IC design, distribution
  • Intel unveils new Comet Lake mobile CPUs for ultra-thin notebooks
    Intel has introduced eight new mobile processors that are based on its 14nm Comet Lake architecture, under its U and Y series for ultra-thin notebooks and over 90 new ultra-thin notebooks using the CPUs are expected to become available in the market before the end of 2019.
  • Semiconductor equipment billings grew slightly on month
    Billings among North American manufacturers of semiconductor production equipment grew slightly on month, but posted a year-over-year decline for the 9th consecutive month in July, according to SEMI.
  • Xilinx has announced the expansion of its 16nm Virtex UltraScale+ family
    Xilinx has announced the expansion of its 16nm Virtex UltraScale+ family to now include what the company claims is the world's largest FPGA, the Virtex UltraScale+ VU19P, with 35 billion transistors, enabling emulation and prototyping of tomorrow's advanced ASIC and SoC technologies.
  • Elan expects its third-quarter 2019 revenues to hit a new quarterly high
    Taiwan-based IC designer Elan Microelectronics expects its third-quarter 2019 revenues to hit a new quarterly high on a notable sequential increase to be driven by demand for stylus and fingerprint chips from PC and notebook vendors to support their specs upgrades.
  • Unisoc stepping up 5G chip market deployments
    Unisoc Communications, Tsinghua Unigroup's chipmaking arm, has had its 7nm 5G baseband chip proceed to the customer validation stage, according to a media report from China.
  • The top-15 semiconductor companies saw their combined sales drop by 18% from a year earlier
    IC Insights has released its list of the world's top-15 semiconductor suppliers in the first half of 2019, and identified Sony as the only company registering year-over-year growth during the six-month period.
  • Semiconductor materials distributors are optimistic about strong demand
    Semiconductor materials distributors Wahlee Industrial and Topco Scientific are both optimistic that strong demand for high-end engineering plastics, silicon wafers and photoresist will persist as advanced foundry processes will be increasingly needed to support growing 5G and AI applications, according...
  • MediaTek's development of SoC chips designed for 5G-enabled smartphones is on schedule
    Taiwan-based IC designer house MediaTek reportedly is on track to roll out its first 5G SoC series, codenamed MT6885, in fourth-quarter 2019, ready for commercial production in first-quarter 2020. The 5G market may see explosive growths...
  • Competition heating up in 5G mobile SoC market
    Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support from TSMC, is on schedule with volume production to kick off in the first quarter of 2020, expected according to industry...
  • Shang-yi Chiang, CEO of HSMC
    While Moore's Law is approaching its physical limits, only a few could still afford the expensive game of process shrink. And when the post-Moore's Law era comes, semiconductor firms, though lost in Moore's Law, may realize that there is another solution: chiplets, according to Shang-yi Chiang, CEO...
  • Nvidia facing challenges from AMD, Intel in the graphics card market
    Nvidia's dominance in the discrete graphics card market is expected to see strong challenges from Intel and AMD beginning from 2021, according to sources from the upstream supply chain.
  • Goodix will acquire all assets of NXP's voice and audio solutions business
    Shenzhen Goodix Technology has reached a definitive agreement with NXP Semiconductors under which it will acquire all assets of NXP's voice and audio solutions (VAS) business, according to the China-based fabless chipmaker. The transaction includes employees based in Europe and Asia, and relevant intellectual...
  • The company is teaming up with GTS
    Himax Technologies has announced that the company is teaming up with GTS to allow its structural light 3D sensing solution to be adopted for factory automation.
  • Second-quarter 2019 smartphone AP shipments to China showed 39.1% sequential growth
    Chinese smartphone vendors, particularly Huawei, scrambled to stock up components in the second-quarter of 2019 amid escalating US-China trade tensions. Such precautionary orders sharply boosted second-quarter smartphone AP shipments,...
  • Smartphone AP shipments to China surged 39.1% sequentially in the second quarter
    Smartphone application processor (AP) shipments to China vendors registered a larger-than-expected increase sequentially in the second quarter of 2019, thanks to deliveries made in advance to avoid the burden of potential tariffs from the US, according to Digitimes Research.
  • Orders for the iPhones have thus far been weaker compared to the momentum in previous years
    Apple is expected to launch its new iPhones soon, but it seems few would expect strong sales or major spec upgrades for the new phones. News from the supply chain has claimed that PCB order momentum ahead of the new iPhone launch has...
  • MCU market slid lower in the first half of 2019
    After reaching record-high sales in the last two years, the microcontroller (MCU) market slid lower in the first half of 2019 because of overall weakness in electronic systems, a slowdown in automobile sales, and no letup in the trade war between the US and China, according to IC Insights.
  • Adoption of in-display fingerprint sensors by vendors in Korea and China is growing
    Taiwan-based fingerprint ID chip designer Egis Technology (EgisTec) expects to enjoy higher revenue growth for the fourth quarter of 2019 than the third quarter thanks to growing adoption of in-display fingerprint sensors by vendors in Korea and China.
  • MediaTek saw its July revenues slip 0.98% sequentially
    Mobile SoC specialist MediaTek saw its July revenues slip 0.98% sequentially to NT$20.69 billion (US$658.2 million).
  • tsmc
    The global semiconductor market is set to enter a dynamic new phase of growth, as the era of 5G network looms around the corner. TSMC, the world's largest pure-play foundry, is also eyeing opportunities arising from 5G with its competitive 7nm and more advanced process technologies.
  • AMD
    AMD is expected to grab a larger share of the server market thanks to its newly launched EPYC server processor platform. Taiwan-based components suppliers are generally...
  • Intel in the second quarter maintained its position as the world's largest semiconductor supplier, although second-placed Samsung managed to narrow the gap due to renewed vigor in some key memory products, according to IHS Markit.
  • AMD second-generation EPYC server platform
    AMD, joined by an expansive ecosystem of datacenter partners and customers at a launch event, has introduced the second-generation AMD EPYC family of processors for enterprise, cloud and high-performance computing (HPC) workloads.
  • AMD releases new EPYC server platform
    AMD has launched its second-generation EPYC server processors manufactured using Taiwan Semiconductor Manufacturing Company's (TSMC) 7nm process technology, and the new platform is expected to raise AMD's share of the global server processor market to 10% in 2020, according to market sources.
  • New business opportunities arising from the new server transmission architecture of PCIe Gen 4
    As AMD has newly launched second-generation EPYC processors, dubbed Rome 7002 series, as the world's first 7nm x86 server CPUs that support PCIe 4.0, Taiwan-based CCL makers ITEQ and Elite Material (EMC) are poised to embrace new business opportunities arising from the new server transmission architecture...

Taiwan LCD monitors – 2Q 2019

Taiwan small- to mid-size LCD panels – 2Q 2019

China smartphone AP shipments – 2Q 2019

Taiwan semiconductor foundry sector, 2Q19

Global AIO PC shipment forecast and industry analysis, 2019

Global AP demand forecast, 2017-2022

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