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Monday 26 January 2026
Cmsemicon enters NOR Flash with first SPI NOR chip, expands beyond MCUs
Cmsemicon Semiconductor has released its first low-power SPI NOR Flash chip series, marking the Shanghai-listed chip designer's initial entry into the non-volatile memory segment. The launch fills a gap in the company's Flash product lineup and aligns with its "MCU+" strategy of pairing MCUs with complementary chips.
Monday 26 January 2026
MIPS expands RISC-V processor platform with ARC IP integration

MIPS is repositioning itself within the RISC-V ecosystem following the integration of the ARC Processor IP business acquired from Synopsys, moving beyond a CPU-centric model toward a broader processor platform that combines CPUs, NPUs, DSPs, and software tools.

Monday 26 January 2026
MIPS accelerates S8200 RISC-V NPU timeline

MIPS has accelerated the development timeline of its S8200 neural processing unit, a RISC-V–based NPU designed for real-time, low-latency edge AI, as the company continues to advance its strategy around what it calls "Physical AI," following its integration into GlobalFoundries.

Monday 26 January 2026
Weekly news roundup: strategy shifts, supply chain realignments, scaling limits
Below are the most-read DIGITIMES Asia stories from the week of January 19-25, 2026.
Monday 26 January 2026
India roundup: India's semiconductor ambitions face hurdles echoing SEA as local IC design sector strives to grow
With Micron's ATMP facility moving into commercial production and fresh investments from domestic players, India's semiconductor push is gaining firmer footing. However, despite its deep talent pool, the country's IC design sector continues to face challenges in building global competitiveness.
Sunday 25 January 2026
Nvidia's China AI chip share falls to 8% as local rivals ramp up

Tighter US export controls on advanced artificial intelligence chips are accelerating China's push to develop domestic chip technologies and expand its semiconductor supply chain, according to recent research. The shift is contributing to structural changes in the global AI chip market.

Sunday 25 January 2026
Fan motor demand drives growth for Taiwan analog chip makers
As 2026 begins, demand for fan motors remains strong. On top of continued cooling needs driven by cloud servers, new fan upgrade and increased usage requirements are emerging across the edge computing segment. AI PCs are driving more dual-fan designs, while automotive and industrial control sectors are also expanding their fan usage. The motor driver IC opportunities behind these trends are expected to become a major development focus for many Taiwanese analog chip makers in 2026. Weltrend Semiconductor, Global Mixed-mode Technology (GMT), and Anpec Electronics are all expected to see stable support for their operations this year.
Friday 23 January 2026
SEALSQ, Gujarat govt, and Kaynes SemiCon sign MoU to establish India's first secure post-quantum semiconductor center
SEALSQ Corp, a developer of semiconductors and post-quantum technology solutions, announced on January 21, 2026, that it has signed a non-binding Memorandum of Understanding (MoU) with the Government of Gujarat and Kaynes SemiCon Private Limited, a subsidiary of Kaynes Technology India Limited. The agreement outlines plans to develop India's first Secure Semiconductor Design, Test, and Personalization Center focused on post-quantum cryptography technologies.
Friday 23 January 2026
ASE Group's USI merges with EugenLight to expand silicon photonics module capacity in Vietnam
ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions that integrate optical engines (OE) and application-specific integrated circuits (ASICs), its subsidiary Universal Scientific Industrial (USI) is also expanding in optical communications. USI recently announced that it has completed the acquisition of a controlling stake in Chengdu-based EugenLight Technologies.
Friday 23 January 2026
India's semiconductor ambitions face hurdles echoing SEA as local IC design sector strives to grow
At the recent World Economic Forum in Davos, India's IT Minister outlined the country's efforts to boost its semiconductor industry, highlighting the emergence of 24 Indian IC design startups, with 18 benefiting from venture capital investments. This underscores India's drive to reclaim a significant role in integrated circuit design amid concerns over ongoing talent migration to foreign firms.
Friday 23 January 2026
Intel’s “better than guidance” quarter comes with a catch
Intel's latest financials highlight a fragile turnaround: while AI-linked data center demand and early traction in advanced manufacturing offer strategic promise, weak margins, volatile profitability, and cautious guidance suggest near-term pressure remains, keeping investor focus squarely on execution and the pace of recovery, which Intel attributed to tight supply across the industry.
Friday 23 January 2026
Lip-Bu Tan faces Intel's first real bottleneck of the AI era
Intel outlined an increasingly AI-centric roadmap across client PCs, data centers, and manufacturing. Still, executives cautioned that tight supply and early-stage foundry ramps continue to limit near-term revenue and profitability, keeping the company's turnaround highly dependent on execution through 2026.
Friday 23 January 2026
Intel slows its most ambitious node—and signals where the real battle is for now
Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments on hold until customer demand is secured.
Thursday 22 January 2026
GlobalWafers chair sees Taiwan's semiconductor edge, says AI is irreversible
On January 21, 2026, GlobalWafers chairwoman Doris Hsu spoke to the media about the recent US-Taiwan tariff agreement, which lowers Taiwan's reciprocal tariffs to 15% without stacking most-favored-nation (MFN) rates. This makes Taiwan the first country to secure tariff relief under Section 232. Both sides also plan to expand supply chain investment cooperation. Hsu called this a very positive outcome for Taiwan's overall industry and said it has eased market concerns.
Thursday 22 January 2026
Cloud ASIC shipments set to surge in 2026; memory capacity remains key risk
2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major cloud service providers (CSPs), but Taiwanese firms MediaTek, Alchip, and GUC also have new products entering mass production. These developments are expected to deliver solid revenue contributions despite ongoing market uncertainties.
Thursday 22 January 2026
Google's TPU strategy said to give Inventec larger role in AI server manufacturing

