TSMC will not let customers sublease or auction off their wafer capacity allocations, chairman C.C. Wei said during the company's October 15 earnings call. With AI chip demand still far outstripping supply, Wei said TSMC intends to leave no food on the table, making as much as it can, as fast as it can.

TSMC Chairman and CEO C.C. Wei announced that, driven by relentless AI momentum and strong demand for advanced process technologies, the company has raised its full-year 2026 US dollar revenue growth guidance to approximately 44%. AI and leading-edge nodes continue to serve as the core growth pillars for the foundry's operations.

The European Union (EU) is negotiating with China to lift sanctions on Sindlhauser Materials GmbH, a small German business that is part of ASML's supply chain, according to people familiar with the matter. In exchange, the EU would remove trade restrictions on a Chinese company previously accused of assisting Russia's war against Ukraine.

TSMC chairman and CEO C.C. Wei said on October 15 that the chipmaker sees no ceiling on its profitability as demand for AI accelerators continues to outpace supply. Wei also said AI-related growth could exceed the company's long-term forecast and outlined plans to adopt high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography in 2030.

Six Taiwanese server and networking contract manufacturers booked combined revenue of NT$2.18 trillion (US$67.3 billion) in September 2026, up 55.9% year-over-year and 4.9% month-over-month, as demand for AI servers stayed strong. Nine-month revenue of NT$15.5 trillion already exceeds the group's full-year 2025 total of NT$14.3 trillion.

India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra, adding SIM and eSIM module production and specialized testing to its outsourced semiconductor assembly and test (OSAT) operations. The facility opened on October 12, 2026, according to Dalal Street Investment Journal.

TSMC has confirmed that it is in discussions with Elon Musk's Terafab initiative over potential semiconductor manufacturing cooperation, marking the first public acknowledgment of talks between the two sides.

Chinese semiconductor equipment maker AMEC plans to develop 102 new equipment models over the next three to five years, backed by nearly CNY13 billion (≈ US$1.94 billion) in research and development investment. The expansion will extend its portfolio beyond plasma etching into thin-film deposition, advanced packaging, inspection and other semiconductor manufacturing processes.

On October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, with third-quarter earnings rising 68.7% year-over-year to NT$763.06 billion (approx. US$23.6 billion), exceeding market expectations on sustained demand for advanced semiconductors used in artificial intelligence (AI).

On October 13, Huawei unveiled the detailed architecture of its Kirin 9050 Pro chip for the first time at its Lianqiu Lake research center in Shanghai, outlining advances in LogicFolding and hybrid bonding technologies. Xu Songyu, head of wireless terminal chip product management at Huawei's semiconductor business, said the company now sees a sustainable development path for Kirin processors over the next decade.

Delta Electronics showcased its on-site solid oxide fuel cell (SOFC) power generation solution at Energy Taiwan 2026, alongside its first physical solid-state transformer (SST) product.

Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor packaging deformation before manufacturing. The investment comes as increasingly complex AI chips create new challenges in managing thermal stress, warpage, and manufacturing yields.

Intel used the Open Compute Project (OCP) Global Summit in San Jose to argue that AI is moving away from giant models in centralized data centers.

GlobalFoundries (GF) has reached a multiyear manufacturing agreement with TSMC to expand silicon interposer capacity at its Malta fab in New York, supplying TSMC's Chip-on-Wafer-on-Substrate (CoWoS) advanced-packaging ecosystem. The agreement is expected to be worth US$2 billion over an initial five-year term.

An explosion and fire at Intel's wafer fab in Kiryat Gat, southern Israel, on October 14, 2026, seriously injured three employees, one of whom later died of his injuries. Authorities deployed eight firefighting and rescue teams, including a hazardous-materials unit, to investigate the cause and assess the risk of a chemical leak involving nitrogen trifluoride (NF3).

Speaking to more than 2,000 Tesla owners and investors at the X Takeover event held at Tesla's Gigafactory in Austin, Texas, on October 11, Elon Musk made a candid admission: "To be clear, I don't know how to make chips." He immediately followed it with a declaration: "We'll figure it out."

Onsemi has said its latest EliteSiC hybrid power module is now being used in Sungrow's PowerTitan 3.0 energy storage platform, a move aimed at improving efficiency, power density, and reliability in utility-scale battery systems. For global power markets, the deal highlights how small gains in conversion efficiency are becoming more important as AI, electrification, and renewable energy drive electricity demand higher.

Taiwan-Asia Semiconductor Corporation (TASC) is benefiting from seasonal demand for sensing chips and new wearable launches by major US and European brands. AI server expansion has also lifted orders for passive and protection components, while its indium phosphide (InP) optical communication chips have entered customer validation. TASC remains cautiously optimistic about 2027.

Bill Frauenhofer, executive director of semiconductor investment and innovation at the US Department of Commerce, joined Entegris CEO David Reeder for a fireside chat at SEMICON West 2026, outlining the latest developments in the US-Taiwan US$500 billion investment agreement and calling on corporate executives and boards to prioritize American semiconductor manufacturing capacity.

Vietnamese technology group FPT is lining up a second Japanese distribution channel for its in-house power chips, a move that would carry Vietnamese-designed semiconductors beyond Japan and into Southeast Asian and Indian markets through a Toyota Group trading network.

ASML, the sole supplier of extreme ultraviolet (EUV) lithography tools, has shifted from taking orders to allocating them. On its third-quarter 2026 earnings call on October 14, the Dutch company said customers want to place orders as far out as 2029 and 2030, but that it will not accept them until it has weighed total demand against its own capacity. It also confirmed, for the first time, that customers have agreed to pay more for its most critical machines.

AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts, denser interconnects, and more advanced memory architectures are expanding demand across logic, DRAM, and high-bandwidth memory (HBM) manufacturing.

Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the coming years. The forecast underscores how hybrid bonding, metrology, and services are becoming central to competition in semiconductor equipment.

ASML has signaled that a new customer whose name may begin with "T" is among the chipmakers seeking lithography tools for 2029 and 2030.