TSMC has been fast advancing its manufacturing processes. It is on track to move 5nm node to commercial production in the second half of 2020, and will soon break ground for a 3nm facility where volume production will start in 2020. Next...

MediaTek and Realtek Semiconductors are both gearing up to ramp up their output of Wi-Fi 6 (802.11ax) chips in 2020, according to sources at IC testing solutions providers.

TSMC uses its N7, the foundry's 7nm process without EUV, to fabricate Qualcomm's latest flagship processor, Snapdragon 865 series. Nevertheless, its Snapdragon 765 chips are being manufactured using Samsung's EUV-based 7nm process technology.

With revenues plunging by 14.7% in the third quarter, the global semiconductor market appears destined for a year of double-digit decline despite some signs of growth in the critical memory segment, according to IHS Markit.

Taiwan-based IC design houses have seen their China-based customers start slowing down their pace of orders due to year-end inventory checks at the clients, which may drag down revenues at those fabless chipmakers in November and December.

Qualcomm has introduced its new 5G SoC lineup - the Snapdragon 865 series for smartphone vendors' flagship models and the 765 series for midrange to high-end ones. But it is the midrange smartphone market segment that is expected to see...

More Taiwan-based IC design houses are moving to strengthen partnerships with foundries in China so as to land more orders from Chinese brand vendors seeking to cut reliance on US supplies of key semiconductor components, according to industry sources.

NAND flash is expected to see the fastest growth in 2020 among all IC segments, according to IC Insights.

The main battlefield in the 5G mobile chip market is expected to shift from flagship models to mostly midrange ones in the first half of 2020, as around 70% of over 200 million 5G smartphones to be shipped next year will be midrange to high-end ones, according to industry sources.

STMicroelectronics has announced the closing of the full acquisition of Swedish silicon carbide (SiC) wafer manufacturer Norstel AB. ST exercised its option to acquire the remaining 45% stake, following the initial transaction announced in February 2019. The total consideration for the acquisition...

Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are both being contracted to manufacture the chips.

Worldwide semiconductor sales grew nearly 3% sequentially in October. However, sales posted an on-year decline for the 10th consecutive month.

Cadence Design Systems and National Instruments (NI) have announced they have entered into a definitive agreement for the former to acquire AWR Corporation, a wholly-owned subsidiary of the latter.

MediaTek has released Dimensity 1000 featuring four Arm Cortex-A77 cores operating up to 2.6GHz with four power-efficient Arm Cortex-A55 cores operating at up to 2.0GHz, accelerating its deployments in the 5G market.

Demand for 5G smartphones is expected to pick up fast next year, with mobile SoC prices for these handsets to stay at high levels at least in the first half of 2020. Tight capacity at TSMC's 7nm node will prevent production cost for 5G mobile chip from falling and Andriod phone vendors will not have...

The radio frequency (RF) front-end (FE) market for telecom infrastructure, estimated at US$1.47 billion in 2018, is forecast to reach US$2.52 billion in 2025, according to Yole Developpement.

5G mobile SoC unit price will stay above US$100 in the first half of 2020, several times that for 4G solutions, as tight capacity at TSMC's 7nm node is likely to keep production cost at high levels, according to industry sources.

The prospect of 5G definitely looks promising, but players in the supply chain have to make sure they have sufficient support from one another in order to fully enjoy the opportunities promised by the arrival of 5G. Chipmakers and their partners are gearing up to build key...

Mobile chipmakers are gearing up to secure stronger support from supply chain partners aiming to gain a greater presence in the market for 5G smartphones whose shipments are estimated to reach at least 200 million units in 2020, according to industry sources.

Taiwan-based IC designers are gearing up to cash in on the growing demand for high-speed, high-performance peripheral chips including Type-C interface chipts, USB 4.0 chips, diverse ASICs and server ICs, driven by the upcoming commercialization of 5G services, according to industry sources.

Chip demand for true wireless stereo (TWS) earbuds and earphones is set to remain robust in 2020, according to industry sources in Taiwan.

With its decision to sell its chipmaking operations to Taiwan's Nuvoton Technology, Panasonic will leave the chipmaking industry where it was once among the world's top-10 players in the 90s.

WPG's tender offer for WT Microelectronics shares has raised concerns among the latter's customers as well as suppliers, according to WT Micro chairman and CEO Eric Cheng.

MediaTek has launched its next-generation 5G SoC family, Dimensity. The launch made a splash with high-ranking executives from many fellow semiconductor firms, including TSMC and ASE, attending. MediaTek, as one of the biggest IC designers...

MediaTek held a press conference on November 26 to introduce the new generation of its 5G SoC chips, with guests including TSMC VP Lora Ho, a number of high-ranking executives from major backend houses including ASE, SPIL and KYEC, and IC probing specialist CHPT.