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Friday 10 April 2026
MetaOptics bets on Taiwan to scale metalens for AI, next-gen optics
MetaOptics, a Singapore-based metalens developer, is partnering with Taiwan's Pin-Jye Nano Technologies to scale production of next-generation optical components as the technology moves from research into early commercialization and gains new relevance in artificial intelligence and advanced sensing applications.
Friday 10 April 2026
Spingence and Advantech accelerate AI edge deployment plans in South Korea manufacturing
In response to strong demand for data security and on-premises AI deployment within South Korea's manufacturing and semiconductor sectors, Taiwanese AI company Spingence Technology is aggressively expanding into the South Korean market starting this year through its enterprise edge large language model (LLM) platform, Edgestar.
Friday 10 April 2026
Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale manufacturing until mid-2027. Industry sources say that despite nearly complete equipment installation, yields remain below expectations, prompting a postponement of mass production schedules.
Friday 10 April 2026
Column: Corintis uses algorithms to target chip hotspots for precise cooling
As HPC and AI processors push computing performance to unprecedented levels, transistor density has reached a point where thermal behavior is no longer uniform. Instead of gradual, evenly distributed heating, modern chips exhibit sharp, localized hotspots that concentrate extreme thermal loads within small regions.
Friday 10 April 2026
Intel–Google alliance reframes AI infrastructure around CPUs
A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the partnership spans multiple generations of Intel's Xeon processors and includes co-development of custom infrastructure silicon. Financial terms and deployment timelines were not disclosed, but the scope points to a long-term alignment, not a one-off supply deal.
Friday 10 April 2026
MediaTek builds an end-to-end challenge to Qualcomm and Broadcom
In recent years, MediaTek has steadily increased its influence in the global Wi-Fi chip market. Its market share gains have been driven not only by continued growth on the consumer side, but also by a strategic push into the telecom operator segment — where the company is securing fresh business across Europe and North America.
Friday 10 April 2026
CoWoS capacity emerges as AI bottleneck as TSMC’s advanced packaging grows at 80% CAGR
Global advanced packaging capacity is currently in severe shortage. Nvidia has already reserved most of TSMC's leading-edge capacity, particularly its CoWoS packaging technology. According to TSMC's disclosures in an interview with CNBC, demand for such advanced packaging is growing at a compound annual growth rate (CAGR) of 80%.
Friday 10 April 2026
Exclusive: Samsung weighs Vietnam semiconductor testing facility

According to sources familiar with the matter, Samsung is in discussions with the Vietnamese government to establish an IC testing facility, which could become the company's second overseas backend semiconductor site outside South Korea after China. Bloomberg also reported that Samsung is planning a phased investment of about US$4 billion in Vietnam, underscoring its continued expansion in Southeast Asia.

Friday 10 April 2026
Samsung and SK Hynix reportedly secure long-term helium contracts with US firms

Industry sources report that the recent supply concerns over semiconductor-grade helium triggered by the US-Iran conflict have eased, as Samsung Electronics and SK Hynix secured long-term contracts ensuring stable access to the critical gas.

Friday 10 April 2026
Praise Victor Industrial aims to break Fujibo's soft pad dominance with 2Q26 sample certification
As AI and high-performance computing (HPC) demand surges and the semiconductor supply chain undergoes accelerating restructuring, structural changes are emerging in the critical materials market long dominated by major US and Japanese players. Praise Victor Industrial (PVI), specializing in polyurethane (PU) material technology and operating three main product lines — semiconductor polishing pads and consumables, medical and sports products, and eco-friendly adhesives — counts Semiconductor Manufacturing International (SMIC), Nexchip, TSMC, UMC, and Micron among its customers. The company plans to go public in May 2026.
Thursday 9 April 2026
When will CPO actually see mass production?
The market continues to closely watch the deployment of co-packaged optics (CPO) technology in cloud AI, driven by the desire of the silicon photonics (SiPh) ecosystem to see a tangible revenue impact. Cloud AI vendors are also hoping that adopting SiPh will simultaneously improve both cost efficiency and computational performance limits.
Thursday 9 April 2026
Hon Precision sees surging demand for AI infrastructure components
Hon Precision's strong March and first quarter 2026 results signal accelerating global demand for AI infrastructure components, with potential ripple effects on data center procurement and semiconductor test-equipment supply chains worldwide. The company's expanding orders for co-packaged optics, satellite communications, and AI accelerator testing equipment point to elevated capital spending across cloud providers.
Thursday 9 April 2026
Why global chipmakers want to join TSMC's certified supply chain
TSMC's long-established supplier verification and management system is gradually becoming an industry standard, attracting major players worldwide. Samsung Electronics, Intel, Japan's Rapidus, China's Semiconductor Manufacturing International Corporation (SMIC), Hua Hong Semiconductor, Nexchip Semiconductor, and even Tesla CEO Elon Musk are actively engaging with Taiwan's semiconductor supply chain.
Thursday 9 April 2026
GITEX AI Asia opens in Singapore as focus shifts to infrastructure, deployment

Artificial intelligence is entering a more infrastructure-driven phase, as companies at GITEX Asia 2026 highlighted growing constraints around compute, energy and hardware supply during the event's opening in Singapore.

