab turn chip independence into reality—or is it too ambitious to succeed?
Elon Musk has unveiled one of his most ambitious industrial visions yet: a "Terafab" that would allow Tesla and SpaceX to design and manufacture their own semiconductors for artificial intelligence, robotics, and even space-based data centers. While the project reflects Musk's sweeping vision of a vertically integrated, AI-driven future, analysts and industry realities suggest the plan may face formidable technical, financial, and structural obstacles.
Monday 23 March 2026
Commentary: CPO mass production put to test as photonic integration faces challenges
Driven by massive demand from cloud AI, silicon photonics continues to gain momentum. At the Optical Fiber Communication Conference (OFC 2026), industry players engaged in in-depth discussions on the current state of co-packaged optics (CPO) mass production. IC design experts observed that, compared with previous OFC events, which focused primarily on new technological breakthroughs, the industry in 2026 is clearly more concerned with whether solutions can be delivered on time.
Sunday 22 March 2026
Samsung union votes to strike, risking Nvidia HBM4 supply disruption
Samsung Electronics' labor union has voted overwhelmingly to initiate dispute proceedings following a breakdown in wage negotiations, raising concerns over potential disruptions to the supply of HBM4 memory for Nvidia's next-generation AI accelerators.
Sunday 22 March 2026
MediaTek, Microsoft Research crack AOC power barrier with Micro LED, 50% reduction

A joint R&D team, including MediaTek, Microsoft Research, and other suppliers, has developed a next-generation active optical cable (AOC) based on miniaturized Micro LED light sources. The Active Micro LED Cable delivers copper-like reliability while significantly extending transmission distance.

Saturday 21 March 2026
Analysis: Samsung's Exynos chip rebounds with mixed performance in 2nm era
Samsung Electronics' self-developed mobile application processor (AP) series, Exynos, long criticized for poor performance and overheating issues, is showing signs of revival. The new Exynos 2600, built on the advanced 2nm second-generation process (SF2), has delivered unexpectedly strong performance results compared to its previous chips, laying a foundation for the once-struggling chip line to bounce back.
Friday 20 March 2026
Lumotive makes optical breakthrough, targets 10,000-port data centers

As Nvidia and Coherent signal a shift toward all-optical networking to solve the AI power crisis, Redmond-based Lumotive has announced a milestone that could redefine data center scalability. In an interview with DIGITIMES Asia, Gleb Akselrod, Co-founder and CTO of Lumotive, detailed the success of the world's first programmable 2D optical beamforming chip.

Friday 20 March 2026
Nvidia and AWS strike massive GPU supply deal through 2027

On March 19, senior executives at Nvidia said the company has reached an agreement with the cloud computing division of Amazon to supply large-scale GPU infrastructure through 2027.

Friday 20 March 2026
Commentary: Nvidia sees Groq as its next Mellanox
Since the start of 2026, Jensen Huang has twice drawn a striking parallel: likening a potential deal involving Groq to Nvidia's 2020 acquisition of Mellanox Technologies. He first made the comparison during a late-February earnings call, and again in an interview following his keynote at GTC 2026 in March.
Friday 20 March 2026
As NAND makers move on, MLC memory nears the end of the line

As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance and edging toward obsolescence.

Friday 20 March 2026
UK-Taiwan R&D ties scale up with Foxconn, Turing Space, NSYSU
Taiwan has long leveraged its manufacturing strengths to carve out a place in the global supply chain. Now, it is going further. With research and development reach expanding overseas, the country is shifting from contract manufacturing to joint innovation. The UK-Taiwan Innovative Industries Programme (I2P), run under the British Office Taipei and ITRI, has hit a record scale in 2026, with 17 research and development teams taking part in bilateral exchanges.