Foxconn reportedly has entered Google' datacenter server supply chain, ready to ship to the client from its plant in the US state of Wisconsin. The latest development is expected to heat up competition among server makers next year. Taiwan-based...

Manufacturing equipment supplier C Sun expects equipment used in advanced IC packaging, mainly SiP (system in package), FO-WLP (fan-out wafer-level package) and CoWoS (chip-on-wafer-on-substrate), to be the major source of business growth in 2021.

Qualcomm has strengthened its ties with Taiwan's semiconductor sector in the wake of the US-China trade war, resulting in increased orders and strong sales for related supply chain makers in 2020 despite the pandemic-induced impacts, according to industry sources.

IC packagers including ASE Technology and Greatek Electronics have been running QFN (quad flat no-lead) wire bonding lines at full capacity utilization, mainly driven by strong demand for power management ICs for 5G and 8K applications, according to industry sources.

ASIC design service and IP provider Faraday Technology has announced its memory compilers based on UMC's 28nm embedded High Voltage (eHV) process technology have been subsequently used by major mobile OLED driver IC customers in multiple project tape-outs.

Toshiba has maintained that it has not reached any "definitive decisions" to sell its two wafer fabs. But even if any of the pure-play foundries manage to buy Toshiba's fabs, the supply of 8-inch wafer fab capacity will remain short of...

Production indexes for Taiwan-based makers of various electronic components for fourth-quarter 2020 remain high, according to Taiwan Institute of Economic Research (TIER).

Taiwan's III-V semiconductor supply chain players are gearing up to deepen deployments in the segment of GaN-based power components and RF modules increasingly applied to 5G handsets and other consumer electronics devices, according to industry sources.

Tesla's adoption of SiC-based MOSFETs for Model 3 is expected to cause other electric vehicle (EV) vendors to follow suit, but their use will not be popular until year-end 2021 or 2022 because certification will take a long time and availability of SiC is likely to be quite limited, according to industry...

Output value for the global IC foundry industry is forecast to surge more than 20% in 2020, and will register another on-year growth but at a slower pace in 2021, according to Digitimes Research.

Toshiba is reportedly seeking to sell its 8-inch fabs in the first quarter of 2021, but the global 8-inch foundry capacity shortages will still hardly be relieved even if the Japanese IDM's fabs are sold to pure-play foundry houses that look to increase their supply to clients, according to industry...

TSMC has held a ceremony marking the completion of the plant structure for its 3nm fab at the Southern Taiwan Science Park (STSP). The foundry house is expected to kick off commerical production at the 3nm fab in 2022. In the semiconductor...

5G mmWave AiP (antenna in package) modules are on track to gain increasing penetration in handsets and other devices after being incorporated into iPhone 12 series, and FC-AiP technology is expected to become the mainstream backend process for such modules, prompting more backend supply chain players...

Taiwan-based memory backend houses have raised their quotes for wire bonding to reflect rising raw materials costs, according to industry sources.

Photomask supplier Taiwan Mask (TMC) has expressed optimism about its operations in 2021, citing robust demand from 8-inch and 12-inch foundries for mature-node manufacturing.

TSMC has held a topping-out ceremony for a new 3nm fab at its manufacturing base at the Southern Taiwan Science Park (STSP), paving the way for the new facility to kick off commercial production in the second half of 2022.

Tight capacity has already sent pure-play foundries raising quotes for the 8-inch segment by 10-15% in fourth-quarter 2020, and further rises are expected in 2021. Demand for 8-inch and smaller silicon...

The supply of ABF substrate has been tight, which has also pushed up BT substrate production lead times, according to industry sources.

The world's top-15 semiconductor companies are forecast to see their combined sales increase 13% in 2020, slightly more than twice the expected total worldwide semiconductor industry growth of 6%, according to IC Insights.

Semiconductor-grade silicon wafer makers, mainly GlobalWafers, Formosa Sumco Technology (FST) and Wafer Works, have seen demand for 8-inch and smaller models sharply rebound since mid-November 2020, according to industry sources.

IC backend service provider Winstek Semiconductor (formerly STATS ChipPAC Taiwan) is expected to see a surge in demand for blockchain-use AI chips in December, according to company president Richard Weng.

Backend house ASE Technology has announced plans to recruit over 3,000 engineers and technicians for its factory complex in Kaohsiung, southern Taiwan seeking to better meet robust backend demand from 5G, notebook, tablet and networking segments in 2021.

Testing house Sigurd Microelectronics is optimistic about its business outlook for 2021, as testing demand for related chips for 5G phone, networking, automotive and AI applications will remain strong in the coming year.

Pure-play foundries including Globalfoundries, United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have raised their 8-inch foundry quotes by 10-15% in the fourth quarter, with the quotes set to rise by another 20-40% in 2021, according to industry sources.

Moore's Law will continue to be embraced as sort of a faith when it becomes inapplicable, but chiplets will have a chance to become the mainstream in future IC design, according to Chris Lin, chairman and president of Taiwan-based IC design house Aspeed Technology.