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Thursday 22 January 2026
Cloud ASIC shipments set to surge in 2026; memory capacity remains key risk
2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major cloud service providers (CSPs), but Taiwanese firms MediaTek, Alchip, and GUC also have new products entering mass production. These developments are expected to deliver solid revenue contributions despite ongoing market uncertainties.
Thursday 22 January 2026
Google's TPU strategy said to give Inventec larger role in AI server manufacturing

Servers built around custom AI chips, known as application-specific integrated circuits (ASICs), have emerged as a focal point of the global server supply chain.

Thursday 22 January 2026
Intel taps Qualcomm GPU veteran Eric Demers to lead AI-focused graphics engineering

Eric Demers, a veteran GPU architect who until recently served as Senior Vice President of Engineering at Qualcomm and led its GPU business, is leaving the company to join Intel, according to a disclosure he made on LinkedIn.

Thursday 22 January 2026
Taiwan PCB direct shipments to the US remain limited
The US has lowered the tariff rate on Taiwan to 15%, and it will not be stacked with the most-favored-nation (MFN) tariff rate. This places Taiwan on the same baseline as Japan, South Korea, and EU countries. It is also better than the previously agreed rates of 19% and 20% for Thailand and Vietnam, respectively. Regarding semiconductor tariffs derived from Section 232, as long as the products are supplied for use by cloud service providers (CSPs), government agencies, and other such purposes, they meet the exemption conditions set by the US. This means that Taiwan's AI products exported to the US are essentially unaffected and benefit from zero-tariff preferential treatment.
Wednesday 21 January 2026
Siemens acquires ASTER to strengthen PCBA test and DFM capabilities
Siemens has acquired ASTER Technologies, a privately held provider of printed circuit board assembly (PCBA) test verification and engineering software, as it moves to expand its electronic design automation (EDA) portfolio. Financial terms of the deal were not disclosed.
Wednesday 21 January 2026
Jabil invests in semiconductor power systems, expanding chipmaking footprint
Jabil Inc., the global manufacturing and supply-chain services company, said on Tuesday that it had made a strategic minority investment in Eagle Harbor Technologies, a Seattle-based developer of advanced power systems for semiconductor manufacturing, and would partner with the company on production.
Wednesday 21 January 2026
Intel recruits Qualcomm GPU chief to lead future AI PC efforts
Intel has poached Eric Demers, a veteran GPU architect, known for developing Qualcomm's proprietary Adreno GPU architecture. Demers will become Intel's senior vice president of GPU engineering. This suggests that even though Intel has long been unable to compete with Nvidia and AMD in the GPU market, it still hopes to strengthen its own GPU capabilities.
Tuesday 20 January 2026
AI server watch: AI servers lift Taiwan supply chain broadly in 2025, gains center on ODM/EMS, cooling, optical
Taiwan's AI server supply chain delivered broad-based growth in 2025, fueled by surging generative AI and cloud data center spending, but the biggest gains clustered around two areas: system-level integration led by original design manufacturer (ODM)/electronics manufacturing services (EMS) manufacturers, and a set of high-power, AI-specific components—especially thermal solutions, rack hardware, and high-speed optical interconnect.
Tuesday 20 January 2026
Advantest faces three standardization challenges in shift-left testing
The silicon photonics (SiPh) and common packaged optics (CPO) solutions supply chains are emerging this year. Japanese testing equipment maker Advantest says that although optical communications have advantages in energy efficiency and high transmission speeds, there remains three major technical challenges that have yet to be standardized before related chip products are formally launched. These issues will need to be addressed as the industry transitions from electrical to optical communications.
Tuesday 20 January 2026
Apple, Qualcomm, MediaTek align on 2nm chips in 2026 as specs lose consumer appeal
Apple Inc., Qualcomm Inc., and MediaTek are all set to advance their smartphone system-on-chip (SoC) offerings to the 2nm process node in 2026. This coordinated move signals the three giants' determination to maintain technological leadership, even as the incremental benefits of process improvements come under scrutiny.
Tuesday 20 January 2026
Taiwan IC designers wager on algorithms for the next boom
Taiwanese integrated circuit design houses used the 2026 Consumer Electronics Show in the US to seek new partnerships, signaling that success in the next phase of edge artificial intelligence will depend as much on software and algorithms as on silicon.
Tuesday 20 January 2026
Taiwanese PMIC makers see stable demand in industrial, automotive sectors as global focus shifts
Demand for power management integrated circuits (PMICs) from Taiwanese manufacturers is showing signs of stabilization, particularly in cloud AI servers, industrial control, and automotive markets, industry sources said. While consumer applications continue to experience seasonal declines, leading global PMIC players are concentrating on higher-end fields, creating opportunities for Taiwanese firms to expand.
Tuesday 20 January 2026
Smartphone chips hit 2nm in 2026. The real shock is the cost
Leading smartphone system-on-chip (SoC) manufacturers will fully adopt the 2nm process node in 2026, a move expected to significantly increase production costs and reshape competitive dynamics beyond flagship devices.
Monday 19 January 2026
Weekly news roundup: memory shortages, packaging power, TSMC's global pivot
Below are the most-read DIGITIMES Asia stories of the week of January 12-18, 2026.
Monday 19 January 2026
OpenAI taps Cerebras for US$10 billion AI chip buildout
OpenAI said it would partner with the artificial intelligence chip maker Cerebras to build 750 megawatts of ultra-low-latency AI computing capacity, a project that will come online in phases starting in 2026. Construction is expected to begin this year and continue through 2028.
Monday 19 January 2026
Commentary: US and Taiwan finalize tariff deal, securing favorable terms for semiconductor exports

