The DRAM sector enjoyed robust growth in 2018, but oversupply coupled with weakening economy and demand has sent memory prices crashing this year. But there may be good news around the corner, with Adata's chairman expecting DRAM pricing...
Intel launches new-generation 14nm mobile chips
Intel has introduced eight new mobile processors that are based on its 14nm Comet Lake architecture, under its U and Y series for ultra-thin notebooks and over 90 new ultra-thin notebooks using the CPUs are expected to become available in the market before the end of 2019.
Samsung EUV process reportedly facing hurdles
Speculation has started circulating in the chipmaking industry that Samsung's 7nm EUV manufacturing yield rates are still lower than expected and may interrupt production for Qualcomm's mid-range 5G SoC slated for launch in the first quarter of 2020.
Tong Hsing to see revenues rise through 4Q19
Tong Hsing Electronic Industries, which supplies ceramic substrates as well as packaging services for CMOS image sensors and other niche ICs, expects its revenues to pick up sequentially to peak in the fourth quarter of 2019, driven by a ramp-up in shipments of new products such as supersonic sensors...
8-inch fab utilization rates may not rebound until 2020
Eight-inch fab utilization rates continue to fall on weak demand for automotive and consumer ICs and are unlikely to rebound until the first half of 2020, according to industry sources.
Billings among North American manufacturers of semiconductor production equipment grew slightly on month, but posted a year-over-year decline for the 9th consecutive month in July, according to SEMI.
For TSMC, Moore's Law is far from being dead. While it has been keen to grow chip density on the transistor level, advancing packaging technology is one of the possible ways TSMC is embracing to improve density by stacking multiple layers of transistors into what it calls monolithic...
Taiwan-based IC testing solutions providers including Keystone Microtech have seen a drastic pickup in 5G-driven orders from chipmakers in Taiwan and China for test interfaces such as probe cards, burn-in boards for IC aging rest, and load boards for final testing in the second half of 2019, according...
TSMC advancing 3D IC integration technology
TSMC continues to move forward with its 3D-IC integration technology development, pursuing cutting-edge performance resulting from heterogeneous components that are "seamlessly connected."
IC Insights has released its list of the world's top-15 semiconductor suppliers in the first half of 2019, and identified Sony as the only company registering year-over-year growth during the six-month period.
ChipMOS, OSE to post sales growth in 2H19
A ramp-up in orders for NAND flash memory will boost revenues at backend houses ChipMOS Technologies and Orient Semiconductor Electronics (OSE) in the second half of 2019, according to industry sources.
TSMC to see revenues surge in 2020
Growing chip demand for 5G- and AIoT-related applications will boost TSMC's revenues for 2020, which are expected to climb over 10% on year, according to industry sources.
Taiwan July export orders down on year
Taiwan received export orders with total value of US$40.53 billion in July 2019, increasing 5.3% sequentially but decreasing 3.0% on year, according to the Ministry of Economic Affairs (MOEA).
Taiwan-based IC designer house MediaTek reportedly is on track to roll out its first 5G SoC series, codenamed MT6885, in fourth-quarter 2019, ready for commercial production in first-quarter 2020. The 5G market may see explosive growths...
Powerchip swings to loss in 1H19
Foundry chipmaker Powerchip Technology has reported net losses of NT$2.69 billion (US$85.7 million) in the first half of 2019. EPS was negative NT$0.85 for the six-month period.
Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support from TSMC, is on schedule with volume production to kick off in the first quarter of 2020, expected according to industry...
While Moore's Law is approaching its physical limits, only a few could still afford the expensive game of process shrink. And when the post-Moore's Law era comes, semiconductor firms, though lost in Moore's Law, may realize that there is another solution: chiplets, according to Shang-yi Chiang, CEO...
Nvidia's dominance in the discrete graphics card market is expected to see strong challenges from Intel and AMD beginning from 2021, according to sources from the upstream supply chain.
Demand for GaN-based components set for long-term growth
Demand for GaN-based RF components and power amplifiers (PAs) is heading for long-term growth along with the establishment of 5G networks, according to industry sources.
Taiwan 1H19 patent applications slightly up on year
Taiwan-based and foreign applicants applied for 35,534 patents during first-half 2019, increasing 0.68% on year, according to Intellectual Property Office (IPO).
NAND flash wafer prices rise above cash cost levels
NAND flash wafer prices have been rising in the third quarter of 2019, and have exceeded manufacturers' cash cost levels, according to industry sources.
Taiwan 2Q19 economic growth re-estimated at 2.40%
Taiwan's economic growth for second-quarter 2019 has been re-estimated at 2.40%, 0.01pp lower than 2.41% forecast at end-of-July according to the Directorate General of Budget, Accounting and Statistics (DGBAS).
Apple is expected to launch its new iPhones soon, but it seems few would expect strong sales or major spec upgrades for the new phones. News from the supply chain has claimed that PCB order momentum ahead of the new iPhone launch has...
CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects to see its GaN power components and RF devices packaging business start contributing revenues in the second half of 2020,...
GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter of 2019, according to industry sources.
Taiwan LCD monitors – 2Q 2019
Taiwan PC monitor shipments continued their on-year growth momentum in the second quarter of 2019, but the increase slowed to...
Taiwan small- to mid-size LCD panels – 2Q 2019
Although second-quarter 2019 was the traditional peak season for the small- to medium-size panel industry, Taiwan's shipments...
China smartphone AP shipments – 2Q 2019
Second-quarter 2019 smartphone application processor (AP) shipments to China showed 39.1% sequential growth, higher than previously...
Taiwan semiconductor foundry sector, 2Q19
According to Digitimes Research's observation, with global market demand on a moderate increase in second-quarter 2019, Taiwan-based...
Global AIO PC shipment forecast and industry analysis, 2019
Global all-in-one (AIO) PC shipments will continue shrinking in 2019, following 2018's around 2% on-year drop. With issues such...
Global AP demand forecast, 2017-2022
Amid bleak outlook for downstream vendors, uncertainties surrounding the US-China trade tension, factory relocation and exchange...