Highlights of the day: Intel to increase output
Notebook ODMs have again been hit by Intel CPU shortages. But Bob Swan, visiting Taiwan for the first time as Intel's CEO, said his company is expanding production capacity, particularly for 14nm processors. Swan noted that Taiwan has...
UMC September revenues down, VIS up
United Microelectronics (UMC) saw its September revenues decline 17.9% sequentially, while revenues at Vanguard International Semiconductor (VIS) increased nearly 2% on month.
TSMC posts record 3Q19 revenues
Pure-play foundry TSMC saw its third-quarter revenues beat the guidance given in July. The results also hit a quarterly record.
Intel will be gradually expanding its foundry production capacity, particularly for 14nm process this year, according to company CEO Bob Swan. Swan and other Intel executives arrived in Taiwan earlier this week meeting with local partners and suppliers.
Taiwan's imports of semiconductor equipment shot up 65.1% on year to US$2.5 billion in September and surged 32.2% to US$15.5 billion for the first three quarters of 2019, according to customs statistics.
GlobalWafers, a semiconductor silicon wafer maker, began trial production of SiC wafers in May-June 2019 and plans to start production in small volume in second-quarter 2020, according to company chairwoman Doris Hsu.
The global IC foundry industry output value will grow by a CAGR of 5.3% to reach US$75.42 billion in 2024, the final year of a five-year forecast period, driven by chip demand for 5G, AI and HPC applications, according to Digitimes Research.
Samsung develops 12-layer 3D-TSV
Samsung Electronics has announced the development of 12-layer 3D-TSV chip packaging technology.
Win Semi 3Q19 revenues beat guidance
GaAs foundry Win Semiconductors' third-quarter 2019 revenues climbed over 40% sequentially, beating its estimate of about 30% growth, due partly to strong demand for compound semiconductor power and sensing devices for new handsets launched by vendors in the US and China, where the company plays an...
Samsung announces earnings guidance for 3Q19
Samsung Electronics has announced its earnings guidance for the third quarter of 2019, expecting consolidated sales to reach KRW62 trillion (US$51.94 billion) and consolidated operating profit to come to KRW7.7 trillion.
Taiwan September exports down
Taiwan recorded exports totaling US$28.1 billion in value in September 2019, dropping 2.4% sequentially and 4.6% on year, while imports reached total value of US$24.97 billion, up 9.4% sequentially but down 0.6% on year, according to statistics released by the Ministry of Finance (MOF).
GlobalWafers 4Q19 sales likely to stay flat
Silicon wafer supplier GlobalWafers is expected to see its fourth-quarter revenues stay flat on quarter, following a 2.7% sequential drop in the prior quarter, according to market sources.
TSMC has announced that its 7nm EUV-based process technology, dubbed N7+, is delivering customer products to market in high volume.
Taiwan-based Integrated Service Technology (iST), specialized in offering semiconductor materials analysis and IC debugging services, has seen its revenues stay at high levels since June 2019 on the gradual take-off of 5G chips testing services and will perform even better in 2020, according to company...
Transcom, a Taiwan-based GaAs chip and foundry company, is expected to report impressive financial results for 2019 thanks mainly to robust orders for niche-market power amplifiers, according to market sources.
Xintec eyeing return to profit in 2019
Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.
Highlights of the day: A good year for TSMC
It is not just application processors vendors that have been scrambling to secure production capacity for making their 5G offerings at TSMC's 7nm node, which is also catering to AI processors developers, such as Nvidia, Xilinx and Bitmain...
GaAs firms to thrive on robust VCSEL, PA, RF demand
Taiwan-based GaAs IC foundries and epitaxial wafer suppliers are set to enjoy strong sales in the fourth quarter of 2019 and beyond, driven by robust demand for VCSEL and PA (power amplifier) and RF (radio frequency) devices, according to industry sources.
CHPT, Keystone see orders for 5G chips ramp up
Taiwan-based IC test solutions providers Chunghwa Precision Test Tech (CHPT) and Keystone Microtech have both seen orders for 5G SoC and other related chips ramp up substantially buoying their sales performance during the third quarter, according to industry sources.
TSMC with its competitive 7nm process technology has obtained orders for made-for-AI chip processors from Nvidia, Xilinx and Qualcomm, and a number of China-based vendors such as Huawei, Bitmain and Alibaba, according to industry sources.
Advanced packaging, mini LED rising as new growth driver: Q&A with Kulicke & Soffa SVP CP Chong
US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging equipment.
TSMC to post record 2019 revenues
TSMC is expected to see its third-quarter revenues rise and post another sequential revenue increase in the fourth quarter. The anticipated rebound in revenues during the second half of 2019 will likely allow the pure-play foundry to enjoy another year of record-high sales, according to market sourc...
ASE provides SiP for TWS device SoC
Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS) devices, according to market sources.
Taiwan's COF (chip on film) supply chain is poised to embrace a prosperous year in 2020, as new COF solutions are expected to be massively applied to integrate optical in-display fingerprint sensor chips and TDDI ICs for application to new smartphones for the year, according to industry sources.
TSMC and other major Taiwanese IC backend service providers including ASE Technology and Powertech Technology (PTI) are ready to offer, or have exerted efforts to develop, AiP (antenna-in-package) packaging process for the manufacture of mmWave 5G devices, according to industry sources.
Global notebook shipment forecast, 2020 and beyond
Notebook shipments in 2019 are estimated to show a 1.6% increase with vendors ramping up inventory in preparation for the US-China...
Global server shipment forecast, 2020 and beyond
According to Digitimes Research's observation, the server market is experiencing sluggish growth in 2019 with customer inventory...
Taiwan handsets – 2Q 2019
Taiwan's handset shipments arrived at 13.8 million units in the second quarter of 2019, a level similar to that of the previous...
Taiwan semiconductor foundry sector, 2Q19
According to Digitimes Research's observation, with global market demand on a moderate increase in second-quarter 2019, Taiwan-based...
Global AIO PC shipment forecast and industry analysis, 2019
Global all-in-one (AIO) PC shipments will continue shrinking in 2019, following 2018's around 2% on-year drop. With issues such...
Global AP demand forecast, 2017-2022
Amid bleak outlook for downstream vendors, uncertainties surrounding the US-China trade tension, factory relocation and exchange...