Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture, faster data movement and tighter coordination between chips, software and AI models.

AMD CEO Lisa Su indicated during the company's second-quarter 2026 earnings call that an estimate of roughly US$30 billion in 2027 Instinct revenue may be too conservative, telling analysts that the data center AI figure was "probably too low."

Onsemi's leadership fielded a wide range of investor questions following the company's second-quarter 2026 results, with much of the discussion centered on its accelerating AI data center business, capacity utilization, and how the company is managing rising input costs.

China has revised its regulations on the protection of integrated circuit (IC) layout designs, introducing stricter registration requirements, stronger enforcement measures and clearer commercialization rules as Beijing steps up efforts to strengthen its domestic semiconductor industry amid ongoing US technology restrictions.

Montage Technology has begun pilot production of what it says is the industry's first CXL 3.2 memory expansion controller, targeting growing memory capacity and pooling requirements across AI, cloud computing and data centers.

RichWave Technology said at a recent earnings call that Wi-Fi 7 adoption continues to rise rapidly, with strong demand from telecom operators and retailers. The radio frequency (RF) front-end supplier said that the second half of 2026 should be slightly better than the first half of the year overall, but warned that tight supply of memory and passive components could affect shipment timing.

ChipAgents, a two-year-old startup building autonomous AI agents for chip design and verification, has raised an additional US$60 million in Series A2 funding, taking its total Series A financing to US$134 million just six months after the round first closed.

MediaTek said at its latest earnings call that its second-generation data-center ASIC product remains on schedule for mass production in 2028, and that the Intel embedded multi-die interconnect bridge (EMIB) advanced packaging process it uses has already reached a very good yield level. MediaTek also said its first-generation product remains on track for volume ramp-up in the fourth quarter of 2026 and is expected to generate US$2 billion in revenue.