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Monday 15 December 2025
Samsung chair, Musk reportedly meet at Texas fab as chip output looms
Samsung Electronics chairman Jay Y. Lee reportedly met Tesla CEO Elon Musk on December 11, 2025, local time at Samsung's semiconductor plant in Texas, underscoring a deepening partnership as the South Korean chipmaker prepares to launch advanced chip production in the US and stabilize manufacturing yields for Tesla's next-generation processors.
Monday 15 December 2025
Samsung courts AMD for 2nm chips as foundry recovery hinges on new orders
Samsung Electronics is reportedly in talks with Advanced Micro Devices about producing next-generation chips using its second-generation 2nm process, as the South Korean technology group seeks to secure major customers and revive its loss-making foundry business, according to industry sources and reports from South Korea's Seoul Economic Daily and G-enews.
Monday 15 December 2025
TSMC, Broadcom AI outlook signals strong growth for Samsung, SK Hynix in 2026
Analysts believe that the performance outlook for 2026 from Taiwan Semiconductor Manufacturing Company (TSMC) and Broadcom offers a glimpse into the expected performance of South Korea's two semiconductor leaders, Samsung Electronics and SK Hynix.
Monday 15 December 2025
Weekly news roundup: TSMC pauses Japan fab plans, Tesla Powerwall demand rises in Taiwan, Huawei flags AI oversupply risks
These are the most-read DIGITIMES Asia stories in the week of December 8 to December 14, 2025.
Monday 15 December 2025
Intel CEO backs India's step-by-step semiconductor push
As India intensifies its efforts to become a global semiconductor hub, Intel CEO Lip-Bu Tan has expressed support for the country's strategy of pursuing incremental progress, focusing initially on legacy node fabrication for automotive and industrial applications.
Monday 15 December 2025
TSMC to expand CoW Orders in 2H26 as OSAT CoWoS-like tech rises
As major US CSPs are ramping up ASIC development, the capacity gap in TSMC's CoWoS advanced packaging continues to widen. Thus, the rise of "CoWoS-like" capacity by OSAT providers has emerged. To address the strong demand for advanced packaging capacity from AI GPU and ASIC vendors, and as IC design houses increasingly introduce second suppliers to enhance supply chain resilience, TSMC is expected to begin expanding the release of Chip-on-Wafer (CoW) packaging process orders to OSAT providers starting in 2026-2027.
Monday 15 December 2025
Intel reportedly to buy AI chip startup SambaNova, reviving governance questions over CEO ties
Bloomberg, citing unnamed sources, reported that Intel Corp. is in advanced discussions to acquire artificial intelligence chip startup SambaNova Systems Inc. for about US$1.6 billion including debt, a move that could significantly bolster Intel's AI product portfolio while reigniting scrutiny over governance and potential conflicts of interest linked to its chief executive.
Monday 15 December 2025
Taiwan set for 2026 outperformance on AI, advanced chip orders

Global growth is poised to lose momentum. IMF forecasts show global GDP easing from 3.3% in 2024 to 3.2% in 2025 and 3.1% in 2026. China's growth is expected to slow from 5% to 4.8% and then to 4.2%, while India may dip from 6.6% to 6.2%. Taiwan remains an outlier, supported by strong AI and semiconductor investment and exports, with GDP projected at 7.37% in 2025. Continued strength in AI server exports could also lift its 2026 forecast of 3.54%.

Monday 15 December 2025
Singapore boosts semiconductor sector with workforce training and new R&D hub
Singapore is expanding its domestic semiconductor capabilities through AI-focused workforce programs, SME digitalization efforts, and new research infrastructure, according to Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA).
Monday 15 December 2025
Samsung pushes new thermal packaging to win back Qualcomm and Apple

Samsung Electronics is positioning a proprietary thermal management technology for external clients as it seeks to reclaim foundry market share from TSMC. The South Korean company plans to offer its Heat Path Block solution to third-party chip designers after validating the system in its upcoming Exynos 2600 processor, according to local media reports.

Monday 15 December 2025
India roundup: Intel commits to India semiconductor mission
Intel and Tata to assemble chips locally as global firms, including Amazon, Microsoft, and Vingroup, announced fresh investments in India.
Sunday 14 December 2025
Taiwan's WinWay partners with Technoprobe and MS SUN in 5-year MEMS probe card deal
Taiwanese semiconductor wafer probe card maker WinWay Technology has entered a long-term supply agreement with Italy's Technoprobe, a leading probe card manufacturer, and Greater China distributor MS SUN Technology. The contract, spanning at least five years, covers the procurement of micro-electro-mechanical systems (MEMS) probe card products, marking a significant cross-border collaboration in the semiconductor testing sector.
Sunday 14 December 2025
Shih Her Technologies sees rising semiconductor demand driving growth despite labor challenges
Precision parts cleaning, once considered a routine task, has become a vital part of the semiconductor supply chain due to increasing demands for advanced process yields. Shih Her Technologies president Shyue-Jer Chen highlighted how this shift affects equipment utilization, process stability, and chip yields, raising the sector's importance year by year.
Saturday 13 December 2025
Commentary: Uncertainty rises as US delays Section 232 semiconductor tariff ruling after eight months
The US Department of Commerce (DOC) launched a Section 232 national security investigation on April 1, 2025, targeting semiconductors, manufacturing equipment, and related products. The review remains ongoing more than eight months later, as disagreements are still unsettled regarding which items should face tariffs and at what rates.
Friday 12 December 2025
Intel reportedly tests chip tools linked to sanctioned Chinese firms for 14A

