Highlights of the day: Global server shipments to grow in 2021 with keener competition among makers
Foxconn reportedly has entered Google' datacenter server supply chain, ready to ship to the client from its plant in the US state of Wisconsin. The latest development is expected to heat up competition among server makers next year. Taiwan-based...
Manufacturing equipment supplier C Sun expects equipment used in advanced IC packaging, mainly SiP (system in package), FO-WLP (fan-out wafer-level package) and CoWoS (chip-on-wafer-on-substrate), to be the major source of business growth in 2021.
Qualcomm has strengthened its ties with Taiwan's semiconductor sector in the wake of the US-China trade war, resulting in increased orders and strong sales for related supply chain makers in 2020 despite the pandemic-induced impacts, according to industry sources.
IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand for power management ICs for 5G and 8K applications, according to industry sources.
ASIC design service and IP provider Faraday Technology has announced its memory compilers based on UMC's 28nm embedded High Voltage (eHV) process technology have been subsequently used by major mobile OLED driver IC customers in multiple project tape-outs.
Toshiba has maintained that it has not reached any "definitive decisions" to sell its two wafer fabs. But even if any of the pure-play foundries manage to buy Toshiba's fabs, the supply of 8-inch wafer fab capacity will remain short of...
Production indexes for Taiwan-based makers of various electronic components for fourth-quarter 2020 remain high, according to Taiwan Institute of Economic Research (TIER).
Taiwan's III-V semiconductor supply chain players are gearing up to deepen deployments in the segment of GaN-based power components and RF modules increasingly applied to 5G handsets and other consumer electronics devices, according to industry sources.
Use of SiC-based MOSEFET in EVs to pick up momentum
Tesla's adoption of SiC-based MOSFETs for Model 3 is expected to cause other electric vehicle (EV) vendors to follow suit, but their use will not be popular until year-end 2021 or 2022 because certification will take a long time and availability of SiC is likely to be quite limited, according to industry...
Global IC foundry output value to rise over 20% in 2020
Output value for the global IC foundry industry is forecast to surge more than 20% in 2020, and will register another on-year growth but at a slower pace in 2021, according to Digitimes Research.
Toshiba is reportedly seeking to sell its 8-inch fabs in the first quarter of 2021, but the global 8-inch foundry capacity shortages will still hardly be relieved even if the Japanese IDM's fabs are sold to pure-play foundry houses that look to increase their supply to clients, according to industry...
Highlights of the day: TSMC closer to 3nm production
TSMC has held a ceremony marking the completion of the plant structure for its 3nm fab at the Southern Taiwan Science Park (STSP). The foundry house is expected to kick off commerical production at the 3nm fab in 2022. In the semiconductor...
5G mmWave AiP (antenna in package) modules are on track to gain increasing penetration in handsets and other devices after being incorporated into iPhone 12 series, and FC-AiP technology is expected to become the mainstream backend process for such modules, prompting more backend supply chain players...
Memory backend houses raise quotes on rising gold costs
Taiwan-based memory backend houses have raised their quotes for wire bonding to reflect rising raw materials costs, according to industry sources.
Taiwan Mask optimistic about 2021
Photomask supplier Taiwan Mask (TMC) has expressed optimism about its operations in 2021, citing robust demand from 8-inch and 12-inch foundries for mature-node manufacturing.
TSMC 3nm fab nears completion
TSMC has held a topping-out ceremony for a new 3nm fab at its manufacturing base at the Southern Taiwan Science Park (STSP), paving the way for the new facility to kick off commercial production in the second half of 2022.
Highlights of the day: Foundry quotes rising
BT substrate production lead time extended
The supply of ABF substrate has been tight, which has also pushed up BT substrate production lead times, according to industry sources.
Top-15 semiconductor suppliers to see combined revenue increase 13% in 2020, says IC Insights
The world's top-15 semiconductor companies are forecast to see their combined sales increase 13% in 2020, slightly more than twice the expected total worldwide semiconductor industry growth of 6%, according to IC Insights.
Demand for 8-inch and smaller silicon wafers rebounds
Semiconductor-grade silicon wafer makers, mainly GlobalWafers, Formosa Sumco Technology (FST) and Wafer Works, have seen demand for 8-inch and smaller models sharply rebound since mid-November 2020, according to industry sources.
IC backend service provider Winstek Semiconductor (formerly STATS ChipPAC Taiwan) is expected to see a surge in demand for blockchain-use AI chips in December, according to company president Richard Weng.
ASE to hire over 3,000 for plant in southern Taiwan
Backend house ASE Technology has announced plans to recruit over 3,000 engineers and technicians for its factory complex in Kaohsiung, southern Taiwan seeking to better meet robust backend demand from 5G, notebook, tablet and networking segments in 2021.
Sigurd counts on 5G chips for sustained growth in 2021
Testing house Sigurd Microelectronics is optimistic about its business outlook for 2021, as testing demand for related chips for 5G phone, networking, automotive and AI applications will remain strong in the coming year.
Eight-inch foundry quotes to rise up to 40% in 2021
Pure-play foundries including Globalfoundries, United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have raised their 8-inch foundry quotes by 10-15% in the fourth quarter, with the quotes set to rise by another 20-40% in 2021, according to industry sources.
The 'curse' of chip scaling
Moore's Law will continue to be embraced as sort of a faith when it becomes inapplicable, but chiplets will have a chance to become the mainstream in future IC design, according to Chris Lin, chairman and president of Taiwan-based IC design house Aspeed Technology.
Global tablet market – 3Q 2020
Global tablet shipments amounted to 43.83 million units in third-quarter 2020, up 10.5% on quarter and 0.4% on year.
China smartphone AP shipments – 3Q 2020
Smartphone application processor shipments to China-based vendors amounted to 192.6 million units in third-quarter 2020, up...
China smartphone market and industry – 3Q 2020
Smartphone shipments to the China market in third-quarter 2020 plunged 25.2% on quarter and 26.2% on year due to the US government...
Global mobile device shipment forecasts, 2021 and beyond: Smartphones, notebooks and tablets
Notebook and tablet shipments are both expected to increase from a year ago in 2020 due to demand from stay-at-home activities,...
Outbreak impact: China smartphone and AP shipments
The coronavirus outbreak has resulted in labor shortages and shipment disruptions in China's supply chain, but Digitimes Research...
Coronavirus impact special report: Mobile devices
The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines...