As the global surge in artificial intelligence continues to drive up memory chip prices, pressure is mounting across the electronics supply chain—and display panel makers are increasingly feeling the strain.
Beyond the closely watched rivalry between Samsung Electronics and Huawei in foldable smartphones—and the shifting balance of market share—another question drawing market attention is whether Apple will launch its first foldable iPhone, tentatively dubbed the iPhone Fold, on schedule in 2026.
Xiaomi's second-generation in-house mobile processor, the Xring O2, will skip TSMC's 2nm process and instead use the company's 3nm N3P node, underscoring a trade-off between performance, cost, and supply availability. The choice also suggests the chip may not power Xiaomi's most premium flagship smartphones.
