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Thursday 13 August 2026
Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years. At the 2026 OCP APAC Summit, however, Ayar Labs CEO Mark Wade shifted the focus from whether CPO works to whether it can scale commercially.

Thursday 13 August 2026
OCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward
Speaking at the OCP APAC Summit 2026, Ayar Labs CEO Mark Wade argued that copper interconnects have become one of the biggest obstacles to realizing the vision of open computing.
Thursday 13 August 2026
Lightmatter white paper targets fragmented supply chain, barriers to photonic interconnect deployment
Bijan Nowroozi, Head of Ecosystem Development at Lightmatter, announced at the OCP APAC Summit 2026 that the company has released an infrastructure white paper aimed at building a more unified, less fragmented supply chain for photonic interconnects.
Thursday 13 August 2026
Siemens EDA unveils AI-Native Design strategy in South Korea
Siemens EDA has introduced an AI-Native Design strategy in Seoul, aiming to help chipmakers and system designers manage rising complexity while reducing the risk of AI errors. The move could shape how semiconductor tools evolve worldwide, as companies seek faster, more reliable automation across increasingly global supply chains.
Thursday 13 August 2026
Synopsys pushes into system design as Nvidia, AMD and Broadcom move up the stack
Nvidia, AMD and Broadcom are moving beyond chip-level design into subsystems and complete systems, a shift that is increasing the need to account for thermal, electrical, mechanical and other physical effects earlier in the design process, according to Synopsys executives.
Thursday 13 August 2026
NXP expands Malaysia factory to bolster global chip supply resilience

NXP Semiconductors has begun expanding its Petaling Jaya assembly and test site in Malaysia, a move that could support semiconductor supply chains worldwide by adding capacity, automation, and geographic diversification. The project is part of a broader effort to improve manufacturing resilience as global demand and supply risks continue to shape the industry.

Thursday 13 August 2026
Nvidia's compute financing push signals a new phase for AI spending
Nvidia's plan to assemble more than US$500 billion in third-party capital for AI infrastructure could reshape how the industry pays for compute. By bringing major Wall Street firms into the deal, the chipmaker is effectively turning AI capacity into a financeable asset class, with implications for cloud providers, investors, and credit markets.
Thursday 13 August 2026
From lab bench to IPO: How Taiwan's top university aims to turn professors into founders, campus into a unicorn factory

National Tsing Hua University (NTHU), one of Taiwan's leading research universities, has spent more than a decade cultivating a campus culture of professor-led startups — a track record that has already produced companies such as eMemory Technology, Heron Neutron Medical, Advanced Ceramic X (ACX), Apex Biotechnology (ApexBio), and Finesse Technology. Building on that history, the university announced on August 10 that it will expand the scale of its "NTHU Accelerator."

Thursday 13 August 2026
Progate posts record profit on TSMC, Synopsys ecosystem gains
Progate Group Corporation posted record second-quarter and first-half 2026 revenue and profit, as stronger operations and deeper ties with the TSMC, Synopsys, and ASE ecosystems boosted results. The Taiwan-based design services provider said demand from U.S. customers and advanced-process projects also supported its performance.
Wednesday 12 August 2026
OCP APAC 2026: AMD sees AI agents pushing CPU-GPU ratio toward 1:1
AMD expects the shift from chatbots to agentic AI to sharply increase CPU demand alongside GPU acceleration, potentially moving the traditional CPU-to-GPU ratio from roughly 1:4 toward 1:2 or even 1:1.
Wednesday 12 August 2026
OCP APAC 2026: Nvidia SVP Shainer on taking CPO to mass production —'can't release something just because it's cool'

Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking at Nvidia, stated at the OCP APAC Summit 2026 — and the manufacturing chain behind them runs heavily through Taiwan.

Wednesday 12 August 2026
Nvidia reportedly planning trillion-parameter Nemotron 4 in open-source push

Nvidia is intensifying its open-source strategy through its upcoming trillion-parameter model in the Nemotron 4 family, which is meant to compete with the world's leading open-source models, according to The Information. While this may put it in the awkward position of vying against its customers, the chipmaker's advocacy for open-source AI could see the company benefit from more chip sales across the board.

Wednesday 12 August 2026
OCP APAC 2026: Applied Materials exec calls for hardware co-optimization to solve AI power crisis

Speaking at the OCP APAC Summit in Taipei, Subi Kengeri, Corporate Vice President and General Manager of Systems to Materials at Applied Materials, delivered a keynote warning that the artificial intelligence boom faces a critical bottleneck: energy efficiency.

Wednesday 12 August 2026
Japan's US$430B 2040 chip plan hinges on Rapidus 2nm

Japan has drawn up a plan for more than JPY370 trillion (approx. US$2.33 trillion) in combined public and private investment across 17 strategic sectors, including AI and space, through fiscal 2040, which runs from April 2040 to March 2041.

