Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on smaller process nodes. Its next-generation Kirin chip, scheduled for 2027, has entered testing, with initial results meeting expectations.

Nvidia's share of AI chips in China's data center market has fallen by 34% in the first half of this year, according to a new report. The drop follows months of US restrictions on advanced chip sales to the country, Chinese authorities' push to rely less on Nvidia imports, and domestic players like Huawei moving to fill in this supply gap.

Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that die size, packaging, power delivery, and cooling are becoming major constraints as workloads evolve, making faster coordination essential for future system performance.

At Plug and Play Taiwan's Batch 4 Selection Day, 21 startups made the case that Taiwan's next wave of innovation is being built by chip-industry veterans who are tackling problems faced by the world's biggest tech companies.

The AI accelerator market is set to reach US$1.4 trillion by 2030, up 150% from Bloomberg Intelligence's January 2026 estimate of US$560 billion, as higher prices—not just shipment growth—drive the market. Annual revenue is expected to surpass US$1 trillion in 2028, growing at a compound annual growth rate (CAGR) of 38% from 2026 to 2030.

Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in Shanghai, strengthening cooperation on domestic manufacturing technologies. The event also showcased advances in chipmaking equipment, AI accelerators, and electronic design automation (EDA).

Memory IC design house AP Memory Technology has successfully priced its global depositary receipt (GDR) offering, raising a total of US$415.5 million. The GDRs were priced at US$56.15 per unit, representing approximately NT$897.61 per common share based on an exchange rate of NT$31.972 per US dollar. Scheduled to list on the Luxembourg Stock Exchange on October 15, the proceeds will be used to bolster working capital and satisfy foreign-currency raw material procurement needs.

SEMI announced at a media event during SEMICON West 2026 that the exhibition will move to Phoenix, Arizona, in 2027 and shift to a spring schedule. SEMI Americas President Joe Stockunas confirmed at a pre-show press conference that the organization has signed a three-year agreement with Phoenix to host SEMICON West.

Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering development to large-scale cluster deployment. The Taiwanese electronics manufacturer presented rack-scale AI systems, liquid-cooling technologies, and integrated deployment capabilities as demand grows for infrastructure that can support increasingly complex AI workloads.

China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D packaging for greater power efficiency, optical interconnects for faster data transmission, and open software ecosystems for easier adoption—will determine whether Chinese GPUs can advance from standalone accelerators to large-scale AI computing clusters.

Foxconn Technology Group showcased rack-scale artificial intelligence infrastructure at the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, combining computing platforms, high-speed interconnects, power delivery, and liquid cooling. The portfolio included Ingrasys Technology's Nvidia Vera Rubin NVL72 platform and connectivity, power, and thermal-management systems from Foxconn Interconnect Technology (FIT) as Foxconn expanded its offering from components and Compute Trays to complete AI racks.

Indian semiconductor engineering services firm Tessolve has raised US$75 million from US-based Vector Line Capital and says it is in advanced discussions to close multiple acquisitions over the next couple of quarters, as the Hero Electronix company pushes deeper into designing AI and high-performance computing chips.

Shenzhen-based Blue Core Computing (Shenzhen) Technology has raised nearly CNY2 billion (≈ US$298.7 million) in Series B financing to accelerate production of its RISC-V server processors with integrated AI capabilities. The funding follows the deployment of its LX500 chip in Lenovo servers, advancing China's efforts to develop alternatives to x86 and Arm architectures.

The Selangor state government has committed MYR50 million (US$12.24 million) to the National Strategic Investment Fund, joining Khazanah Nasional Bhd and the Penang government in a MYR150 million vehicle to accelerate the growth of Malaysian semiconductor and advanced technology companies, Bernama reported on October 10, 2026.

Chinese CMOS image sensor (CIS) maker SmartSens completed a CNY3.2 billion (approx. US$478 million) capital increase in September 2026 to expand into automotive electronics and AI vision. The investment targets high-performance imaging, intelligent driving and on-device AI computing, extending its sensing technology into image processing and edge applications as demand for environmental perception grows in vehicles and robots.

Nvidia may be preparing to stop making its flagship GeForce RTX 5090 graphics card and reserve the GB202 chip inside it for professional RTX PRO products, according to unconfirmed claims by two hardware leakers. Nvidia has not confirmed the plan or announced an end-of-production date, VideoCardz reported. If accurate, the move would be consistent with gaming card capacity being squeezed by demand for artificial intelligence.

The AI buildout is still lifting Taiwan's server supply chain faster than almost any other industry, yet September's filings show the lift concentrating into fewer hands. The 49 listed Taiwanese companies tracked across the AI server chain reported combined September revenue of NT$2.95 trillion (US$92.35 billion), up 55.0% from a year earlier and 3.8% from August. Strip out Hon Hai Precision Industry, and the same group's September revenue fell 6.8% from August. For the first nine months, the group has booked NT$21.39 trillion, up 53.9% year-on-year.

Microsoft's in-house Azure Maia chips will become the main platform for its own AI services, including Microsoft 365 Copilot, GitHub Copilot and Microsoft Foundry. However, the company will keep using GPUs from Nvidia and AMD, Andrew Wall, general manager of the Azure Maia program, told DIGITIMES.

Microsoft will scale its in-house Azure Maia AI accelerators to multi-gigawatt deployments starting in 2027, making Maia the primary AI inference system for its products and services. The company also unveiled Maia 300, the third generation of the chip family, which it says will start production deployments next year.

Touch IC leader Elan Microelectronics recently announced its September 2026 consolidated revenue of NT$602 million (approx. US$18.9 million), down 18.74% month-over-month and 46.9% year-over-year. Third-quarter revenue slid 30.7% quarter-over-quarter to NT$2.221 billion (US$69.6 million), down 33.0% year-over-year, marking a sharp decline during what is traditionally a peak season.

The Financial Times recently reported that Nvidia is in early-stage talks to acquire or significantly deepen its investment in the US$25 billion open-weight AI startup Reflection AI. To dodge lengthy antitrust regulatory reviews, Nvidia is considering an "acqui-hire" framework to bring on key staff and license technology while expanding its strategic position in open-weight models.

As the global smartphone system-on-chip (SoC) market contracts, competition in the high-end application processor (AP) segment is intensifying. MediaTek is accelerating its push into the flagship market, putting greater pressure on Samsung Electronics, which is promoting 2-nanometer Exynos chips.

This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces manufacturing, packaging, printed circuit board (PCB) yield, partnership, and governance questions, while Intel remains involved and TSMC's role may be limited. Samsung reportedly advances HBM4E high-bandwidth memory validation and glass interposer testing. Vicor expands patent litigation over AI server power systems. Taiwan restricts China-made fiberglass sleeves, and China's new five-year plan prioritizes advanced PCBs, materials, equipment, and domestic investment.