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Sunday 2 November 2025
Samsung's Exynos 2600 chips challenge Apple and Qualcomm in early benchmarks
Samsung Electronics' next-generation application processor, the Exynos 2600, appears poised to reclaim the spotlight in the high-end smartphone chip market, with early benchmark tests suggesting it outperforms Apple's A19 Pro and Qualcomm's Snapdragon 8 Elite Gen 5 in multi-core performance.
Friday 31 October 2025
Nvidia's Jensen Huang commits quarter-million AI chips to push South Korea's AI frontier
Nvidia CEO Jensen Huang capped his week in Seoul with a sweeping series of agreements that could redefine South Korea's role in the global AI economy.
Friday 31 October 2025
Massive US investment highlights Texas Instruments' push for manufacturing resilience
Texas Instruments (TI) unveiled a US$60 billion investment plan in June 2025 to expand its semiconductor manufacturing within the US, aiming to increase wafer capacity fivefold with the construction of seven new fabs across Texas and Utah. The move represents a strategic bet on domestic production despite a declining market share in analog chips.
Friday 31 October 2025
Elan Microelectronics advances AI strategy with new smart campus, expanding product lines
Elan Microelectronics has marked the progress of its new AI smart campus headquarters in Zhubei with a topping-off ceremony. The facility, slated for completion in 2026 and official operation in 2027, underscores Elan's commitment to integrating artificial intelligence into its product offerings and expanding into new AI applications.
Friday 31 October 2025
ASE's advanced packaging and testing revenue to rise by US$1 billion in 2026
Leading semiconductor packaging and testing company ASE expects that fourth quarter revenue in NTD will grow 1-2% quarter-over-quarter, while semiconductor assembly and test materials (ATM) revenue is expected to rise 3-5% sequentially. Full-year 2025 ATM revenue in USD is projected to increase more than 20%, with advanced packaging revenue reaching US$1.6 billion as planned, and full-year 2026 revenue anticipated to rise by an additional $1 billion.
Friday 31 October 2025
Nvidia reportedly considers up to US$1 billion investment in AI startup Poolside
Nvidia is reportedly preparing to invest up to US$1 billion in AI startup Poolside, potentially increasing the company's valuation to as high as US$12 billion. Poolside is currently in the midst of a US$2 billion funding round, with more than half of that amount already secured, according to Bloomberg sources familiar with the matter.
Friday 31 October 2025
STM cuts 2025 capex on sluggish demand recovery for automotive and industrial chips
STMicroelectronics (STM) has projected fourth-quarter 2025 revenue below market expectations and trimmed its capital expenditure plan for the year, signaling a weaker-than-anticipated recovery in automotive and industrial chip demand.
Friday 31 October 2025
Skyworks–Qorvo merger creates RF chip powerhouse, pressuring Asian rivals
US RF chipmaker Skyworks Solutions plans to acquire its domestic rival Qorvo in a cash-and-stock deal worth US$22 billion, forming one of the largest mergers in the RF semiconductor sector.
Friday 31 October 2025
ASE posts 11-quarter profit high on advanced packaging, stable FX in 3Q25
ASE, a leader in semiconductor assembly and testing, reported stronger-than-expected overall operations in the third quarter of 2025, driven by growth in advanced packaging fueled by AI applications and a stabilized New Taiwan dollar (NT$) against the US dollar. The company's quarterly profit reached an 11-quarter high.
Friday 31 October 2025
MCU maker Holtek rebounds strongly, riding security and health momentum into 2026
Taiwan's microcontroller unit (MCU) designer Holtek Semiconductor posted consolidated revenue of NT$754 million (US$24.53 million) for the third quarter of 2025, up 10% from a year earlier, bringing January through September 2025 revenue to NT$2.375 billion, a 31% annual increase. The company maintained a solid gross margin of around 38% and aims to reach 40% in the near term.
Friday 31 October 2025
Renesas reports significant profit decline and warns of potential inventory risks with Nexperia dispute
Japanese semiconductor manufacturer Renesas Electronics has disclosed a challenging beginning to 2025, revealing a decline in revenue and a sharp drop in profitability for the first nine months of the year. The company expressed concerns that the ongoing Nexperia dispute may cause customers to stockpile excess semiconductor inventories, potentially disrupting market stability in early 2026.
Thursday 30 October 2025
Taiwan approves funding for local IC design houses to advance AI and chip innovation
As Taiwan seeks to strengthen its position in the global semiconductor race, the government is shifting its focus toward homegrown innovation. Taiwan's Ministry of Economic Affairs (MOEA) has approved NT$3 billion (US$97.69 million) in funding for five semiconductor research and development projects involving six domestic companies, with the government providing NT$840 million in subsidies. The initiative, targeting an estimated industrial output value of NT$98.1 billion, represents a strategic pivot toward supporting local IC design houses rather than foreign chipmakers, particularly in cutting-edge areas like artificial intelligence and high-performance computing.
Thursday 30 October 2025
STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era
IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge is no longer invention itself, but turning invention into a manufacturable, scalable reality.
Thursday 30 October 2025
Pichai outlines Alphabet’s next act: scaling AI from cloud to cars
Alphabet CEO Sundar Pichai underscored the company's accelerating progress in artificial intelligence infrastructure, product leadership, and autonomous mobility during its third quarter 2025 earnings call. He noted that Alphabet's deep integration of AI across cloud, consumer, and mobility segments is positioning the company for sustained long-term growth despite rising investment costs.
Thursday 30 October 2025
Egis Technology unveils AI vision, robotics, and 3nm computing platforms at 2025 Tech Day
Taiwanese semiconductor group Egis Technology held its annual "2025 Egis Tech Day" on October 28, 2025, unveiling a suite of cutting-edge innovations under the theme of "fully activated AI."
Thursday 30 October 2025
Pegatron eyes 1Q26 production launch for Texas plant with Nvidia GB300 servers
Pegatron has revealed progress on its US manufacturing expansion, announcing that its Texas factory is set to begin mass production in March 2026. The facility will produce Nvidia's latest GB300 or B300 AI servers, complementing Pegatron's existing Mexico plant to flexibly support North American market demand.
Wednesday 29 October 2025
Skyworks–Qorvo tie-up signals new phase of US semiconductor consolidation
Skyworks Solutions and Qorvo have agreed to merge in a cash-and-stock transaction valued at about US$22 billion, forming a US-based leader in high-performance radio frequency (RF), analog, and mixed-signal semiconductors. The announcement coincided with Skyworks' release of preliminary fiscal 2025 results.
Wednesday 29 October 2025
South Korean tycoons meet Nvidia CEO as part of APEC corporate diplomacy
Leading South Korean conglomerate heads are set to engage in intensive "corporate diplomacy" during the 2025 Asia-Pacific Economic Cooperation (APEC) summit, meeting with global leaders and entrepreneurs to expand international cooperation and investment opportunities.
Wednesday 29 October 2025
WPG launches smart warehousing to strengthen semiconductor supply chain services
In response to the surge in AI- and HPC-driven market demand, WPG Holdings' board of directors has approved an adjustment to its investment structure to further advance its semiconductor supply chain strategy. WPG will implement a professional division of labor within the group and enhance the operational efficiency and market share of its Logistics as a Service (LaaS) business.
Wednesday 29 October 2025
Unified packaging standards seen as key to meeting AI and automotive demands
Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence (AI), 5G/6G communications, and automotive electronics. However, they face challenges, including supply chain vulnerabilities, talent shortages, and a lack of unified packaging standards. Devan Iyer, CSO for Advanced Electronic Packaging at the Global Electronics Association, outlined these issues and opportunities in an exclusive interview with DIGITIMES.
Wednesday 29 October 2025
A-SSCC to take place in South Korea, with 6 papers from Taiwan accepted
The IEEE Asian Solid-State Circuits Conference (A-SSCC), a major annual event in the semiconductor field, recently announced its paper selection results, with six papers from Taiwan accepted.
Wednesday 29 October 2025
Commentary: With new AI chips, Qualcomm joins race to challenge Nvidia in the cloud

