Chinese semiconductor equipment maker SiCarrier has booked over CNY10 billion (US$1.4 billion) in orders and is mobilizing upstream suppliers for large-scale production. With nearly 20,000 employees, the Shenzhen-based firm is emerging as a key force in China's drive to localize chipmaking gear as global export restrictions tighten.
France is preparing its biggest foray yet into Asia's semiconductor heartland. At SEMICON Taipei next week, Paris will field its largest industrial delegation on record, a move that signals an ambition to plant itself firmly in the global supply chain—not through wafer fabs, but through advanced packaging.
As demand for AI servers drives full production capacity, PCB manufacturer Gold Circuit Electronics (GCE) announced on September 5, 2025, that its board of directors approved a NT$1.6 billion (approx. US$52.4 million) investment to acquire an idle factory in Zhongli from optical disc maker CMC Magnetics (CMC). This site will serve as the company's reserve base for future capacity expansion in Taiwan.
The South Korean government is reportedly pushing to reduce tariffs on key imported materials used in semiconductor wafer production to 0% by 2026. Amid the US' announcement of a potential 100% tariff on South Korean semiconductors, Seoul aims to enhance the foundational cost competitiveness of its domestic semiconductor industry.
Micron is sharpening its case in the high-bandwidth memory (HBM) market, where it faces entrenched rivals and rising competition.
Intel CFO David Zinsner told investors at Citigroup's 2025 Global TMT Conference that 2026 will mark a turning point for the company's manufacturing plans, with the fate of its 14A process set to determine its next steps. He emphasized that paying down debt remains Intel's top priority and highlighted the company's long-term dependence on TSMC.
China's new energy vehicle (NEV) sector continues to face intense price competition, with domestic manufacturers pushing vehicle prices to unprecedented lows. This aggressive pricing strategy has severely squeezed profit margins, prompting the industry to seek innovative solutions that can balance cost and performance. One such emerging technology gaining traction is hybrid SiC, which promises to enhance NEV efficiency while controlling manufacturing expenses.
Japan's semiconductor materials suppliers are racing to expand capacity as the AI data center build-out drives unprecedented demand for advanced chips and packaging inputs. Nikkei reports that Asahi Kasei will invest JPY16 billion (US$108 million) to double production of PIMEL, its photosensitive insulating material used in GPUs and other high-end semiconductors, by fiscal 2030.
Broadcom CEO Hock Tan revealed the company has landed a US$10 billion order from a mystery customer, which insiders now identify as OpenAI. The two firms are developing OpenAI's first custom artificial intelligence (AI) processor, scheduled to enter mass production in 2026.
On September 3, 2025, Anhui Anfu Battery Technology announced its portfolio company Xiangdi Xian Computing Technology (XDXCT) had completed tape-out validation of its next-generation "Fuxi" GPU architecture. The chip demonstrated strong graphics rendering and parallel computing performance, with early optimizations confirming it can run the much-anticipated title Black Myth: Wukong.
Broadcom posted record earnings for the third quarter of fiscal 2025, topping Wall Street forecasts on revenue and profit, and disclosed a custom AI chip order exceeding US$10 billion from an undisclosed client. The deal is expected to materially lift its AI outlook in fiscal 2026, alleviating investor concerns over a potential slowdown.
More coverage
