IC manufacturing
  • Intel expanding production capacity, particularly for 14nm processors
    Notebook ODMs have again been hit by Intel CPU shortages. But Bob Swan, visiting Taiwan for the first time as Intel's CEO, said his company is expanding production capacity, particularly for 14nm processors. Swan noted that Taiwan has...
  • UMC saw its September revenues decline 17.9% sequentially
    United Microelectronics (UMC) saw its September revenues decline 17.9% sequentially, while revenues at Vanguard International Semiconductor (VIS) increased nearly 2% on month.
  • TSMC saw its third-quarter revenues beat the guidance
    Pure-play foundry TSMC saw its third-quarter revenues beat the guidance given in July. The results also hit a quarterly record.
  • Swan
    Intel will be gradually expanding its foundry production capacity, particularly for 14nm process this year, according to company CEO Bob Swan. Swan and other Intel executives arrived in Taiwan earlier this week meeting with local partners and suppliers.
  • Taiwan's imports of semiconductor equipment shot up 65.1% on year
    Taiwan's imports of semiconductor equipment shot up 65.1% on year to US$2.5 billion in September and surged 32.2% to US$15.5 billion for the first three quarters of 2019, according to customs statistics.
  • GlobalWafers chairwoman and SAS president Doris Hsu
    GlobalWafers, a semiconductor silicon wafer maker, began trial production of SiC wafers in May-June 2019 and plans to start production in small volume in second-quarter 2020, according to company chairwoman Doris Hsu.
  • The global IC foundry industry output value will grow by a CAGR of 5.3%
    The global IC foundry industry output value will grow by a CAGR of 5.3% to reach US$75.42 billion in 2024, the final year of a five-year forecast period, driven by chip demand for 5G, AI and HPC applications, according to Digitimes Research.
  • Samsung has announced the development of 12-layer 3D-TSV chip packaging technology
    Samsung Electronics has announced the development of 12-layer 3D-TSV chip packaging technology.
  • Win Semi' third-quarter 2019 revenues climbed over 40% sequentially
    GaAs foundry Win Semiconductors' third-quarter 2019 revenues climbed over 40% sequentially, beating its estimate of about 30% growth, due partly to strong demand for compound semiconductor power and sensing devices for new handsets launched by vendors in the US and China, where the company plays an...
  • Samsung has announced its earnings guidance for the third quarter of 2019
    Samsung Electronics has announced its earnings guidance for the third quarter of 2019, expecting consolidated sales to reach KRW62 trillion (US$51.94 billion) and consolidated operating profit to come to KRW7.7 trillion.
  • Taiwan recorded exports totaling US$28.1 billion in September 2019
    Taiwan recorded exports totaling US$28.1 billion in value in September 2019, dropping 2.4% sequentially and 4.6% on year, while imports reached total value of US$24.97 billion, up 9.4% sequentially but down 0.6% on year, according to statistics released by the Ministry of Finance (MOF).
  • GlobalWafers is expected to see its fourth-quarter revenues stay flat on quarter
    Silicon wafer supplier GlobalWafers is expected to see its fourth-quarter revenues stay flat on quarter, following a 2.7% sequential drop in the prior quarter, according to market sources.
  • The N7+ volume production is one of the fastest on record
    TSMC has announced that its 7nm EUV-based process technology, dubbed N7+, is delivering customer products to market in high volume.
  • iST has seen its revenues stay at high levels since June 2019
    Taiwan-based Integrated Service Technology (iST), specialized in offering semiconductor materials analysis and IC debugging services, has seen its revenues stay at high levels since June 2019 on the gradual take-off of 5G chips testing services and will perform even better in 2020, according to company...
  • Transcom is expected to report impressive financial results for 2019
    Transcom, a Taiwan-based GaAs chip and foundry company, is expected to report impressive financial results for 2019 thanks mainly to robust orders for niche-market power amplifiers, according to market sources.
  • IC packaging house Xintec is eyeing its return to profitability this year
    Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.
  • TSMC with its competitive 7nm process technology has obtained orders for made-for-AI chip processors
    It is not just application processors vendors that have been scrambling to secure production capacity for making their 5G offerings at TSMC's 7nm node, which is also catering to AI processors developers, such as Nvidia, Xilinx and Bitmain...
  • Win Semi is also expected to see its September revenues hit a new monthly high
    Taiwan-based GaAs IC foundries and epitaxial wafer suppliers are set to enjoy strong sales in the fourth quarter of 2019 and beyond, driven by robust demand for VCSEL and PA (power amplifier) and RF (radio frequency) devices, according to industry sources.
  • CHPT sees orders for 5G chips ramp up
    Taiwan-based IC test solutions providers Chunghwa Precision Test Tech (CHPT) and Keystone Microtech have both seen orders for 5G SoC and other related chips ramp up substantially buoying their sales performance during the third quarter, according to industry sources.
  • Pingtouge unveils first AI chip
    TSMC with its competitive 7nm process technology has obtained orders for made-for-AI chip processors from Nvidia, Xilinx and Qualcomm, and a number of China-based vendors such as Huawei, Bitmain and Alibaba, according to industry sources.
  • CP Chong, SVP at Kulicke & Soffa
    US-based semiconductor assembly equipment supplier Kulicke & Soffa (K&S) is optimistic that 5G and AI applications will drive demand for advanced IC packaging equipment.
  • TSMC to enjoy strong revenue growth in 2H19
    TSMC is expected to see its third-quarter revenues rise and post another sequential revenue increase in the fourth quarter. The anticipated rebound in revenues during the second half of 2019 will likely allow the pure-play foundry to enjoy another year of record-high sales, according to market sourc...
  • ASE provides SiP for TWS device SoC
    Backend house ASE Technology Holding has offered a development board based on its system-in-package (SiP) services for heterogeneous SoC chips designed for true wireless stereo (TWS) devices, according to market sources.
  • Taiwan's COF supply chain is poised to embrace a prosperous year in 2020
    Taiwan's COF (chip on film) supply chain is poised to embrace a prosperous year in 2020, as new COF solutions are expected to be massively applied to integrate optical in-display fingerprint sensor chips and TDDI ICs for application to new smartphones for the year, according to industry sources.
  • ASE gearing up for AiP packaging process for the manufacture of mmWave 5G devices
    TSMC and other major Taiwanese IC backend service providers including ASE Technology and Powertech Technology (PTI) are ready to offer, or have exerted efforts to develop, AiP (antenna-in-package) packaging process for the manufacture of mmWave 5G devices, according to industry sources.

Global notebook shipment forecast, 2020 and beyond

Global server shipment forecast, 2020 and beyond

Taiwan handsets – 2Q 2019

Taiwan semiconductor foundry sector, 2Q19

Global AIO PC shipment forecast and industry analysis, 2019

Global AP demand forecast, 2017-2022

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