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SEMICON Taiwan 2014
Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging technology.
IN THE NEWS
Tuesday 23 September 2014
Orbotech advances into the IC packaging industry together with SPTS in SEMICON Taiwan 2014
Orbotech Ltd. (NASDAQ: ORBK) announced that it has successfully closed the previously-announced acquisition of SPTS Technologies Group Limited ("SPTS"), in a strategic move...
Wednesday 3 September 2014
Demand of 3D ICs may not take off for 3 years, says Amkor Technology
Demand for 3D IC parts may not begin to take off until three years due to concerns of high production costs, according to Mike Liang, president of Amkor Technology Taiwan.
Wednesday 3 September 2014
China to post highest growth in semiconductor manufacturing equipment spending in 2014
While Taiwan will remain globally the largest spender on semiconductor manufacturing equipment in 2014, the rise of the semiconductor industry in China will give the country the highest...
Tuesday 2 September 2014
Semicon Taiwan 2014: Focus on new processing, packaging technologies
Semicon Taiwan 2014 will kick off in Taipei from September 3-5, with this year's theme focusing on advanced wafer processes, next-generation memory technologies, 3D ICs and SiP packaging...