IC manufacturing
  • Oversupply coupled with weakening economy and demand has sent memory prices crashing this year
    The DRAM sector enjoyed robust growth in 2018, but oversupply coupled with weakening economy and demand has sent memory prices crashing this year. But there may be good news around the corner, with Adata's chairman expecting DRAM pricing...
  • Intel unveils new Comet Lake mobile CPUs for ultra-thin notebooks
    Intel has introduced eight new mobile processors that are based on its 14nm Comet Lake architecture, under its U and Y series for ultra-thin notebooks and over 90 new ultra-thin notebooks using the CPUs are expected to become available in the market before the end of 2019.
  • Samsung's 7nm EUV manufacturing yield rates are still lower than expected
    Speculation has started circulating in the chipmaking industry that Samsung's 7nm EUV manufacturing yield rates are still lower than expected and may interrupt production for Qualcomm's mid-range 5G SoC slated for launch in the first quarter of 2020.
  • Tong Hsing expects its revenues to pick up
    Tong Hsing Electronic Industries, which supplies ceramic substrates as well as packaging services for CMOS image sensors and other niche ICs, expects its revenues to pick up sequentially to peak in the fourth quarter of 2019, driven by a ramp-up in shipments of new products such as supersonic sensors...
  • Eight-inch fab utilization rates continue to fall on weak demand
    Eight-inch fab utilization rates continue to fall on weak demand for automotive and consumer ICs and are unlikely to rebound until the first half of 2020, according to industry sources.
  • Semiconductor equipment billings grew slightly on month
    Billings among North American manufacturers of semiconductor production equipment grew slightly on month, but posted a year-over-year decline for the 9th consecutive month in July, according to SEMI.
  • TSMC to improve density by stacking multiple layers of transistors into monolithic 3D ICs
    For TSMC, Moore's Law is far from being dead. While it has been keen to grow chip density on the transistor level, advancing packaging technology is one of the possible ways TSMC is embracing to improve density by stacking multiple layers of transistors into what it calls monolithic...
  • Keystone have seen a drastic pickup in 5G-driven orders
    Taiwan-based IC testing solutions providers including Keystone Microtech have seen a drastic pickup in 5G-driven orders from chipmakers in Taiwan and China for test interfaces such as probe cards, burn-in boards for IC aging rest, and load boards for final testing in the second half of 2019, according...
  • TSMC continues to move forward with its 3D-IC integration technology development
    TSMC continues to move forward with its 3D-IC integration technology development, pursuing cutting-edge performance resulting from heterogeneous components that are "seamlessly connected."
  • The top-15 semiconductor companies saw their combined sales drop by 18% from a year earlier
    IC Insights has released its list of the world's top-15 semiconductor suppliers in the first half of 2019, and identified Sony as the only company registering year-over-year growth during the six-month period.
  • A ramp-up in orders for NAND flash memory will boost revenues at ChipMOS and OSE
    A ramp-up in orders for NAND flash memory will boost revenues at backend houses ChipMOS Technologies and Orient Semiconductor Electronics (OSE) in the second half of 2019, according to industry sources.
  • TSMC EUV node manufacturing to drive profit growth starting 2020
    Growing chip demand for 5G- and AIoT-related applications will boost TSMC's revenues for 2020, which are expected to climb over 10% on year, according to industry sources.
  • The order value for January-July totaled US$263.39 billion
    Taiwan received export orders with total value of US$40.53 billion in July 2019, increasing 5.3% sequentially but decreasing 3.0% on year, according to the Ministry of Economic Affairs (MOEA).
  • MediaTek's development of SoC chips designed for 5G-enabled smartphones is on schedule
    Taiwan-based IC designer house MediaTek reportedly is on track to roll out its first 5G SoC series, codenamed MT6885, in fourth-quarter 2019, ready for commercial production in first-quarter 2020. The 5G market may see explosive growths...
  • Powerchip has reported net losses of NT$2.69 billion in 1H19

    Foundry chipmaker Powerchip Technology has reported net losses of NT$2.69 billion (US$85.7 million) in the first half of 2019. EPS was negative NT$0.85 for the six-month period.

  • Competition heating up in 5G mobile SoC market
    Unsatisfactory yield rates at Samsung's 7nm EUV process may affect production for the upcoming Qualcomm Snapdragon 7250 mobile SoC, but MediaTek's development of 5G chips, with support from TSMC, is on schedule with volume production to kick off in the first quarter of 2020, expected according to industry...
  • Shang-yi Chiang, CEO of HSMC
    While Moore's Law is approaching its physical limits, only a few could still afford the expensive game of process shrink. And when the post-Moore's Law era comes, semiconductor firms, though lost in Moore's Law, may realize that there is another solution: chiplets, according to Shang-yi Chiang, CEO...
  • Nvidia facing challenges from AMD, Intel in the graphics card market
    Nvidia's dominance in the discrete graphics card market is expected to see strong challenges from Intel and AMD beginning from 2021, according to sources from the upstream supply chain.
  • Demand for GaN-based RF components and PAs is heading for long-term growth
    Demand for GaN-based RF components and power amplifiers (PAs) is heading for long-term growth along with the establishment of 5G networks, according to industry sources.
  • TSMC led Taiwan-based applicants in the number of applications for inventions
    Taiwan-based and foreign applicants applied for 35,534 patents during first-half 2019, increasing 0.68% on year, according to Intellectual Property Office (IPO).
  • NAND flash wafer prices have exceeded manufacturers' cash cost levels
    NAND flash wafer prices have been rising in the third quarter of 2019, and have exceeded manufacturers' cash cost levels, according to industry sources.
  • Taiwan's economic growth lower than 2.41% forecast at end-of-July
    Taiwan's economic growth for second-quarter 2019 has been re-estimated at 2.40%, 0.01pp lower than 2.41% forecast at end-of-July according to the Directorate General of Budget, Accounting and Statistics (DGBAS).
  • Orders for the iPhones have thus far been weaker compared to the momentum in previous years
    Apple is expected to launch its new iPhones soon, but it seems few would expect strong sales or major spec upgrades for the new phones. News from the supply chain has claimed that PCB order momentum ahead of the new iPhone launch has...
  • Xintec has put increased focus on high-profit segments of healthcare
    CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects to see its GaN power components and RF devices packaging business start contributing revenues in the second half of 2020,...
  • Shipments for 3D sensing components ramping up
    GaAs foundry Win Semiconductors, and backend houses Xintec and ShunSin Technology have started ramping up shipments for structured light 3D sensing components in the third quarter of 2019, according to industry sources.

Taiwan LCD monitors – 2Q 2019

Taiwan small- to mid-size LCD panels – 2Q 2019

China smartphone AP shipments – 2Q 2019

Taiwan semiconductor foundry sector, 2Q19

Global AIO PC shipment forecast and industry analysis, 2019

Global AP demand forecast, 2017-2022

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