Qisda Chairman Peter Chen said infrastructure is the foundation that must first be built as AI compute demand surges. He said Qisda will not be absent from the fast-growing race, as the company steps up work on AI servers, data centers, 1.6T switches, and silicon photonics (SiPh).

Foxconn said its decade-long partnership with Sharp has entered a new growth phase, as the Taiwanese electronics group expands into AI servers, semiconductors, robotics, and next-generation communications. The comments, made at Foxconn's second quarter 2026 investor conference on August 12, came as the two companies marked 10 years since Foxconn completed its investment in Sharp.

Samsung Electronics is set to increase its TV LCD panel purchases in 2026, even as global shipments of TV LCDs are forecast to decline. The buying shift will favor BOE Technology Group and reduce Samsung's reliance on TCL China Star Optoelectronics Technology (TCL CSOT), according to ZDNet Korea, citing market research firm Omdia.

Samsung Electronics is expected to double its purchases of TV LCD panels from BOE in 2026 while cutting orders from CSOT, as Samsung and LG Electronics rebalance their supplier mixes in an LCD market increasingly dominated by Chinese panel makers.

Ennostar Holdings is targeting a return to full-year profitability after stronger seasonal demand, asset-disposal gains, and a sharp rise in memory prices boosted second-quarter 2026 earnings and unexpectedly revived demand for RGB direct-view LCD TVs. The company said high memory costs are prompting some TV brands to favor RGB backlight solutions over OLED models because they offer lower system costs while delivering improved picture quality.

LCD TV panel prices fell across the board in July and have extended their decline in August as high utilization at makers' high-generation lines has kept the supply and demand situation from improving, even as brands stepped up procurement for the traditional third-quarter stocking season. Industry sources said the sector is pursuing a strategy of "trading volume for price," with Black Friday and Single's Day demand failing to stop the slide.

AI-driven demand for advanced packaging is giving old-generation panel fabs and equipment new value. As Taiwan's panel makers accelerate the phaseout of LCD capacity at the 5.5 generation and below, they are splitting into two tracks: selling factories to foundries and outsourced semiconductor assembly and test (OSAT) providers, or keeping lines in-house to develop fan-out panel-level packaging (FOPLP), through-glass via (TGV), redistribution layer (RDL), and glass core technologies.