Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build a state-backed 12-inch memory fabrication plant in Shenzhen, a move aimed at easing DRAM shortages while reducing reliance on overseas suppliers amid continued US export controls.
A shortage of skilled workers could slow construction of new US semiconductor plants, raise costs, and limit chip output for global markets, according to a new report. The findings suggest the manufacturing push backed by Washington's CHIPS Act may depend on sustained funding and closer industry cooperation to avoid bottlenecks.
A push by Infineon for TSMC to expand further in Dresden could reshape Europe's role in advanced chipmaking and ripple through the supply chains of automakers, industrial firms, and device makers worldwide. The remarks also hint at how shifting global demand could influence where next-generation semiconductors get built.
AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.
India is moving from semiconductor planning to execution, using funding, tariff changes, foreign investment approvals, and regional development efforts to build a broader electronics ecosystem beyond assembly.
Tesla and SpaceX are already converging around chips, talent and manufacturing under Terafab, even before any merger speculation turns into reality.
ASE Holdings posted record second-quarter and first-half 2026 revenue, driven by strong demand for advanced semiconductor packaging and testing, conventional backend services and AI-related applications. June revenue reached its second-highest monthly level on record, while quarterly growth exceeded the company's previous guidance.
Samsung Electronics' preliminary earnings have shaken financial markets. Drawing on a report from a US brokerage, DIGITIMES Intelligence analyst Luke Lin examined the actual progress of advanced-node capacity expansion at TSMC, Intel, and Samsung, arguing that market expectations in several areas have run ahead of reality.
TSMC is accelerating advanced packaging capacity expansion as supply remains tight, with market chatter indicating its CoWoS monthly output will reach at least 200,000 wafers in 2027. Equipment makers are still waiting for TSMC to finalize order allocation, a delay that is raising fears of price-cutting competition and delivery delays, as lead times run at least seven to nine months.