Qualcomm on Tuesday unveiled its latest AI accelerator cards, the AI200 and AI250, along with corresponding rack-level system designs, signaling a major expansion of the company's ambitions in cloud-based AI computing. The two products are slated for commercial release in 2026 and 2027, respectively, and Qualcomm pledged to launch new AI accelerator models every year going forward.

Wednesday 29 October 2025
Intel's 18A and advanced packaging boost Taiwanese IP design firms
Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A and 2.5D/3D advanced packaging. Taiwanese design service providers like Faraday have confirmed securing multiple new projects, signaling optimistic operations for 2025 and strong prospects through 2026 even outside the TSMC ecosystem.
Wednesday 29 October 2025
Jensen Huang hails AI as 'America's next Apollo moment,' unveils US-built Blackwell supercomputers

Nvidia CEO Jensen Huang declared that the US is entering "America's next Apollo moment," framing the rise of artificial intelligence (AI) as both a technological revolution and a national renaissance.

Wednesday 29 October 2025
Nvidia stakes US$1 billion in Nokia to build AI-native 6G networks

In a landmark announcement marking what leaders are calling the beginning of the AI-native wireless era, Nvidia and Nokia have established a strategic partnership to accelerate the development and deployment of next-generation AI-native mobile networks and AI networking infrastructure.