Servers built around custom AI chips, known as application-specific integrated circuits (ASICs), have emerged as a focal point of the global server supply chain.

Thursday 22 January 2026
Why Intel poached a Qualcomm GPU chief to bet on AI graphics

Eric Demers, a veteran GPU architect who until recently served as Senior Vice President of Engineering at Qualcomm and led its GPU business, is leaving the company to join Intel, according to a disclosure he made on LinkedIn.

Thursday 22 January 2026
Taiwan PCB direct shipments to the US remain limited
The US has lowered the tariff rate on Taiwan to 15%, and it will not be stacked with the most-favored-nation (MFN) tariff rate. This places Taiwan on the same baseline as Japan, South Korea, and EU countries. It is also better than the previously agreed rates of 19% and 20% for Thailand and Vietnam, respectively. Regarding semiconductor tariffs derived from Section 232, as long as the products are supplied for use by cloud service providers (CSPs), government agencies, and other such purposes, they meet the exemption conditions set by the US. This means that Taiwan's AI products exported to the US are essentially unaffected and benefit from zero-tariff preferential treatment.
Wednesday 21 January 2026
Siemens acquires ASTER to strengthen PCBA test and DFM capabilities
Siemens has acquired ASTER Technologies, a privately held provider of printed circuit board assembly (PCBA) test verification and engineering software, as it moves to expand its electronic design automation (EDA) portfolio. Financial terms of the deal were not disclosed.
Wednesday 21 January 2026
Jabil invests in semiconductor power systems, expanding chipmaking footprint
Jabil Inc., the global manufacturing and supply-chain services company, said on Tuesday that it had made a strategic minority investment in Eagle Harbor Technologies, a Seattle-based developer of advanced power systems for semiconductor manufacturing, and would partner with the company on production.
Wednesday 21 January 2026
Intel recruits Qualcomm GPU chief to lead future AI PC efforts
Intel has poached Eric Demers, a veteran GPU architect, known for developing Qualcomm's proprietary Adreno GPU architecture. Demers will become Intel's senior vice president of GPU engineering. This suggests that even though Intel has long been unable to compete with Nvidia and AMD in the GPU market, it still hopes to strengthen its own GPU capabilities.
Tuesday 20 January 2026
AI server watch: AI servers lift Taiwan supply chain broadly in 2025, gains center on ODM/EMS, cooling, optical
Taiwan's AI server supply chain delivered broad-based growth in 2025, fueled by surging generative AI and cloud data center spending, but the biggest gains clustered around two areas: system-level integration led by original design manufacturer (ODM)/electronics manufacturing services (EMS) manufacturers, and a set of high-power, AI-specific components—especially thermal solutions, rack hardware, and high-speed optical interconnect.
Tuesday 20 January 2026
Advantest faces three standardization challenges in shift-left testing
The silicon photonics (SiPh) and common packaged optics (CPO) solutions supply chains are emerging this year. Japanese testing equipment maker Advantest says that although optical communications have advantages in energy efficiency and high transmission speeds, there remains three major technical challenges that have yet to be standardized before related chip products are formally launched. These issues will need to be addressed as the industry transitions from electrical to optical communications.
Tuesday 20 January 2026
Apple, Qualcomm, MediaTek align on 2nm chips in 2026 as specs lose consumer appeal
Apple Inc., Qualcomm Inc., and MediaTek are all set to advance their smartphone system-on-chip (SoC) offerings to the 2nm process node in 2026. This coordinated move signals the three giants' determination to maintain technological leadership, even as the incremental benefits of process improvements come under scrutiny.
Tuesday 20 January 2026
Taiwan IC designers wager on algorithms for the next boom
Taiwanese integrated circuit design houses used the 2026 Consumer Electronics Show in the US to seek new partnerships, signaling that success in the next phase of edge artificial intelligence will depend as much on software and algorithms as on silicon.