US AI startup Anthropic has enforced a new policy prohibiting Chinese-controlled entities from using its Claude series models, prompting ByteDance's Singapore-based IDE platform Trae...

China's Ministry of Commerce (MOFCOM) and the General Administration of Customs announced on November 7 that they will suspend the implementation of several export control measures...

US lawmakers are ramping up scrutiny of China's AI and semiconductor sectors, tightening oversight from corporate ties to capital flows to reinforce Washington's edge in the global...

Novatek Microelectronics, Taiwan's top display driver IC (DDI) supplier, held its earnings call with CEO Steve Wang outlining the company's market outlook. He said the stronger New...

Amid the global trend toward automotive electrification and smartification, the Ministry of Economic Affairs (MOEA) has commissioned the Taiwan External Trade Development Council...

As the edge AI market rapidly heats up, creating growth opportunities for the industrial PC (IPC) sector, AAEON expects demand to enter a phase of explosive growth within the next...

Hua Hong Semiconductor, one of China's top wafer foundries, reported a steep profit drop for the first three quarters of 2025, citing higher costs from new production lines and rising...

Driven by growing demand for AI servers, Catcher Technology has joined the competitive server chassis components arena. Chairman Hung Shui-shu said the server segment is still in...

Memory prices have sharply rebounded in the third quarter of 2025, supported by increases in both volume and unit prices, boosting financial results for leading memory module manufacturers...

Chinese AI chipmaker Cambricon Technologies is facing a massive legal battle. The company's former chief technology officer, Liang Jun, has filed a lawsuit seeking CNY4.3 billion...

The surge in AI computing has led to a significant price increase in DRAM and NAND Flash, with major manufacturers raising prices by up to 30% in late 2025, putting cost pressure...

China's DRAM maker CXMT plans to start mass production of fourth-generation high-bandwidth memory (HBM3) in 2026 using mass reflow molded underfill (MR-MUF) packaging, the same technology...

Touch IC leader Elan Microelectronics held an earnings call on November 6, reporting that third-quarter performance exceeded internal forecasts despite a weaker consumer market than...

The European automotive industry faces unprecedented challenges in 2025, grappling with slow progress in electronic/electrical (E/E) transformation and widespread internal layoffs,...