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Thursday 9 April 2026
When will CPO actually see mass production?
The market continues to closely watch the deployment of co-packaged optics (CPO) technology in cloud AI, driven by the desire of the silicon photonics (SiPh) ecosystem to see a tangible revenue impact. Cloud AI vendors are also hoping that adopting SiPh will simultaneously improve both cost efficiency and computational performance limits.
Thursday 9 April 2026
Hon Precision sees surging demand for AI infrastructure components
Hon Precision's strong March and first quarter 2026 results signal accelerating global demand for AI infrastructure components, with potential ripple effects on data center procurement and semiconductor test-equipment supply chains worldwide. The company's expanding orders for co-packaged optics, satellite communications, and AI accelerator testing equipment point to elevated capital spending across cloud providers.
Thursday 9 April 2026
Why global chipmakers want to join TSMC's certified supply chain
TSMC's long-established supplier verification and management system is gradually becoming an industry standard, attracting major players worldwide. Samsung Electronics, Intel, Japan's Rapidus, China's Semiconductor Manufacturing International Corporation (SMIC), Hua Hong Semiconductor, Nexchip Semiconductor, and even Tesla CEO Elon Musk are actively engaging with Taiwan's semiconductor supply chain.
Thursday 9 April 2026
GITEX AI Asia opens in Singapore as focus shifts to infrastructure, deployment

Artificial intelligence is entering a more infrastructure-driven phase, as companies at GITEX Asia 2026 highlighted growing constraints around compute, energy and hardware supply during the event's opening in Singapore.

Thursday 9 April 2026
Samsung Foundry launches new 2nm temperature sensor IP to improve chip thermal and area efficiency
Samsung Electronics' foundry division has introduced a new temperature sensor intellectual property (IP) designed to address heat dissipation and area efficiency challenges in advanced 2nm process nodes. Industry experts view this move as Samsung's strategic effort to secure a technological edge over competitors.
Thursday 9 April 2026
Cyient Semiconductors closes US$85M majority stake in Kinetic Technologies, accelerating India-led power IC scale
India-based Cyient Semiconductors' US$85 million majority investment in Kinetic Technologies could expand end-to-end power semiconductor design and production capabilities from India, offering global customers broader access to custom silicon, ASSP products, and enhanced engineering and manufacturing resources, and accelerate deployment of advanced power management solutions across computing and industrial markets worldwide.
Thursday 9 April 2026
China faces 300,000 semiconductor talent gap, warns SMIC founder

China's semiconductor industry faces a widening talent gap even as global competition intensifies, exposing a structural constraint despite its rapid expansion.

Thursday 9 April 2026
ChipX targets AI data center market with photonics, power chips ahead of Malaysia fab
Semiconductor startup ChipX is moving to commercialize silicon photonics and high-voltage power chip technologies for artificial intelligence (AI) data centers, as it advances plans to build a wafer fabrication facility in Malaysia, executives said in an exclusive interview with DIGITIMES Asia during a visit to Taipei.
Thursday 9 April 2026
Helium and tungsten shortages threaten South Korea's semiconductor industry
China's tightening grip on critical mineral exports is sending shockwaves through Asia's semiconductor supply chain. South Korea's chip industry, already on edge over the potential impact of the US-Iran conflict on helium supplies, is now confronting a more immediate threat: a looming shortage of tungsten hexafluoride (WF6). As Beijing's export controls on tungsten shipments to Japan grow increasingly restrictive, Korean chipmakers are finding it harder to secure one of the most essential gases in semiconductor manufacturing.
Thursday 9 April 2026
China accelerates semiconductor equipment localization; Korean firms eyeing Taiwan as orders slip
In response to US semiconductor sanctions and to accelerate AI industry development, China is aggressively promoting localization in semiconductor manufacturing. While South Korean equipment makers initially viewed this as an opportunity to expand in the Chinese market, the gradual implementation of a "50% localization rule" is now beginning to impact orders. Rapid technological progress by Chinese equipment vendors is expected to further squeeze foreign suppliers' presence in China.
Thursday 9 April 2026
Intel–Terafab collaboration highlights potential role for 18A in next-generation AI manufacturing
The collaboration between Intel and Elon Musk under the Terafab initiative is emerging as a potential catalyst for demand for Intel's most advanced manufacturing node, 18A, even as key details of the partnership remain undisclosed.
Thursday 9 April 2026
Geopolitics and AI is redrawing the global chip packaging landscape
The AI computing boom is reshaping where semiconductors get packaged. Geopolitical pressure and supply chain diversification are pushing capacity well beyond its traditional strongholds in Taiwan and China.
Thursday 9 April 2026
Zensemi strengthens automotive chip team with hiring of industry veterans KC Ang and Marco Maria Monti
China-based automotive semiconductor wafer foundry Zensemi has announced a new management team led by chairman Xiaofei Chen, appointing two internationally experienced executives: KC Ang as general manager and Marco Maria Monti as co-general manager. This leadership restructuring signals Zensemi's ambition to expand its presence in the automotive and specialty process wafer markets by integrating global expertise.
Thursday 9 April 2026
Shanghai GTA Semiconductor teams up with Infineon on SONOS memory for automotive chips

Shanghai state-backed foundry GTA Semiconductor has partnered with Infineon Technologies to introduce SONOS-based embedded non-volatile memory (eNVM) into production, positioning itself more firmly in automotive and industrial chip supply chains.

