IC manufacturing
  • TSMC on track to start 3nm production in 2022
    TSMC has been fast advancing its manufacturing processes. It is on track to move 5nm node to commercial production in the second half of 2020, and will soon break ground for a 3nm facility where volume production will start in 2020. Next...
  • LTCC to be mainstream packaging material for mmWave modules
    The market for packaging materials for 5G mmWave transmission modules is set to heat up in 2020, with LTCC (low temperature co-fired ceramic) likely to replace LCP (liquid crystal polymer) as the mainstream material, according to industry sources.
  • Demand from the Wi-Fi 6 sector is picking up
    MediaTek and Realtek Semiconductors are both gearing up to ramp up their output of Wi-Fi 6 (802.11ax) chips in 2020, according to sources at IC testing solutions providers.
  • Taiwan's IC backend service providers have seen sales grow in 2H19
    Despite the ongoing US-China trade tensions, Taiwan's IC packaging and testing industry is still expected to see second-half 2019 revenues grow from the first half thanks to rising demand for 5G-related applications, according to Digitimes Research.
  • Prospects bright for silicon wafer suppliers, fab toolmakers
    Taiwan-based silicon wafer suppliers and fab toolmakers, particularly those in the supply chain of TSMC, have enjoyed a ramp-up in orders recently and become optimistic about their sales outlook for 2020.
  • Qualcomm
    TSMC uses its N7, the foundry's 7nm process without EUV, to fabricate Qualcomm's latest flagship processor, Snapdragon 865 series. Nevertheless, its Snapdragon 765 chips are being manufactured using Samsung's EUV-based 7nm process technology.
  • TSMC to kick off 3nm production in 2022
    TSMC is firmly on track to move 5nm process technology to commercial production in the first half of 2020 and will kick off production of chips built using a newer 3nm process node in 2022, according to JK Wang, the firm's senior vice president for fab operations.
  • Semiconductor sales are expected to decline in 2019
    With revenues plunging by 14.7% in the third quarter, the global semiconductor market appears destined for a year of double-digit decline despite some signs of growth in the critical memory segment, according to IHS Markit.
  • 5G to see intense competition in midrange phone segment
    Qualcomm has introduced its new 5G SoC lineup - the Snapdragon 865 series for smartphone vendors' flagship models and the 765 series for midrange to high-end ones. But it is the midrange smartphone market segment that is expected to see...
  • Taiwan's IC designers are seeking to form tighter ties with China's foundries
    More Taiwan-based IC design houses are moving to strengthen partnerships with foundries in China so as to land more orders from Chinese brand vendors seeking to cut reliance on US supplies of key semiconductor components, according to industry sources.
  • Powerchip chairman
    Powerchip Semiconductor Manufacturing (PSMC), a foundry subsidiary of Powerchip Technology, has enjoyed robust demand for smartphone-use sensors which is filling its 12-inch fab capacity.
  • ST closes acquisition of silicon carbide wafer specialist Norstel AB
    STMicroelectronics has announced the closing of the full acquisition of Swedish silicon carbide (SiC) wafer manufacturer Norstel AB. ST exercised its option to acquire the remaining 45% stake, following the initial transaction announced in February 2019. The total consideration for the acquisition...
  • Qualcomm Snapdragon 865 and 765 series
    Qualcomm has introduced its new Snapdragon 865 and 765 seies SoC chips designed for 5G-capable Android smartphones slated for launch in 2020. TSMC and Samsung Foundry reportedly are both being contracted to manufacture the chips.
  • Semiconductor sales increased in October
    Worldwide semiconductor sales grew nearly 3% sequentially in October. However, sales posted an on-year decline for the 10th consecutive month.
  • Worldwide semiconductor equipment manufacturers posted third-quarter 2019 billings
    Worldwide semiconductor equipment manufacturers posted third-quarter 2019 billings of US$14.9 billion, a sequential increase of 12% but a 6% decrease on year, according to SEMI.
  • CHPT obtains major orders for 5G chips
    Chunghwa Precision Test Tech (CHPT) has obtained orders for test interfaces for 5G smartphone chips from the world's first-tier fabless chipmakers, and is poised to enjoy a strong 2020, according to industry sources.
  • 5G mobile SoC price will stay at high levels
    5G mobile SoC unit price will stay above US$100 in the first half of 2020, several times that for 4G solutions, as tight capacity at TSMC's 7nm node is likely to keep production cost at high levels, according to industry sources.
  • UMC announces 22nm tech readiness
    UMC has announced the technology readiness of its 22nm process technology following first-pass silicon success using a USB 2.0 test vehicle.
  • UMC co-president SC Chien
    Taiwan's pure-play foundry UMC will see clear growth momentum in 2020 come from ever-increasing chips foundry demand for 5G applications, with clients moving actively to pull in shipments to build up inventory, according to company co-president SC Chien.
  • Mobile chipmakers are gearing up to secure stronger support from supply chain partners
    Mobile chipmakers are gearing up to secure stronger support from supply chain partners aiming to gain a greater presence in the market for 5G smartphones whose shipments are estimated to reach at least 200 million units in 2020, according to industry sources.
  • Taiwan's economic growth for third-quarter 2019 is estimated at 2.99%
    Taiwan's economic growth for third-quarter 2019 is estimated at 2.99%, 0.32pp higher than 2.67% forecast in August 2019, reaching the highest quarterly level since third-quarter 2018, according to the Directorate General of Budget, Accounting and Statistics (DGBAS).
  • Nuvoton to buy Panasonic chip unit
    Panasonic has agreed to sell its semiconductor business to Nuvoton Technology, a Taiwan-based MCU specialist majority owned by memory chipmaker Winbond Electronics.
  • Panasonic to quit chipmaking business
    With its decision to sell its chipmaking operations to Taiwan's Nuvoton Technology, Panasonic will leave the chipmaking industry where it was once among the world's top-10 players in the 90s.
  • UMC has kicked off risk production for 5G RF switches using its 12-inch wafer fabrication lines
    UMC may have quit the expensive race to advance manufactuing nodes, but it has been keen to develop specialty process. The latest development reportedly sees th pure-play foundry enter risk production for 5G FR switches at its 12-inch...
  • 5G devices are driving demand
    GaAs foundry Advanced Wireless Semiconductor (AWSC) is gearing up for capacity expansion to satisfy ever-expanding demand for 5G RF (radio frequency), PA (power amplifier), WiFi 6 and VCSEL devices, according to industry sources.

Taiwan LCD TVs – 3Q 2019

Taiwan LCD monitors – 3Q 2019

Global tablet market – 3Q 2019

Global LCD panel shipment forecast, 2020 and beyond

Global mobile device shipment forecasts, 2020 and beyond: Smartphones, notebooks and tablets

Taiwan semiconductor foundry sector, 2Q19

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