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Friday 3 July 2026
Tsinghua chip veteran’s US$1.8bn 3D AI chip startup targets China’s GPU gap

China's AI chip sector has a heavyweight new entrant: veteran semiconductor figure Shaojun Wei has formally unveiled Shanghai Orient Computing Core Technology Co., a 3D AI compute chip startup now valued at CNY12.2 billion (approx. US$1.8 billion), just two years after it was founded.

Friday 3 July 2026
AI server PMIC demand drives spillover orders for Taiwan chip designers

Taiwanese power management IC (PMIC) design houses have been expanding into new applications and broadening their product portfolios in recent years, aiming to move beyond consumer electronics into higher-spec, more stable markets as the AI boom accelerates.

Friday 3 July 2026
Infineon opens Dresden chip plant ahead of schedule, boosting global supply capacity
Infineon has opened its new Smart Power Fab in Dresden ahead of schedule, adding capacity for chips used in AI data centers, electric vehicles, renewable energy, and industrial systems. The move expands Europe's semiconductor base, strengthens supply chains, and could affect technology markets far beyond Germany and the continent.
Friday 3 July 2026
Renesas trims chip portfolio to focus on AI servers and EVs

Renesas Electronics has completed the sale of its timing device business to US fabless semiconductor specialist SiTime, tightening its portfolio around AI servers, electric vehicles, embedded computing and software-led chip design.

Friday 3 July 2026
Chinese power chip price hikes lift Taiwanese suppliers
Inflationary pressures are hitting the semiconductor supply chain in 2026 as Chinese power device makers raise prices, while Taiwan-based firms say their flexibility, quality, and service advantages are becoming more visible as the search for non-China supply chains gains momentum.
Friday 3 July 2026
Huawei's Ascend AI chips target South Korea in new Nvidia challenge

Huawei is reportedly preparing to launch its AI chips in South Korea for the first time in the fourth quarter of 2026, as rising demand for AI infrastructure opens a new market for alternatives to Nvidia-based systems.

Thursday 2 July 2026
Singapore files additional fraud and money laundering charges in Nvidia-linked server case

Singapore authorities have filed additional fraud and money laundering charges against four individuals and brought fresh charges against four companies, as part of an investigation linked to the movement of servers that may have contained Nvidia artificial intelligence chips subject to US export controls. The case has been reported by multiple outlets, including CNA, The Straits Times, and Reuters.

Thursday 2 July 2026
AI server probe pulls back the curtain on the evolving journey of Taiwan's motherboard industry

An ongoing investigation into alleged AI server smuggling has once again put Taiwan's motherboard industry under the spotlight. Veteran motherboard maker Albatron Technology has become a focal point after its general manager, Alex Lu, and an employee of Super Micro Computer (Supermicro) were detained without visitation rights as part of the investigation.

Thursday 2 July 2026
LG Electronics moves into ASIC design services as TSMC ties draw attention
LG Electronics has begun offering application-specific integrated circuit (ASIC) design services to outside chip companies, drawing on system-on-chip (SoC) development work the company has done for its own products since the early 2000s, according to industry sources cited by ZDNet Korea. LG declined to confirm the report when contacted.
Thursday 2 July 2026
Infineon closes ams OSRAM sensor acquisition, adds EUR230 million in annual revenue
Infineon Technologies completed its acquisition of the non-optical analog and mixed-signal sensor portfolio from ams OSRAM on Tuesday, expanding its position in automotive and industrial sensing and adding roughly 230 employees across three new locations.
Thursday 2 July 2026
Socionext to develop TSMC A14 chiplet for AI data center SoCs

Socionext announced that it would develop a high-performance compute chiplet using TSMC's A14 process technology, positioning the project as a platform for next-generation custom silicon aimed at AI data center infrastructure.

Wednesday 1 July 2026
Tenstorrent's Jim Keller says startup will outpace Cerebras as AI chip competition intensifies

AI chip competition is widening beyond raw performance, a shift that matters for global cloud providers, device makers, and investors. Tenstorrent chief executive Jim Keller says the startup can outdo Cerebras, while also courting Intel, Qualcomm, and hyperscalers for licensing deals, acquisitions, and future chip deployments.

Wednesday 1 July 2026
AI chip startup Rebellions' acquisition of SqueezeBits signals push beyond hardware

South Korean AI chip designer Rebellions said on June 30 that it is acquiring AI inference optimization company SqueezeBits, as part of an effort to become a full-stack AI infrastructure provider rather than a chip designer alone.