Thursday 9 April 2026
Samsung Foundry launches new 2nm temperature sensor IP to improve chip thermal and area efficiency
Samsung Electronics' foundry division has introduced a new temperature sensor intellectual property (IP) designed to address heat dissipation and area efficiency challenges in advanced 2nm process nodes. Industry experts view this move as Samsung's strategic effort to secure a technological edge over competitors.
Thursday 9 April 2026
Cyient Semiconductors closes US$85M majority stake in Kinetic Technologies, accelerating India-led power IC scale
India-based Cyient Semiconductors' US$85 million majority investment in Kinetic Technologies could expand end-to-end power semiconductor design and production capabilities from India, offering global customers broader access to custom silicon, ASSP products, and enhanced engineering and manufacturing resources, and accelerate deployment of advanced power management solutions across computing and industrial markets worldwide.
Thursday 9 April 2026
China faces 300,000 semiconductor talent gap, warns SMIC founder

China's semiconductor industry faces a widening talent gap even as global competition intensifies, exposing a structural constraint despite its rapid expansion.

Thursday 9 April 2026
ChipX targets AI data center market with photonics, power chips ahead of Malaysia fab
Semiconductor startup ChipX is moving to commercialize silicon photonics and high-voltage power chip technologies for artificial intelligence (AI) data centers, as it advances plans to build a wafer fabrication facility in Malaysia, executives said in an exclusive interview with DIGITIMES Asia during a visit to Taipei.
Thursday 9 April 2026
Helium and tungsten shortages threaten South Korea's semiconductor industry
China's tightening grip on critical mineral exports is sending shockwaves through Asia's semiconductor supply chain. South Korea's chip industry, already on edge over the potential impact of the US-Iran conflict on helium supplies, is now confronting a more immediate threat: a looming shortage of tungsten hexafluoride (WF6). As Beijing's export controls on tungsten shipments to Japan grow increasingly restrictive, Korean chipmakers are finding it harder to secure one of the most essential gases in semiconductor manufacturing.
Thursday 9 April 2026
China accelerates semiconductor equipment localization; Korean firms eyeing Taiwan as orders slip
In response to US semiconductor sanctions and to accelerate AI industry development, China is aggressively promoting localization in semiconductor manufacturing. While South Korean equipment makers initially viewed this as an opportunity to expand in the Chinese market, the gradual implementation of a "50% localization rule" is now beginning to impact orders. Rapid technological progress by Chinese equipment vendors is expected to further squeeze foreign suppliers' presence in China.
Thursday 9 April 2026
Intel–Terafab collaboration highlights potential role for 18A in next-generation AI manufacturing
The collaboration between Intel and Elon Musk under the Terafab initiative is emerging as a potential catalyst for demand for Intel's most advanced manufacturing node, 18A, even as key details of the partnership remain undisclosed.
Thursday 9 April 2026
Geopolitics and AI is redrawing the global chip packaging landscape
The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds in Taiwan and China.
Thursday 9 April 2026
Zensemi strengthens automotive chip team with hiring of industry veterans KC Ang and Marco Maria Monti
China-based automotive semiconductor wafer foundry Zensemi has announced a new management team led by chairman Xiaofei Chen, appointing two internationally experienced executives: KC Ang as general manager and Marco Maria Monti as co-general manager. This leadership restructuring signals Zensemi's ambition to expand its presence in the automotive and specialty process wafer markets by integrating global expertise.
Thursday 9 April 2026
Shanghai GTA Semiconductor teams up with Infineon on SONOS memory for automotive chips

Shanghai state-backed foundry GTA Semiconductor has partnered with Infineon Technologies to introduce SONOS-based embedded non-volatile memory (eNVM) into production, positioning itself more firmly in automotive and industrial chip supply chains.

Wednesday 8 April 2026
DIGITIMES analyst discusses Apple's Siri evolution, AI agent trends, and Samsung's 2nm reality
In his podcast, DIGITIMES senior analyst Luke Lin discussed Apple's upcoming evolution of Siri. The new version is expected to integrate Google's Gemini and allow users to select their preferred chatbot, including ChatGPT, Claude, or xAI's Grok. While some market analysts suggest Apple may use this approach to control distribution and charge listing fees, Lin is skeptical of that interpretation.