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Thursday 8 October 2026
Intel stays in Musk's Terafab as TSMC talks point to multi-foundry strategy
Elon Musk has moved to quell uncertainty over Intel's position in the Terafab chip project, stressing that his companies will build and operate the planned semiconductor complex themselves while limiting any potential TSMC involvement to subleasing part of the site.
Thursday 8 October 2026
AI agents fuel new CPU demand, lifting AMD
Before generative AI rose and Nvidia GPUs came to dominate the market, the central processing unit (CPU) was the main compute engine for servers. Now, as the personal AI agent boom gathers pace, CPUs are drawing renewed attention for their role in AI — a trend that is giving Advanced Micro Devices (AMD) powerful growth momentum.
Thursday 8 October 2026
Nvidia's RTX Spark hits order books, taking on Apple's Macs
Nvidia's RTX Spark superchip for Windows PCs moved from stage demos to order books on October 7, as pre-orders opened for Windows laptops built to rival Apple's unified-memory Macs at running large AI models locally. Reuters said cracking the Windows PC market could help Nvidia go after one of the last major markets dominated by Intel and AMD.
Thursday 8 October 2026
Samsung Electronics posts record quarterly profit in preliminary results
Samsung Electronics has become the first South Korean company to clear KRW100 trillion in operating profit in a single quarter, a milestone that shows how heavily the company now leans on a memory market where, by analysts' reckoning, suppliers hold pricing power. The open questions are whether high-bandwidth memory (HBM) contracts can extend that run into 2027, and how long the company's consumer-device arm can absorb the rising component costs that the same boom creates.
Thursday 8 October 2026
Lisa Su takes AMD's Korea ties beyond memory to AI
AMD is broadening its Korean partnerships from memory procurement to AI infrastructure and research, as chief executive Lisa Su seeks the supply and technology cooperation needed for the company's planned 2027 expansion in chip shipments.
Thursday 8 October 2026
Broadcom reportedly in early talks to finance OpenAI's custom chip purchases
Broadcom is increasingly arranging the money its customers need to buy its chips. Fresh off launching a US$60 billion debt package to fund Anthropic's AI build-out, the company has held early discussions to arrange financing that would help OpenAI buy the custom AI chip the two are developing together, Bloomberg reported, citing people familiar with the matter.
Thursday 8 October 2026
Microloops sees 2027 growth as ASIC shipments near GPU crossover
Microloops, a thermal module maker, reported September 2026 consolidated revenue of NT$421 million (approx. US$13.2 million), up 25.12% year-over-year but down 17.88% month-over-month, as component shortages slowed customer pull-ins from cloud service provider orders. The company said underlying demand remained intact and was only delayed, while new products from major cloud clients continued to make a meaningful contribution to sales.
Thursday 8 October 2026
Acer Synergy Tech expands OT push, builds IT-OT integration
Acer subsidiary Acer Synergy Tech reported consolidated revenue of NT$265 million (approx. US$8.3 million) in September 2026, up 158% year-on-year and a monthly record. Third-quarter consolidated self-reported revenue reached NT$550 million, also a quarterly high, as rising semiconductor demand boosted orders for information technology (IT) and operational technology (OT) solutions.
Wednesday 7 October 2026
Commentary: Qualcomm patent deal puts spotlight on Huawei's broader IP push
Huawei and Qualcomm announced on Oct. 5 that they had signed a multi-year patent licensing agreement covering technologies including 5G, computing, AI and networking.
Wednesday 7 October 2026
AMD expands Korea push after Taiwan supply talks
AMD CEO Lisa Su moved from supply-chain talks in Taiwan to South Korea this week, broadening the chipmaker's Asia push from efforts to secure more CPU, GPU and advanced-wafer capacity to building an open computing ecosystem around its processors, Korean AI accelerators and software.
Wednesday 7 October 2026
Chip price hikes loom as Taiwan IC designers brace to pass on costs through 2027
Taiwanese integrated circuit (IC) design firms report that passing on costs to customers will likely continue through 2027 as upstream foundry and outsourced semiconductor assembly and test (OSAT) price hikes take shape.
Wednesday 7 October 2026
Low-cost terahertz SoC takes shape as Taiwan advances next-generation communications
As the global communications industry moves toward the 6G era around 2030, front-end modules supporting frequency ranges such as D-band at 130-150GHz and W-band at 77-95GHz have become major research priorities across academia and industry.
Wednesday 7 October 2026
Semicon 2.0 widens focus beyond fabs: Dassault Systèmes pitches virtual twins to India's chipmakers
Dassault Systèmes is pitching its virtual twin software as the link between India's chip design base and the factories and packaging plants now being built under the country's semiconductor mission. The French industrial software company is offering tools that simulate production before anything is built, as the government's Semicon 2.0 program widens support beyond fabrication to design, research, and talent.