Intel has evaluated advanced manufacturing equipment from ACM Research, a US supplier with subsidiaries subject to American trade restrictions, even as Chinese semiconductor toolmakers report surging revenues and technological gains.

Friday 12 December 2025
Japan's major banks and corporations back Rapidus with massive financing and new investments
Japan is accelerating its national push to rebuild an advanced semiconductor ecosystem as Rapidus, the country's flagship next-generation chip venture, secures financing from major banks and private equity from more than twenty Japanese companies. According to reports from Nikkei and Asahi Shimbun, Japan's three megabanks, Mitsubishi UFJ Bank, Sumitomo Mitsui Banking, and Mizuho Bank, will provide Rapidus with up to JPY2 trillion (approx. US$12.8 billion) in financing.
Friday 12 December 2025
VPEC will focus on optical components in 2026
AI data centers are seeing rapidly increasing demand for HPC and big data processing. The shift from traditional copper wiring to fiber optics boosts data transfer rates while lowering power consumption. Gallium arsenide (GaAs) epitaxy maker Visual Photonics Epitaxy Co. (VPEC) stated that while the smartphone market in 2026 is expected to remain flat or show slight growth, rising transmission efficiency requirements in AI data centers will drive planned equipment purchases and expanded capacity, making data centers the company's main growth driver for 2026.
Friday 12 December 2025
TSMC pauses work on second Kumamoto wafer fab amid potential shift to AI chip production
TSMC, through its Japanese subsidiary Japan Advanced Semiconductor Manufacturing (JASM), has halted construction on its second wafer fabrication facility in Kikuyo Town, Kumamoto Prefecture. The project, initially intended to produce 6-7nm and 40nm automotive and image sensor chips, saw a near-complete stoppage roughly two months after groundbreaking in October 2025.
Friday 12 December 2025
Foxconn pumps US$509M into new Kaohsiung HQ
Foxconn signed a development agreement with the Kaohsiung city government on December 12 to advance the Y15 mixed-use project along the city's MRT Yellow Line. The company will invest NT$15.9 billion (US$509 million) to build a new flagship headquarters in the Asia New Bay Area as it deepens its long-term commitments in southern Taiwan.
Friday 12 December 2025
Advantest unveils next-gen memory handler for AI, targets customer rollout in 2Q26
Japanese semiconductor test equipment manufacturer Advantest has announced the launch of a next-generation memory handler, designed specifically for high-performance memory components used in artificial intelligence (AI) applications. The product has already attracted interest from several major memory makers and is slated to begin shipments in the second quarter of 2026, meeting customer demands for performance, automation, and cost efficiency.
Friday 12 December 2025
Huawei–SMIC chip hits milestone, still lags TSMC’s 5nm

China is accelerating its semiconductor capabilities through technical gains at Huawei and Semiconductor Manufacturing International Corp.(SMIC) while simultaneously mandating the use of domestic processors across state sectors to circumvent US export controls.

Friday 12 December 2025
Photonics suppliers dominate Taiwan's semiconductor growth rankings on CPO momentum
Silicon photonics is emerging as the strongest growth engine within Taiwan's semiconductor manufacturing sector.
Friday 12 December 2025
Exclusive: Ex-TSMC R&D VP on advanced packaging and Morris Chang's vision
Douglas Yu, former TSMC R&D vice president, highlighted the development of TSMC's 3D Fabric platform, including challenges in early adoption and the impact of founder Morris Chang's leadership.
Friday 12 December 2025
Why replicating Taiwan's science park ecosystem in Arizona is harder than it looks
Taiwan's semiconductor supply chain, which produces over 60% of the world's chips, faces growing pressure to expand overseas amid rising geopolitical tensions. Gudeng Precision Industrial, a key player in Taiwan's semiconductor ecosystem as a precision component manufacturer, offers a critical perspective on these challenges.
Friday 12 December 2025
Rapidus secures Canon, SoftBank backing for 2nm chip ambitions
Canon has reportedly entered final negotiations to invest in a state-backed chipmaker, while SoftBank prepares to increase its financial support, marking a significant step in Japan's bid to revitalize its semiconductor industry. Kyodo News reported that the funding aims to support mass production of 2nm chips at the Chitose plant in Hokkaido by the second half of fiscal 2027 and establish a foundation for future 1.4nm manufacturing.