Wednesday 1 July 2026
India Semiconductor Mission 2.0 reportedly clears Finance Ministry hurdle as govt highlights first-phase progress

India's proposed second phase of the India Semiconductor Mission (ISM 2.0) has reportedly taken a key step forward, clearing the Finance Ministry's Expenditure Finance Committee (EFC), according to Indian media reports. The development could pave the way for a broader expansion of the country's semiconductor manufacturing ambitions.

Wednesday 1 July 2026
SK Hynix talent hunt targets HBM's next frontiers while drawing Samsung employees' attention

SK Hynix's latest senior hiring drive has reignited debate in South Korea's semiconductor industry, with the move seen as more than routine R&D reinforcement and as a sign that competition in the high-bandwidth memory (HBM) market has entered a new stage. As AI chips demand more from memory, logic design, advanced process nodes, and packaging integration, talent with system semiconductor and foundry experience has become a strategic asset.

Tuesday 30 June 2026
IC design firms brace for uncertain peak season as prices rise
The 2026 peak season for IC design firms remains unclear, with global readers likely to feel the effects through pricier smartphones, PCs, and other devices. Supply-chain costs are rising, demand is hard to gauge, and companies are preparing for customer stockpiling that could keep chip orders elevated into the third quarter.
Tuesday 30 June 2026
Expected MCU price hike drives early 1H26 pull-ins

Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply chain, with global implications for electronics pricing and availability. Industry sources said buyers are seeking to secure supply before further increases, while weak demand and AI-related capacity pressure continue to shape the market.

Tuesday 30 June 2026
Arm says it tops 50% share in hyperscale cloud as x86 grip slips

Arm Holdings says its chip architecture has crossed the 50% threshold in the hyperscale cloud market, a milestone in a segment long dominated by Intel and AMD. The SoftBank-backed chip designer is now pushing further into the hardware business itself, even as supply chains strain under the weight of the AI infrastructure buildout.

Monday 29 June 2026
Baidu subsidiary Kunlunxin seeks US$50B IPO valuation, asks investors to buy its chips

Kunlunxin, the semiconductor subsidiary of Chinese search engine giant Baidu, is targeting a US$50 billion valuation for its Hong Kong public offering. The company is also asking investors to commit to buying its chips as a condition of participation, according to The Information, underscoring the competitive dynamics shaping chip makers as Beijing moves to strengthen its domestic AI supply chain.

Monday 29 June 2026
BYD's 4nm smart-driving chip signals deeper EV supply-chain integration

BYD plans to install its first in-house smart-driving chip in a Denza production model in 2027, marking a key step in the Chinese automaker's push to extend vertical integration from electrification into intelligent driving.

Monday 29 June 2026
Weekly news roundup: South Korea takes physical AI push from policy to practice; Europe aggressively pursues non-red supply chains
Below are the most-read DIGITIMES Asia stories from the week of June 22-28, 2026:
Monday 29 June 2026
Onsemi's Synaptics acquisition intensifies competition for physical AI leadership
Onsemi's acquisition of Synaptics underscores how global chipmakers are racing to build broader edge AI platforms, with implications that could ripple through data centers, industrial systems, and connected devices. The deal signals a push toward integrated hardware stacks amid intensifying worldwide competition across the AI supply chain.
Monday 29 June 2026
Qualcomm stirs AI data center competition with CPUs, ASICs, and accelerators
Qualcomm officially unveiled its Dragonfly data center platform at this week's annual investor day, laying out a four-pronged push into cloud AI that spans SerDes, PAM4 DSP, and other connectivity technologies gained through its Alphawave acquisition; ASICs; AI accelerators; and CPUs. The company also said its Modular acquisition added key assets for an AI software stack.
Sunday 28 June 2026
2nm advanced process waste surges 13x, Techzone targets semiconductor ESG waste treatment market
As advanced semiconductor processes rapidly transition from 28nm to 3nm and 2nm nodes, more frequent chemical cleaning procedures are driving an increase in demand for liquid chemical waste treatment. Techzone Chairman Chen Li-Li said that semiconductor companies are currently pursuing two major approaches in response to ESG requirements: first, establishing outsourced waste treatment channels; and second, building in-house zero-waste centers to process waste within their own facilities. Both approaches involve close cooperation with Techzone.
Saturday 27 June 2026
Apple's reported 1.4nm roadmap signals prolonged race for advanced-node capacity
Apple is reportedly considering adopting 1.4nm process technology for its flagship smartphone SoCs as early as 2028, implying that flagship chips built on the 2nm generation could have a lifecycle of only about two years.