Wednesday 7 October 2026
Rapidus adds Malaysian chip designers to its semiconductor network
Japan's Rapidus is widening its semiconductor push with help from four Malaysian IC design firms, a move that could strengthen chip-development support for customers worldwide. The partnership underlines how Malaysia is emerging as a key design hub, linking Japanese ambitions with global supply-chain and AI-chip demand.
Wednesday 7 October 2026
Marvell raises 2028 revenue outlook to US$20 billion as AI connectivity expands
Marvell Technology is betting that the next phase of AI infrastructure growth will require substantially more networking and optical connectivity, raising its fiscal 2028 revenue outlook to approximately US$20 billion and setting a fiscal 2031 target of US$70 billion to US$90 billion. The company's strategy centers on extending existing hyperscaler relationships across switches, optics, and custom chips surrounding AI processors.
Tuesday 6 October 2026
Cerebras' stock slide stops after Sam Altman calls it 'close partner'
Cerebras' stock rebounded by 9% after OpenAI CEO Sam Altman gave reassurance that the two companies are close partners days after a report cast doubt on their relationship, causing the chipmaker's stock to drop 20% last week. The episode raises concerns over its current concentration on a few large customers.
Tuesday 6 October 2026
Taiwan bets on SiPh, CPO to tackle AI data center power bottlenecks
Taiwan's National Science and Technology Council (NSTC) has launched two research programs targeting silicon photonics (SiPh) and next-generation AI data center power systems, seeking to address energy and performance bottlenecks as high-speed computing shifts increasingly from copper to optical interconnects.
Tuesday 6 October 2026
Apple, Qualcomm renew patent deal, iPhone modem shift deepens
Qualcomm announced on September 24 that it has renewed its global patent licensing agreement with Apple, with the new contract set to take effect on April 1, 2027. The terms and value of the deal were not disclosed, but Apple's long-running move toward in-house modem chips continues to draw close attention.
Tuesday 6 October 2026
Skyworks closes Qorvo deal, forming US RF and analog powerhouse
Skyworks Solutions (Nasdaq: SWKS) has completed its combination with Qorvo, creating a US-based supplier of high-performance radio frequency (RF), power management, and analog and mixed-signal semiconductors. The company expects annual cost synergies of US$500 million or more, and says the deal will add to non-GAAP earnings per share right away.
Tuesday 6 October 2026
Qualcomm takes Arm to trial again, with billions in royalties at stake
Qualcomm and Arm opened a five-day trial in US federal court in Delaware on October 5, with Qualcomm seeking to stop paying Arm royalties for up to five years, a remedy potentially worth billions of dollars. The dispute comes as Qualcomm pushes deeper into data centers, raising the stakes of a licensing relationship largely formed around the smartphone market.
Tuesday 6 October 2026
Qualcomm says Huawei patent deal not tied to LogicFolding, rejects net-payer claims
Correction, Oct. 6, 2026: An earlier version of this story, citing Bloomberg, reported that Qualcomm had agreed to license patents related to Huawei's LogicFolding technology. Qualcomm said on Oct. 6 that assertions linking the agreement to LogicFolding are not accurate. The story has been revised throughout.
Tuesday 6 October 2026
MIPS deepens RISC-V ties with China despite US-China tech tensions
Despite intense technology competition between the US and China, cooperation between the two sides on the open-standard RISC-V architecture continues to deepen, with US intellectual property provider MIPS expanding its work with Chinese industry.
Tuesday 6 October 2026
Samsung ramps Exynos 2700 wafer production as second-gen 2nm rollout advances
Samsung Electronics has reportedly begun front-end wafer mass production of its next-generation Exynos 2700 mobile application processor, with production volume planned at more than 10% above that of the Exynos 2600 as the company prepares to expand use of its in-house chips across the Galaxy S27 lineup.
Monday 5 October 2026
Kyushu's chip expo expands as Japan adds a chip design focus
Japan's Kyushu Semiconductor Industry Exhibition, known as K-Semi, grew 36% at this year's edition in Fukuoka, held from September 30 to October 1, 2026, as chip makers expanded their presence in Kyushu. The event also added a semiconductor design zone for the first time and was held alongside the debut Kyushu Next-Generation Energy Exhibition, or K-Ene.
Monday 5 October 2026
Taiwan teams accelerate 2D semiconductor transfer with published research in Nature
Researchers in Taiwan are intensifying efforts to turn 2D semiconductor materials from basic science into practical applications, with a series of studies published in Nature. The latest work, published in the October 1 issue of the leading scientific journal, follows another Nature paper published on July 1, 2026, underscoring the push in Taiwan's academia to speed up research in next-generation semiconductors.