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Wednesday 30 September 2009
A peek at the semiconductor industry from the materials side: Q&A with Wouter Taen, BASF director of business management, Asia
Headquartered in Germany, BASF is the world's largest chemical company, operating all over the world and covering a vast number of different industries, including the semiconductor,...
Wednesday 30 September 2009
Failure as opportunity to learn: Q&A with Corning CEO Wendell P Weeks
Many companies went bankrupt in the financial storm, and the remaining companies also learned the lesson the hard way. In the aftermath of the financial woes, many enterprises are...
Friday 25 September 2009
Taiwan renewable energy feed-in tariffs not final: Q&A with Huey-ching Yeh, director general of the Bureau of Energy
At a September 24 public hearing held by the Bureau of Energy (BE) under Taiwan's Ministry of Economic Affairs (MOEA) to discuss its recently announced tentative feed-in tariff rates...
Thursday 10 September 2009
Telecom equipment demand to pick up in 4Q09: Q&A with Alcatel-Lucent North Asia president Alain Biston
Demand for telecom equipment in the North Asia region is expected to stage a major upturn in the fourth quarter of 2009 as carriers in the region are beginning to deploy their LTE...
Tuesday 8 September 2009
Bosch-Akustica acquisition a win-win strategy: Q&A with Akustica founder Michael E Elchik
MEMS microphone supplier Akustica was officially acquired by automotive MEMS IDM Robert Bosch North America in August 2009. Michael E Elchik, Akustica's founder and VP of sales, recently...
Friday 31 July 2009
Acer aims to be top-five smartphone vendor: Q&A with Aymar de Lencquesaing, president of SHBG at Acer
Acer aims to ship 2-2.5 million own-brand smartphones in 2010 and the company expects its annual shipments to increase to 20 million units by 2012-2014, making the company a top-five...
Tuesday 30 June 2009
Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu
Gold bumping service provider, Chipbond Technology, which also offers COF/COG (chip-on-film/chip-on glass) turnkey services, has identified outsourcing of LCD driver-IC bumping and...
Thursday 11 June 2009
ACM Research finding strength in megasonic cleaning tool: Q&A with CEO David Wang
ACM Research has developed a 300mm single-wafer megasonic cleaning tool, which has been adopted by several leading foundry houses, according to company founder and CEO David Wang...
Thursday 4 June 2009
Killer app for the networked TV: Broadcom talks up OTT video
While the traditional WLAN market has been sluggish due to a slump in the economy, chip specialist Broadcom recently noted that the company has seen a rebound in its traditional WLAN...
Thursday 4 June 2009
A glimpse into Taiwan IPC industry: Q&A with Lanner Electronics
During Computex Taipei 2009, Taiwan IPC maker Lanner Electronics (Nangang Exhibition Hall, L808) launched what it claimed was the world's first Intel Atom-based fanless embedded computer...
Wednesday 3 June 2009
Kingston playing supportive role in Taiwan DRAM rescue: Q&A with company co-founder John Tu
Kingston Technology, the US-based memory module maker who has long been a supportive partner for Taiwan's financially-distressed DRAM makers during difficult times, intends to play...
Tuesday 2 June 2009
Smartbooks vs netbooks: Q&A with Qualcomm senior VP Luis Pineda
While US-based Qualcomm has been a major player driving growth in the wireless handset market over the past 20 years, the company is now looking to expand its market scope into mobile...
Tuesday 2 June 2009
Nvidia's 5-year plan coming to fruition as GPU compute goes mainstream, Q&A with Ujesh Desai, vice president of product marketing
Nvidia built its name around satisfying PC gamers' desire for better graphics, higher resolutions, and higher frame rates, from one GPU generation to the next. But around five years...
Thursday 14 May 2009
CIS market to see more consolidation: Q&A with Aptina marketing VP Sandor Barna
More designers are entering the CMOS image sensor (CIS) market, but Sandor Barna, vice president of marketing for Aptina, told Digitimes in a recent interview that smaller players...
Tuesday 28 April 2009
Applied Materials optimistic about a-Si thin-film PV
Declining polysilicon prices may impact demand for amorphous silicon (a-Si) thin-film photovoltaic (PV) modules, but Applied Materials is confident of the development of thin-film...