With DRAM prices having slid as low as some manufacturer's costs, less-competitive firms are exploring various options to preserve cash and improve their financial structures. In the meantime, the growing supply-demand imbalance in the PC DRAM market has discouraged packaging and testing firms from paying attention to the segment, with some looking to completely phase out their DRAM backend production.
Elpida Memory's bankruptcy filing reflects the fact that companies must diversify to cope with trends in the evolution of customer behavior and usage. The DRAM memory industry currently...
DRAM contract prices for the second half of November, due to sluggish demand from PC OEM makers, dropped by nearly 8% sequentially, according to industry sources in Taiwan.
Taiwan's ProMOS Technologies, which has been looking for funding and strategic partners, reportedly will negotiate with Globalfoundries for the sale of its 12-inch wafer plant, according...
Kingston Technology reportedly will give a hand to its upstream chip providers Elpida Memory and Toshiba, both of which are struggling with excessive inventory. The dedicated memory...
Elpida Memory has announced that Taiwan-based Walton Advanced Engineering, which provides packaging and testing services mainly for DRAM products, has agreed to make a JPY3.75 billion...
DRAM chipmakers Powerchip Technology and ProMOS Technologies are reportedly considering selling fabs in order to preserve cash and strengthen their financial structures. Bidders for...
Nanya Technology has announced that four affiliates of parent company Formosa Plastic Group will subscribe to its new shares through a private placement, according to a company filing...
Cash-strapped Powerchip Technology reportedly is exploring various options, including selling one of its 12-inch plants, in order to continue gaining support from its creditor banks,...
Packaging and testing house Powertech Technology (PTI) plans to lower the proportion of standard DRAM products in company revenues to less than 70% in the first quarter of 2012, and...
Packaging and testing house ChipMOS Technologies plans to gradually phase out its DRAM packaging and testing business, and concentrate on backend services for LCD driver ICs and flash...
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