Nvidia has halted production of artificial intelligence (AI) chips intended for the Chinese market and redirected manufacturing capacity at TSMC to its next-generation Vera Rubin platform, as regulatory barriers in both the US and China continue to cloud prospects for sales to Chinese customers, the Financial Times reported.
Broadcom reported strong results for the first quarter of fiscal 2026, driven by robust demand for cloud application-specific integrated circuits (ASICs), and issued an upbeat outlook. During the earnings call, however, industry attention centered less on the company's financial performance and more on its views on silicon photonics and copper interconnect technologies.
Apple's newly introduced MacBook Neo, a low-cost laptop priced from US$599, uses the A18 Pro chip instead of the newer A19 Pro, according to a report from Wccftech, which attributed the decision partly to supply constraints affecting advanced semiconductor manufacturing nodes.
On February 28, Hangzhou convened an AI development summit at the Hangzhou Civic Center aimed at positioning the city as China's leading artificial intelligence (AI) hub. According to East Money and Xinhua, 12 AI projects were signed, with a total investment of CNY25.5 billion (US$3.71 billion).
In recent weeks, Taiwanese IC design companies have indicated during earnings calls that advance stocking across the IT industry has been notable. The typical off-season has remained relatively active, largely driven by expectations of memory shortages and price increases, as well as concerns that component costs could rise in the near term. Industry players generally believe the pull-in demand will likely balance out between the first and second halves of 2026, suggesting that the traditional seasonal cycle of weak and peak periods may largely be absent this year.
In the AI era, technological competition among leading chip design companies continues to intensify. Broadcom announced in 2024 that it was working with TSMC to launch its 3.5D eXtreme Dimension System in Package (XDSiP) platform, with products scheduled to ship in 2026. Broadcom has now confirmed that the product, built on a 2nm process and using 3.5D system-level packaging, has begun shipping on schedule, primarily to customer Fujitsu.
