On May 28, 2025, AMD announced the acquisition of Enosemi, a Silicon Valley-based company specializing in photonic integrated circuits. The move is aimed at accelerating AMD's development of co-packaged optics technologies to support next-generation AI systems.
A federal court ruling this week has dealt a significant blow to President Donald Trump's trade agenda, suspending a wide array of tariffs he had imposed through emergency executive powers. The decision invalidates the "reciprocal" tariffs announced on April 2, which had triggered volatility in global markets and raised fears of a renewed trade war.
Nan Ya Printed Circuit Board Corporation (Nanya PCB), a top Taiwanese IC substrate maker, cautioned that second-quarter earnings may miss forecasts, citing the sharp rise of the New Taiwan dollar and policy uncertainty surrounding President Trump's proposed reciprocal tariffs. At the May 27 shareholders meeting, Chairman Chia-chau Wu noted that AI-related substrate demand has kept Taiwan's capacity running at high levels, outperforming China, but rising currency pressures and trade tensions are now dragging on export sales.
Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's semiconductor packaging equipment giant Kulicke & Soffa (K&S) has confirmed its close collaboration with Taiwan's semiconductor foundry leaders in the advanced packaging field for high-end chips.
