Globalfoundries has announced the next generation of its FDX platform, 22FDX+, designed to meet the ever-growing need for higher performance and ultra-low power requirements of connected devices.

Merck has announced a plan to expand investments in Taiwan, seeking to turn its plant in Kaohsiung, southern Taiwan into a new R&D hub for deposition materials.

Demand for TSMC's advanced process support has been strong. The foundry is set to move the 3nm node to volume production in 2022, with monthly output expected to reach 100,000 wafers in 2023. It remains to be seen whether Huawei - banished...

Taiwan's IC design services providers has seen orders ramp up significantly so far this year from Chinese clients who are eager to develop ASICs, according to industry sources.

Retail channel operators for Huawei's smartphones in China are hiking prices of the vendor's models powered by HiSilicon's Kirin chips that are expected to become obsolete in the wake of the US sanctions against the Chinese tech giant, according to industry sources.

TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process output will climb further to 100,000 units in 2023.

TSMC is fast advancing its manufacturing processes, and it has already disclosed a plan to build a 2nm fab in Hsinchu, northern Taiwan. And if demand is strong, it may have to expand a central Taiwan fab to house more 2nm capacity, according...

Taiwan's semiconductor industries generated NT$2.7 trillion (US$91 billion) in output in 2019, and the value in 2020 is expected to exceed NT$3.0 trillion, said premier Su Tseng-chang in his opening speech at SEMICON Taiwan 2020 on September 23.

The emerging artificial intelligence (AI) and 5G technologies are set to generate unprecedented opportunities and productivity, which will be driving the memory market growth over the next 10 years, according to Micron Technology EVP of global operations Manish Bhatia.

ASE Technology has already seen its chip-first FOCoS (fan-out chip-on-substrate) production yield reach 95-96%, and plans to introduce its chip-last FOCoS packaging technology with volume production scheduled for 2021, according to industry sources.

TSMC has been stepping up the development of its advanced packaging business, with plans to open in 2021-2022 two new fabs dedicated to advanced packaging incorporating its newly unveiled 3D Fabric wafer level system integration technology platform, according to industry sources.

TSMC may expand its factory site in Taichung, central Taiwan for additional 2nm process capacity, according to company chairman Mark Liu.

Taiwan recorded manufacturing production index (2016 as base year) of 121.49 for August 2020, the highest-ever monthly level with increases of 4.27% sequentially and 5.29% on year, according to the Ministry of Economic Affairs (MOEA).

The intensifying US-China tensions are driving Beijing to accelerate its push for semiconductor self-sufficiency. China's 14th 5-year plan running 2021-2025 will focus its IC industry development on third-generation semiconductors such...

PCB equipment supplier Symtek Automation Asia (SAA) expects higher sales in second-half 2020 than in first-half 2020, with even brighter market prospect for 2021.

A fingerprint identification chip for large-area in-display sensing applications co-developed by Taiwan-based Egis Technology, eMemory Technology and Innolux is likely to secure validation in fourth-quarter 2020, paving way to enter the supply chain of Korean's handset vendors, according to sources...

Despite the prevailing pandemic-induced economic uncertainty, the global semiconductor market is poised for growth in 2021, according to SEMI.

China will be stepping up the development of its homegrown third-generation semiconductor materials and quantum computers in the next 5-10 years seeking to fully wean itself off US influence in the next-generation segments, according to industry sources.

SEMICON Taiwan 2020 has kicked off in Taipei and will run through Friday, highlighting 15 theme pavilions and innovation zones as well as 19 international forums on-site and online.

GaAs device and foundry company Transcom has disclosed plans to expand its factory site at the Southern Taiwan Science Park (STSP) to satisfy robust demand for military applications.

Building on bullish growth in first-quarter 2020 in weak market conditions, the world's top-10 semiconductor suppliers managed to continue their revenue growth at a rate of 2.4% in the second quarter of 2020, according to Omdia.

Supply of 8-inch foundry capacity has been tight, with delivery lead time extending to three to four months. Rush orders placed with 8-inch foundries are expected to face an increase of 10% in quotes in fourth-quarter 2020. In turn, IC...

Delivery lead times at Taiwan-based 8-inch foundries have been extended to more than three months, according to sources at fabless chipmakers who are aggressively seeking support from their foundry partners.

Taiwan's leading III-V semiconductor player Win Semiconductors is gearing up its foundry support for Qualcomm after having stopped shipments to Huawei/HiSilicon, as the US chipmaker has massively adopted GaAs-based 5G PA solutions for sales to non-Huawei Chinese handset vendors, according to industry...

Driven by growing demand for application processors and other device sales into 5G smartphones, the pure-play foundry market is on pace to expand by a strong 19% this year after slipping 1% in 2019, according to IC Insights.