Global supply chain: Mobile, telecom, computing

Mobile, telecom, computing trends

IN THE NEWS

Monday 19 January 2026

Taiwan carves robotics niche as humanoids proliferate

"Physical AI"—the fusion of artificial intelligence with machines that move, sense, and act in the real world—emerged as a defining theme at CES 2026, where Chinese robotics...

Monday 19 January 2026

Micron sets 1γ as mainstream node for 2026 as HBM and SOCAMM2 ramp

With shipments of application-specific integrated circuits (ASICs) and XPUs expected to rise sharply in 2026, AI accelerators are set to continue relying on fifth-generation high-bandwidth...

Monday 19 January 2026

Server ODMs shrug off US-Taiwan tariff deal, prioritize customer demands

The recent US-Taiwan tariff agreement has minimal effect on servers' original design manufacturers (ODMs), as server products were excluded from both previous reciprocal tariffs and...

Monday 19 January 2026

Europe moves to reinforce its satellite internet ambitions with new OneWeb order

Eutelsat, the satellite operator backed by the French and British governments, announced this week that it has placed an additional order...

Monday 19 January 2026

Quanta rushing to hire and expand as AI server demand holds strong

Server ODM Quanta Computer is aggressively expanding production, with the expectation that capacity will double again by the end of 2026. Quanta's Executive Vice President and Quanta...

Monday 19 January 2026

Global power grids emerge as strategic choke points in AI and industrial competition race

The escalating global energy transition and intensifying industrial rivalry have elevated power infrastructure security to a national defense-level strategic concern, with a focus...

Monday 19 January 2026

Apple leads global smartphone market, Huawei tops China in 2025

Despite supply-chain pressure and memory shortages, the global smartphone market remained resilient in 2025, supported by strong demand for high-end models, foldable devices, and early...

Monday 19 January 2026

Oppo counters rising memory prices with feature upgrades in A6 series

Despite significant jumps in memory costs threatening smartphone affordability, Oppo has chosen to enhance rather than downgrade its latest A6 mid- to low-end models. The company retained...

Monday 19 January 2026

Wistron posts record 2025 revenue despite margin pressure from system assembly

Wistron posted a record-high consolidated revenue of NT$2.19 trillion (approx. US$67.63 billion) for full-year 2025, according to its unaudited financial results announced on January...

Monday 19 January 2026

Taiwan PCB industry gearing up for record investment driven by AI cloud computing

Taiwan's printed circuit board (PCB) industry is entering a new growth cycle fueled by a surge in cloud artificial intelligence (AI) computing orders. Manufacturers are ramping up...

Monday 19 January 2026

Oppo's reintegration of Realme signals push for cost discipline and sharper brand segmentation

Realme, once an independent smartphone brand, will be reintegrated as a sub-brand under Oppo in a strategic move to enhance competitive positioning. This realignment will see Oppo...

Monday 19 January 2026

Persistent shortages of advanced glass fiber cloud the AI chip outlook

Demand for AI chips is expected to remain strong in 2026, keeping the spotlight firmly on persistent shortages of high-end glass fiber...

Monday 19 January 2026

Ardentec utilization rate rises through 2025 on chip testing demand from networking, automotive, and storage sectors

Semiconductor testing company Ardentec reported steady utilization growth through 2025, driven by strong chip-testing orders from the networking, automotive, and storage markets. The...

Sunday 18 January 2026

MGC expands into AI liquid cooling market

Meta Green Cooling (MGC) is making a comprehensive push into the AI liquid cooling sector, leveraging its unique full-spectrum capabilities. MGC chairman James Chen noted that, unlike...

Saturday 17 January 2026

Research Insight: System-level design, energy efficiency, and TCO drive AI hardware competition

AMD introduced its Helios system platform at CES 2026, marking a significant move in cloud AI computing competition from traditional single-chip performance to full rack-scale solutions...

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