The US and Taiwan have formally concluded a tariff agreement that sets a 15% rate on covered goods, alongside a sweeping package of Taiwanese commitments aimed at deepening ties with the American semiconductor industry. Under the deal, Taiwan will make US$250 billion in direct investment in US semiconductor manufacturing, while its government will provide an additional US$250 billion in credit guarantees.

Monday 19 January 2026
OpenAI and Cerebras reach US$10 billion agreement to reduce Nvidia dependence
OpenAI has reached a multi-year compute procurement agreement worth more than US$10 billion with AI chip startup Cerebras Systems, with the intention to enhance ChatGPT performance and reduce its reliance on Nvidia. According to The Wall Street Journal and Bloomberg, OpenAI said in a statement that it has committed to purchasing up to 750 MW of computing capacity from Cerebras by 2028. Contract terms were not disclosed, but people familiar with the matter said the deal value exceeds US$10 billion.
Monday 19 January 2026
Taiwan's DDI chipmakers fight for survival beyond displays

Taiwanese DDI vendors rode a post-pandemic growth wave, but demand turned increasingly uncertain in 2025. Weak consumer end markets, slowing specification upgrades, and intensifying competition from Chinese rivals have sharply raised pressure on local suppliers.

Sunday 18 January 2026
Research Insight: Qualcomm's Ventana deal signals push to reduce Arm reliance and deepen RISC-V bets
On December 10, 2025, Qualcomm Inc. disclosed its acquisition of Ventana Micro Systems in the US without revealing the deal's financial terms or completion date. The company highlighted that the move would reinforce its global leadership in the RISC-V ecosystem and improve its CPU development capabilities, complementing its existing Oryon custom CPU team.
Saturday 17 January 2026
Research Insight: System-level design, energy efficiency, and TCO drive AI hardware competition
AMD introduced its Helios system platform at CES 2026, marking a significant move in cloud AI computing competition from traditional single-chip performance to full rack-scale solutions. This development follows Nvidia's GB200 NVL series release and Google's TPU-based rack product plans disclosed by Broadcom, underscoring an industry trend toward delivering computing power through integrated system platforms rather than isolated chips.
Saturday 17 January 2026
Top 10 Chart: Taiwan's IC design sector ends 2025 with an AI-led split
Taiwan's IC design segment posted a visibly divergent finish in December 2025, with AI/HPC, data center, and enterprise storage-related suppliers closing the year strongly, while consumer electronics-facing lines weakened amid seasonality, cautious panel and handset component pull-ins, and ongoing inventory adjustment.
Saturday 17 January 2026
In Jodi Shelton’s new podcast, Jensen Huang says Nvidia was forged by suffering

In the inaugural episode of a new leadership podcast, Jensen Huang offers a strikingly unvarnished account of how Nvidia became one of the world's most valuable technology firms.

Friday 16 January 2026
Xiaomi reportedly skips 2nm for Xring O2, chooses TSMC 3nm to cut costs

Xiaomi's second-generation in-house mobile processor, the Xring O2, will skip TSMC's 2nm process and instead use the company's 3nm N3P node, underscoring a trade-off between performance, cost, and supply availability. The choice also suggests the chip may not power Xiaomi's most premium flagship smartphones.

Friday 16 January 2026
Taiwanese power semiconductor firms report mixed 2025 results amid supply chain shifts
Taiwanese power semiconductor companies, including Taiwan Semiconductor Company (TSC), Panjit International, and Eris Tech, have recently disclosed their 2025 revenue results, anticipating benefits from order shifts driven by Nexperia. Market analysts project that these effects will take full shape in the first quarter of 2026. Concurrently, these firms are developing power management products to enter the growing AI server market, driven by rising demand for higher power density in AI data centers.
Friday 16 January 2026
MediaTek scales flagship performance with Dimensity 9500s and 8500
MediaTek has launched the Dimensity 9500s and Dimensity 8500 mobile processors, both carrying over key technologies from the company's flagship Dimensity platform. The new chips deliver upgrades in performance, power efficiency, AI processing, imaging, gaming, and connectivity, targeting the premium smartphone market.