Wednesday 12 August 2026
OCP APAC 2026: Microsoft leans on Taiwan supply chain for 'silicon-to-systems' AI buildout

Microsoft sources roughly 70% of the hardware content in its cloud infrastructure from Taiwan and the wider Asia-Pacific region, executives said at the OCP APAC 2026 summit here. The company is shifting from buying discrete components to co-designing entire AI systems from the silicon up.

Wednesday 12 August 2026
OCP APAC 2026: Nvidia, Broadcom diverge on how to scale AI networks beyond the rack
Nvidia and Broadcom outlined different paths for scaling AI networks at the OCP APAC Summit in Taipei on Aug. 11, as clusters expand from rack-scale systems to entire data centers and across multiple sites.
Wednesday 12 August 2026
Synnex sees strong growth in value-added commercial IT, semiconductors
AI-driven enterprise procurement and a consumer shift toward higher-end products lifted Synnex Technology International's revenue and profit in the second quarter of 2026, with profit growing far faster than revenue, showing that volume growth is increasingly translating into stronger profitability.
Wednesday 12 August 2026
Taiwan's 20-qubit superconducting quantum computer wins 2026 Future Tech Award

Taiwan's National Science and Technology Council (NSTC) announced the winners of its annual Future Tech Award on August 10, with the aim of encouraging the licensing and commercialization of breakthrough research projects. Among the selected technologies were Academia Sinica's 20-qubit superconducting quantum computer and quantum chip process development project, headed by distinguished research fellow Chii-dong Chen, and research into complementary field-effect transistors and other advanced stacked transistors, led by Chee Wee Liu of the Department of Electrical Engineering at National Taiwan University (NTU).

Wednesday 12 August 2026
Novatek sees 3Q26 growth resting on smartphone DDI and Edge AI demand

Novatek, a Taiwan-based display driver integrated circuit (DDI) supplier, said at its August 6 investor conference that second-quarter 2026 revenue and gross margin exceeded expectations, supported by stronger customer orders across all three major product lines and a sharp sequential increase in profit.

Wednesday 12 August 2026
California satellite makers expand as office vacancies become factory space
California's satellite manufacturing sector kept growing despite high costs and strict regulation, as startups and established operators expanded across San Jose, Sunnyvale, and Los Angeles. According to SpaceNews, the state remained a central hub for the U.S. space supply chain because of its talent base, venture funding, customer access, and the ability to repurpose office space.
Wednesday 12 August 2026
Etron reports record July revenue as memory prices surge
Etron Technology said July 2026 consolidated revenue jumped to NT$2.125 billion, a fourth straight monthly record, as rising memory prices lifted sales. The Taiwan-based memory IC design company also reported that revenue for the first seven months of 2026 climbed to NT$9.759 billion, up 481.09% from a year earlier.
Tuesday 11 August 2026
Microsoft seeks expanded Maia 300 production to tap into demand for cheaper compute
Microsoft plans to unveil its new Maia 300 accelerator chip this fall, with a public announcement possible as early as next month, according to The Information. Although Microsoft has lagged Google and Amazon in scaling its in-house AI chips, it is targeting far higher production volumes for Maia 300 than for Maia 200 in hopes of attracting major clients such as Anthropic.
Tuesday 11 August 2026
Taiwan's AI server supply chain posts record July as growth spreads down the component tier

The latest indication of global demand for AI hardware comes not from a hyperscaler capex presentation, but from unaudited monthly filings in Taipei. Major Taiwanese companies across the AI server supply chain, including server assembly, cooling, power, networking, and testing, reported combined July revenue of NT$2.59 trillion (US$80.34 million), according to the filings.

Tuesday 11 August 2026
GMT says PMIC demand outstrips supply, prioritizes wafer grabs

Taiwanese power management IC (PMIC) maker Global Mixed-mode Technology (GMT) said at a recent investor conference that its revenue and profit for the second quarter of 2026 were close to expectations. Looking ahead to the third quarter, the company said wafer manufacturing and back-end testing capacity remain extremely tight, leaving little room to offer customers additional supply beyond already secured volumes.

Tuesday 11 August 2026
Fitipower sees e-paper and e-label growth, warns on 2H26 demand

Taiwanese display driver IC (DDI) maker Fitipower Integrated Technology's Chairman Young Lin said the company will roll out several new products for sampling and mass production in 2026, laying the groundwork for continued revenue growth. He added that the e-paper and electronic label markets are a major focus, with Fitipower hoping for sequential quarterly growth this year. However, he said end-market demand is not yet strong and still requires caution.