Electronic component distributor Honey Hope Honesty Enterprise (3H) reported December 2025 revenue of NT$652 million (US$20.63 million), up 52.01% year over year. The strong growth was primarily driven by urgent customer orders, which boosted sales. For the full year of 2025, cumulative revenue reached NT$5.43 billion, up 15.75% compared to 2024.

Taiwan and Europe will continue to strengthen collaboration in advanced fields such as drones, robotics, and low Earth orbit (LEO) satellites in 2026, according to Chao-chung Kuo, director general of the Department of Industrial Technology (DOIT) at the Ministry of Economic Affairs (MOEA). Kuo made the announcement at a press conference hosted by the DOIT on January 7, which showcased the results of cross-national collaborative R&D efforts with Europe. These include Innolux's entry into the market for high-voltage EV charging, and MediaTek's collaboration with Eutelsat OneWeb. In addition, the number of countries participating in the Eureka Network's Globalstars program is expected to increase to seven in 2026.

At the opening of his keynote, Nvidia CEO Jensen Huang delivered a stark message: the world's US$10 trillion computing infrastructure is entering a fundamental modernization phase, driven by two platform shifts unfolding in parallel.

India's backend semiconductor makers see temporary relief from material constraints linked to legacy packaging, as KLA opens a US$36 million R&D hub in Chennai to boost AI, software, and process control capabilities.

India has made measurable progress in nurturing a domestic semiconductor chip design ecosystem, with early outcomes emerging from government-backed programmes aimed at reducing dependence on imported intellectual property and strengthening participation in higher-value segments of the global chip industry.

Following the US government's decision to ease restrictions on Nvidia H200 chip exports to China, Wei Shaojun, vice chairman of the China Semiconductor Industry Association (CSIA), warned domestic firms to exercise caution when placing orders, saying Washington's true strategic intent remains unclear.

At CES 2026, Qualcomm Technologies highlighted new collaborations and growing adoption of its Snapdragon Digital Chassis solutions, aiming to advance software-defined vehicles (SDVs) and agentic AI-driven in-cabin experiences. The company outlined updates across infotainment, digital cockpit, advanced driver-assistance systems (ADAS), and end-to-end automated driving platforms.

Nvidia's next-generation AI superchip, Vera Rubin, has become the center of industry debate following comments by CEO Jensen Huang at CES 2026, where he said the product had entered the production phase. The statement has drawn scrutiny from the semiconductor supply chain, particularly memory makers, as questions emerge over the readiness of sixth-generation high-bandwidth memory (HBM4) for commercial deployment.

Volkswagen Group and Qualcomm Technologies have announced a Letter of Intent (LOI) for a long-term supply agreement to provide advanced infotainment and connectivity solutions for the automaker's software-defined vehicle (SDV) architecture. The intended deal, expected to take effect with vehicles launching from 2027, will see Qualcomm supplying high-performance system-on-chips (SoCs) for infotainment functions through Volkswagen Group's joint venture with Rivian Automotive, Rivian and Volkswagen Group Technologies (RV Tech).

China is preparing to approve limited imports of Nvidia's H200 AI chips as early as this quarter, potentially reopening a key market for the US chipmaker while maintaining strict national security safeguards, according to Bloomberg, citing people familiar with the matter.

Nvidia CEO Jensen Huang announced that the company's new Vera Rubin has entered mass production and is preparing for widespread shipments. The design represents a rare major engineering overhaul for Nvidia, involving significant changes to assembly and manufacturing processes with deeper direct involvement from the company.

Nvidia recently acquired Groq's technology license and integrated its core technical team, sparking curiosity about the chip giant's investment philosophy. At CES 2026, Nvidia CEO Jensen Huang outlined the company's three main investment focuses that guide how it deploys its abundant cash reserves.

At CES 2026, Nvidia CEO Jensen Huang identified physical AI as the next significant evolution in artificial intelligence. Huang categorized physical AI into two main types: one involving direct interaction with the physical world through robots and autonomous vehicles, and the other focusing on understanding physical laws for applications such as weather forecasting and protein structure prediction.

MediaTek is preparing to commence large-scale manufacturing of its new Wi-Fi 8 solution, the Filogic 8000, by the end of 2026, in response to heightened demand from telecom operators seeking cross-generational network upgrades. The company unveiled the technology at CES 2026 in the US, signaling a decisive push toward serving evolving market requirements.

Nvidia officially introduced its next-generation autonomous driving platform, Drive AGX Hyperion, at CES 2026 in Las Vegas, signaling an important shift in the self-driving industry. The new platform represents a move away from isolated development efforts by automakers and Tier 1 suppliers toward a collaborative, ecosystem-based approach for scalable, certifiable autonomous driving systems.

To overcome AI's limits, a bridge must be built between computer science and biology, according to Kea-Tiong Tang, a professor from Taiwan's National Tsing Hua University (NTHU) and a leading scholar in neuromorphic computing. Tang recently led a Taiwan team to the US for CES in 2026, demonstrating efforts to break from the traditional von Neumann architecture.

Arm Holdings has restructured its operations to create a Physical AI business unit. The move expands its footprint in robotics, as automation systems dominated this year's Consumer Electronics Show.

Chinese authorities have reportedly asked domestic tech companies to halt orders for Nvidia's H200 AI chips, according to Reuters, signaling tighter oversight even as US export licenses near completion. The move reflects Beijing's broader push to prioritize domestic semiconductor development while managing foreign chip adoption.

Qualcomm Inc. introduced its Snapdragon X2 Plus platform at CES 2026, the newest addition to the Snapdragon X series aimed at professionals, emerging creators, and regular users. The platform promises fast, responsive performance, along with multi-day battery life and portability, addressing diverse computing needs.

Samsung Electronics reported a strong rebound in profitability in the fourth quarter of 2025, supported by rising memory chip prices and sustained global demand from AI data center operators, according to its preliminary consolidated financial results released under fair disclosure rules.

Huawei has signalled a renewed push into South Korea's AI infrastructure market, outlining plans to introduce its next-generation AI processor — widely expected to be the Ascend 950 — packaged with an end-to-end stack spanning hardware, software, networking, and storage.

Bao Yungang, vice director of the Chinese Academy of Sciences' Institute of Computing Technology and chief scientist at the Beijing Open Source Chip Academy, predicts RISC-V will become the world's third mainstream CPU ecosystem alongside x86 and Arm within five to ten years.

Marvell Technology has agreed to acquire XConn Technologies to strengthen its position in PCIe, CXL, and UALink switching for AI data center infrastructure, as demand grows for scale-up connectivity in multi-rack accelerator systems.

AMD CEO Lisa Su stated at CES 2026 that the industry has officially entered the "YottaScale" era, marking a shift toward new performance benchmarks. In an interview with CNBC, Su also explained that AI has not slowed the company's hiring pace, that AMD is actively recruiting and prioritizing candidates who are "AI forward."