Taiwan-based GreenTrans Corporation has expanded the application of its automated guided vehicle (AGV) and autonomous mobile robot (AMR) to the semiconductor sector. The company said...
Electrical vehicles (EV) and autonomous vehicles (AV) will be the two largest semiconductor applications in the future. However, there is still no unified specification for EV/AV...
RISC-V Summit China 2023 is currently underway in Beijing, participants include leading Chinese RISC-V players like the Alibaba subsidiary T-Head, StarFive and Beijing ESWIN.
Artificial intelligence (AI) will bring substantial growth to the semiconductor industry, according to Mark Wang, chairman for IC test interface specialist WinWay Technology.
Speculation has emerged that Intel's expanding fab site in Oregon will serve as a foundry for MediaTek using the Intel 18A technology, with production beginning as early as 2025.
In the three major segments of the semiconductor value chain: design, manufacturing, and packaging/testing, China's weakest link is manufacturing. In the packaging and testing field,...
As Huawei boldly proclaimed the comeback of its flagship 5G smartphone in early August, rumors about Huawei commissioning China's largest semiconductor foundry SMIC to break through...
Before the scheduled trip of US Secretary of Commerce Gina Raimondo to China from August 27–30, the US removed 27 Chinese companies and institutions from the "Unverified List"...
VeriSilicon, a major player in China's RISC-V ecosystem and also the country's largest chip design IP vendor, has on August 18 inaugerated its new R&D center in Shanghai. focusing...
As sustainability trends continue to shape business operations, how is the PCB sector, which has long been associated with high pollution, adapting to the changes?
Intel has invested a total of US$8 billion in Malaysia, and is committing an additional US$6 billion for the construction of new semiconductor facilities there, including a 3D advanced...
Japan-based equipment supplier Canon has estimated its sales of semiconductor lithography equipment, mainly KrF and i-line exposure machines, to increase to 195 units in 2023 from...
With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...
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