Wednesday 8 April 2026
DIGITIMES analyst discusses Apple's Siri evolution, AI agent trends, and Samsung's 2nm reality
In his podcast, DIGITIMES senior analyst Luke Lin discussed Apple's upcoming evolution of Siri. The new version is expected to integrate Google's Gemini and allow users to select their preferred chatbot, including ChatGPT, Claude, or xAI's Grok. While some market analysts suggest Apple may use this approach to control distribution and charge listing fees, Lin is skeptical of that interpretation.
Wednesday 8 April 2026
US-China tech clash over chips intensifies ahead of summit, with global supply-chain implications
As US and Chinese leaders prepared for a mid-May summit, proposed US export controls on semiconductor equipment under the MATCH Act and China's sharp state-media rebuttal signaled heightened tech tensions with far-reaching global supply-chain implications. Analysts have characterized the moves as pre-summit leverage that could reshape chip manufacturing and trade flows.
Wednesday 8 April 2026
Taiwan warns of Beijing's covert push to poach AI and chip talent

According to the latest report submitted by Taiwan's National Security Bureau to the Legislative Yuan, China is increasingly targeting Taiwan in an effort to circumvent international technological restrictions. Beijing has set its sights on Taiwan's high-tech sectors—particularly artificial intelligence (AI), semiconductors, and precision machinery—seeking to lure companies to establish operations or maintain a presence in China under the framework of its 15th Five-Year Plan.

Wednesday 8 April 2026
Commentary: US MATCH Act tightens chip tool controls as China builds local supply chain
At SEMICON China 2026, Applied Materials and ASML kept a low profile under tightening US export controls, while domestic Chinese suppliers dominated visibility and floor presence.
Wednesday 8 April 2026
Rising gallium costs force price increases across GaAs chip supply chain

Prices for gallium arsenide (GaA) substrates — a key material used in power amplifiers for wireless communications — are rising, driven by surging costs for gallium, a critical upstream metal. After months of sustained increases in raw material prices, industry executives say a reversal appears unlikely.

Wednesday 8 April 2026
Analysis: ASML earnings preview; SK Hynix and TeraFab already facing EUV capacity difficulties
Compared to short-term geopolitical turbulence, the AI megatrend represents a once-in-a-generation business opportunity. In the past, TSMC often took the lead during earnings season in releasing industry outlooks. This time, ASML will hold its earnings call for the first quarter of 2026 a day earlier on April 15, and is expected to outline how memory manufacturers and new large-scale logic foundries will reshape the semiconductor manufacturing landscape.
Wednesday 8 April 2026
Broadcom, Google, and Anthropic alliance faces MediaTek competition
Broadcom recently announced two major partnership developments. The first is with Google on its Tensor Processing Unit (TPU) application-specific integrated circuits (ASICs), with the collaboration set to extend through 2031. This means that Broadcom will continue to generate related revenue from multiple future generations of Google's TPU products.
Wednesday 8 April 2026
Intel and Musk's Terafab revive IDM collaboration as chipmaker pushes turnaround
Intel's industrial ecosystem is converging on a vertically integrated chip model, as Intel joins the Terafab project led by SpaceX, xAI, and Tesla—marking both a revival of the IDM approach and a potential turning point in Intel's turnaround strategy.
Wednesday 8 April 2026
China export controls spark global InP supply concerns for AI high-speed transmission
Indium phosphide (InP), a critical material for long-distance optical communication, has become essential for AI-driven high-speed data transmission. However, China's export restrictions have triggered a shortage of InP substrates, creating a bottleneck in manufacturers' capacity expansion worldwide. The supply chain acknowledges that due to China's export curbs and the technical challenges of producing InP substrates, major international players remain cautious about increasing investments. The timeline for resolving this shortage remains uncertain.
Tuesday 7 April 2026
Quobly moves quantum chips into volume production

French quantum chip startup Quobly has continued to report progress while expanding its partnership network. The company has set up a new presence in Canada and gained recognition at the American Physical Society meeting, where it was identified as a potential key player in the emerging quantum computing era.

Tuesday 7 April 2026
Intel challenges TSMC CoWoS as Amazon, Google reportedly explore alternatives

AI-driven demand is pushing advanced chip packaging to its limits, exposing constraints in TSMC's CoWoS capacity and forcing hyperscalers to seek alternatives, leaving Intel as the only credible challenger with its EMIB platform.